Patents by Inventor Souhei Kouda

Souhei Kouda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Metal-based circuit board
    Patent number: 8785787
    Abstract: A metal-based circuit board, which reduces the influence of thermal expansion, is provided having a structure where an insulating layer A having a large coefficient of thermal expansion is sandwiched between insulating layers B having a small coefficient of thermal expansion. Such a structure allows the insulating layers B to contract and expand so as to suppress contraction and expansion of the insulating layer A and thereby reduce the stress in the direction of negating the stress. As a result, while warpage or distortion is suppressed to be minimal, the bonding strength of the upper and the lower layer is maintained, and degree of freedom for circuit design is not impaired, thereby providing a highly reliable circuit structure.
    Type: Grant
    Filed: February 28, 2012
    Date of Patent: July 22, 2014
    Assignee: Koa Kabushiki Kaisha
    Inventors: Souhei Kouda, Toshiharu Takayama
  • METAL-BASED CIRCUIT BOARD
    Publication number: 20120217047
    Abstract: A metal-based circuit board, which reduces the influence of thermal expansion, is provided having a structure where an insulating layer A having a large coefficient of thermal expansion is sandwiched between insulating layers B having a small coefficient of thermal expansion. Such a structure allows the insulating layers B to contract and expand so as to suppress contraction and expansion of the insulating layer A and thereby reduce the stress in the direction of negating the stress. As a result, while warpage or distortion is suppressed to be minimal, the bonding strength of the upper and the lower layer is maintained, and degree of freedom for circuit design is not impaired, thereby providing a highly reliable circuit structure.
    Type: Application
    Filed: February 28, 2012
    Publication date: August 30, 2012
    Inventors: Souhei Kouda, Toshiharu Takayama