Patents by Inventor Soumendra K. Basu

Soumendra K. Basu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110272238
    Abstract: One exemplary embodiment comprises a load transfer device that includes a composite component having a variable and controllable surface roughness. The component may comprise a base substrate, a compliant layer over the base substrate, and a top layer over the compliant layer. The complaint layer and the top layer may act cooperatively to reversibly generate wrinkles in response to changes in temperature of the composite component.
    Type: Application
    Filed: May 5, 2010
    Publication date: November 10, 2011
    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
    Inventors: Soumendra K. Basu, Yang T. Cheng
  • Patent number: 7811405
    Abstract: The bonding of polymeric panels with thermosetting adhesive compositions may lead to an unsightly image of the adhesive bond line on an external surface of the joined articles. This bond-line read-out is reduced or eliminated using an adhesive material with filler particles characterized by nanometer size clay platelets when the content of the filler particles does not exceed about five percent by volume of the uncured adhesive. Selective placement of the adhesive extending to the edges of the bonding surfaces of the polymeric members also reduces bond-line read-out.
    Type: Grant
    Filed: August 31, 2007
    Date of Patent: October 12, 2010
    Assignee: GM Global Technology Operations, Inc.
    Inventors: Soumendra K. Basu, Jessica A. Schroeder, Hamid G. Kia
  • Publication number: 20100207071
    Abstract: The present disclosure relates to thermoplastic polymer articles, and methods of making and/or selectively controlling surface properties of the same. The article includes a bulk thermoplastic polymer, and a cap layer formed in-situ thereon. A resin formulation used to form the articles includes the bulk polymer in an amount ranging from about 80 wt. % to about 99.5 wt. %, and a polymer additive (which forms the cap layer) in an amount ranging from about 0.5 wt. % to about 20 wt. %. The bulk polymer viscosity ranges from about 5 to about 1000 times higher than the polymer additive viscosity, and the polymer additive is immiscible in the bulk polymer. A predetermined surface property of the polymer additive, which is not inherent in the bulk polymer, is imparted to the cap layer, and thus to the article.
    Type: Application
    Filed: February 13, 2009
    Publication date: August 19, 2010
    Applicant: GM GLOBAL TECHNOLOGY OPERATONS, INC.
    Inventors: Bhaskar Patham, Soumendra K. Basu
  • Publication number: 20090056868
    Abstract: The bonding of polymeric panels with thermosetting adhesive compositions may lead to an unsightly image of the adhesive bond line on an external surface of the joined articles. This bond-line read-out is reduced or eliminated using an adhesive material with filler particles characterized by nanometer size clay platelets when the content of the filler particles does not exceed about five percent by volume of the uncured adhesive. Selective placement of the adhesive extending to the edges of the bonding surfaces of the polymeric members also reduces bond-line read-out.
    Type: Application
    Filed: August 31, 2007
    Publication date: March 5, 2009
    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
    Inventors: Soumendra K. Basu, Jessica A. Schroeder, Hamid G. Kia