Abstract: A method of manufacturing a stacked-type semiconductor device, including the steps of: forming dividing grooves, having a depth corresponding to a finished thickness for a plurality of first chips formed on the face side of a wafer, on the face side of the wafer along planned dividing lines; stacking existing second chips on the first chips; covering the face-side surfaces of the second chips with a protective member; and grinding the back side of the wafer until the dividing grooves are exposed and the first chips are thinned to the finished thickness, to obtain semiconductor devices of a two-layer structure.

Abstract: A method of manufacturing a stacked-type semiconductor device, including the steps of: forming dividing grooves, having a depth corresponding to a finished thickness for a plurality of first chips formed on the face side of a wafer, on the face side of the wafer along planned dividing lines; stacking existing second chips on the first chips; covering the face-side surfaces of the second chips with a protective member; and grinding the back side of the wafer until the dividing grooves are exposed and the first chips are thinned to the finished thickness, to obtain semiconductor devices of a two-layer structure.

Abstract: A cutting apparatus includes a blade mount supporting a first ultrasonic transducer for imparting ultrasonic vibrations to a cutting blade. The blade mount includes an annular flange having a grip surface on an outer circumferential side surface thereof for gripping the cutting blade, a first ultrasonic transducer housing portion for housing the first ultrasonic transducer, and a hollow cylindrical mount boss having a fitting hole fitting over the spindle. The annular flange has a plurality of through holes defined therein between the first ultrasonic transducer housing portion and the mount boss. A blade grip flange has a fitting hole fitted over the mount boss, a grip surface on an outer circumferential side surface thereof for gripping the cutting blade, a second ultrasonic transducer housing portion for housing a second ultrasonic transducer, and a plurality of through holes defined therein between the second ultrasonic transducer housing portion and the fitting hole.

Abstract: A cutting apparatus includes a blade mount supporting a first ultrasonic transducer for imparting ultrasonic vibrations to a cutting blade. The blade mount includes an annular flange having a grip surface on an outer circumferential side surface thereof for gripping the cutting blade, a first ultrasonic transducer housing portion for housing the first ultrasonic transducer, and a hollow cylindrical mount boss having a fitting hole fitting over the spindle. The annular flange has a plurality of through holes defined therein between the first ultrasonic transducer housing portion and the mount boss. A blade grip flange has a fitting hole fitted over the mount boss, a grip surface on an outer circumferential side surface thereof for gripping the cutting blade, a second ultrasonic transducer housing portion for housing a second ultrasonic transducer, and a plurality of through holes defined therein between the second ultrasonic transducer housing portion and the fitting hole.