Abstract: Various methods and systems for minimum supply voltage level selection in a portable computing device (“PCD”) are disclosed. It is an advantage of the various embodiments that PCD designers may close timing at a certain minimum supply voltage and operating temperature threshold that is higher than the lowest end of the main operating temperature range within which the PCD must function. By closing timing at the higher operating temperature threshold, relatively smaller components requiring relatively lower power consumption may be used in the PCD, thereby providing improved overall power consumption when the PCD is operating at operating temperatures above the threshold. To maintain functionality when operating temperatures fall below the threshold, the minimum supply voltage to the components is increased.

Abstract: Various embodiments of methods and systems for controlling and/or managing thermal energy generation on a portable computing device are disclosed. Data discarded from one or more processing core registers may be monitored and analyzed to deduce individual workloads that have been processed by each of the cores over a unit of time. From the deduced workloads, the power consumed by each of the cores over the unit of time in order to process the workload can be calculated. Subsequently, a time dependent power density map can be created which reflects a historical and near real time power consumption for each core. Advantageously, because power consumption can be correlated to thermal energy generation, the TDPD map can be leveraged to identify thermal aggressors for targeted, fine grained application of thermal mitigation techniques. In some embodiments, workloads may be reallocated from the identified thermal aggressors to the identified underutilized processing components.

Abstract: Various embodiments of methods and systems for controlling and/or managing thermal energy generation on a portable computing device are disclosed. Data discarded from one or more processing core registers may be monitored and analyzed to deduce individual workloads that have been processed by each of the cores over a unit of time. From the deduced workloads, the power consumed by each of the cores over the unit of time in order to process the workload can be calculated. Subsequently, a time dependent power density map can be created which reflects a historical and near real time power consumption for each core. Advantageously, because power consumption can be correlated to thermal energy generation, the TDPD map can be leveraged to identify thermal aggressors for targeted, fine grained application of thermal mitigation techniques. In some embodiments, workloads may be reallocated from the identified thermal aggressors to the identified underutilized processing components.

Abstract: An integrated circuit includes multiple power domains. Supply current switch circuits (SCSCs) are distributed across each power domain. When a signal is present on a control node within a SCSC, the SCSC couples a local supply bus of the power domain to a global supply bus. An enable signal path extends through the SCSCs so that an enable signal can be propagated down a chain of SCSCs from control node to control node, thereby turning the SCSCs on one by one. When the domain is to be powered up, a control circuit asserts an enable signal that propagates down a first chain of SCSCs. After a programmable amount of time, the control circuit asserts a second enable signal that propagates down a second chain. By spreading the turning on of SCSCs over time, large currents that would otherwise be associated with coupling the local and global buses together are avoided.

Abstract: In general, this disclosure is directed to circuitry for implementation of headswitches and footswitches in an ASIC for power management. The disclosed circuitry supports not only effective power management, but also efficient use of ASIC area, reduced complexity, and the use of electronic design automation (EDA) tools. In this manner, the disclosed circuitry can support enhanced performance and simplified ASIC design. In some cases, headswitch or footswitch circuitry may be implemented as a switch pad ring that extends around a hard macro forming part of an ASIC core. In other cases, headswitch or footswitch circuitry can be distributed within an ASIC core by embedding distributed headswitch or footswitch components under metal layer power routing coupled to standard cell rows.

Abstract: An integrated circuit includes multiple power domains. Supply current switch circuits (SCSCs) are distributed across each power domain. When a signal is present on a control node within a SCSC, the SCSC couples a local supply bus of the power domain to a global supply bus. An enable signal path extends through the SCSCs so that an enable signal can be propagated down a chain of SCSCs from control node to control node, thereby turning the SCSCs on one by one. When the domain is to be powered up, a control circuit asserts an enable signal that propagates down a first chain of SCSCs. After a programmable amount of time, the control circuit asserts a second enable signal that propagates down a second chain. By spreading the turning on of SCSCs over time, large currents that would otherwise be associated with coupling the local and global buses together are avoided.

Abstract: In general, this disclosure is directed to circuitry for implementation of headswitches and footswitches in an ASIC for power management. The disclosed circuitry supports not only effective power management, but also efficient use of ASIC area, reduced complexity, and the use of electronic design automation (EDA) tools. In this manner, the disclosed circuitry can support enhanced performance and simplified ASIC design. In some cases, headswitch or footswitch circuitry may be implemented as a switch pad ring that extends around a hard macro forming part of an ASIC core. In other cases, headswitch or footswitch circuitry can be distributed within an ASIC core by embedding distributed headswitch or footswitch components under metal layer power routing coupled to standard cell rows.