Patents by Inventor Soumei Yarita

Soumei Yarita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Platinum electroforming bath
    Patent number: 5549738
    Abstract: The invention relates to platinum electroforming and platinum electroplating capable of preparing a deposited platinum material having high hardness and increased thickness and size. The platinum electroforming or electroplating bath comprises at least one compound selected from the group consisting of chloroplatinic acid, chloroplatinates of alkali metals, hydrogen hexahydroxoplatinate, and hexahydroxoplatinates of alkali metals, 2-100 g/l as platinum and a hydroxylated alkali metal, 20-100 g/l.
    Type: Grant
    Filed: May 4, 1994
    Date of Patent: August 27, 1996
    Assignee: Electroplating Engineers of Japan, Limited
    Inventors: Katsutsugu Kitada, Soumei Yarita
  • Platinum electroforming and platinum electroplating
    Patent number: 5529680
    Abstract: The invention relates to platinum electroforming and platinum electroplating capable of preparing a deposited platinum material having high hardness and increased thickness and size utilizing an electrolyte bath comprising at least one compound selected from the group consisting of chloroplatinic acid, chloroplatinates of alkali metals, hydrogen hexahydroxoplatinate, and hexahydroxoplatinates of alkali metals, 2-100 g/l as platinum; a hydroxylated alkali metal, 20-100 g/l; and a soluble carboxylate.
    Type: Grant
    Filed: January 24, 1995
    Date of Patent: June 25, 1996
    Assignee: Electroplating Engineers of Japan, Limited
    Inventors: Katsutsugu Kitada, Soumei Yarita
  • Platinum alloy electrodeposition bath and process for manufacturing platinum alloy electrodeposited product using the same
    Patent number: 5421991
    Abstract: This invention provides a platinum alloy electrodeposition bath which, by alloying platinum with other metals, enables thick plating and can give platinum alloy layers having superior luster and hardness, and also provides a process for manufacturing a platinum alloy electrodeposited product using the same.The platinum alloy electrodeposition bath according to this invention contains 2 to 100 g/lit. of platinum in the form of Pt(OH).sub.6.sup.2- complex ion and at least one of Sn, Zn and Pd in an amount of 1 mg/lit or more.
    Type: Grant
    Filed: September 24, 1993
    Date of Patent: June 6, 1995
    Assignee: Electroplating Engineers of Japan, Ltd.
    Inventor: Soumei Yarita
  • Platinum electroforming and platinum electroplating
    Patent number: 5310475
    Abstract: The invention relates to platinum electroforming and platinum electroplating capable of preparing a deposited platinum material having high hardness and increased thickness and size. The platinum electroforming or electroplating bath comprises at least one compound selected from the group consisting of chloroplatinic acid, chloroplatinates of alkali metals, hydrogen hexahydroxoplatinate, and hexahydroxoplatinates of alkali metals, 2-100 g/l as platinum and a hydroxylated alkali metal, 20-100 g/l.
    Type: Grant
    Filed: June 21, 1991
    Date of Patent: May 10, 1994
    Assignee: Electroplating Engineers of Japan, Limited
    Inventors: Katsutsugu Kitada, Soumei Yarita