Patents by Inventor Sridhar Krishnan
Sridhar Krishnan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240121583Abstract: A method for authenticating features reported by a vehicle includes receiving, from a network, a map of an area with confidence weights corresponding to each feature on the map and/or a list of trusted users; upon the vehicle entering the area, checking whether the vehicle is on the list of trusted users; and checking features reported from the vehicle and matching the features to the map of the area.Type: ApplicationFiled: December 12, 2023Publication date: April 11, 2024Inventors: Richard DORRANCE, Ignacio ALVAREZ, Deepak DASALUKUNTE, S M Iftekharul ALAM, Sridhar SHARMA, Kathiravetpillai SIVANESAN, David Israel GONZALEZ AGUIRRE, Ranganath KRISHNAN, Satish JHA
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Publication number: 20230277111Abstract: There is provided a computer-implemented method for identifying abnormal QRS-complexes in an ECG signal comprising: receiving an ECG signal with detected QRS-complexes; calculating and normalizing a plurality of geometric measures of the QRS-complexes; constructing an RGB image with three two-dimensional matrices, each matrix corresponding to one of the calculated plurality of geometric measures, the geometric measures belonging to one QRS-complex have the same matrix index across the three two-dimensional matrices; transforming the RGB image to a plurality of gray-scale images; computing histograms of each of the plurality of gray-scale image; iteratively comparing every histogram peak to its previous one; and marking pixel intensities corresponding to histogram peaks with a difference value of equal or greater than a predefined threshold referred to as a saliency threshold, as salient pixels; using saliency detection for mapping salient pixels indices onto the ECG signal and classifying the salient pixel inType: ApplicationFiled: July 16, 2021Publication date: September 7, 2023Inventors: Sridhar KRISHNAN, Sourav Kumar MUKHOPADHYAY
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Publication number: 20220061701Abstract: There is provided a system, method and device for dynamically compressing an actigraphy signal at a source device.Type: ApplicationFiled: June 28, 2019Publication date: March 3, 2022Inventors: SRIDHAR KRISHNAN, YASHODHAN ATHAVALE
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Patent number: 8329581Abstract: A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate overlying and spaced from a first face of the microelectronic element, whereby an outer region of the substrate extends beyond the outer perimeter of the microelectronic element. The microelectronic package includes a plurality of etched conductive posts exposed at a surface of the substrate and being electrically interconnected with the microelectronic element, whereby at least one of the etched conductive posts is disposed in the outer region of the substrate. The package includes an encapsulating mold material in contact with the microelectronic element and overlying the outer region of the substrate, the encapsulating mold material extending outside of the etched conductive posts for defining an outermost edge of the microelectronic package.Type: GrantFiled: July 14, 2011Date of Patent: December 11, 2012Assignee: Tessera, Inc.Inventors: Belgacem Haba, Masud Beroz, Teck-Gyu Kang, Yoichi Kubota, Sridhar Krishnan, John B. Riley, III, Ilyas Mohammed
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Publication number: 20110269272Abstract: A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate overlying and spaced from a first face of the microelectronic element, whereby an outer region of the substrate extends beyond the outer perimeter of the microelectronic element. The microelectronic package includes a plurality of etched conductive posts exposed at a surface of the substrate and being electrically interconnected with the microelectronic element, whereby at least one of the etched conductive posts is disposed in the outer region of the substrate. The package includes an encapsulating mold material in contact with the microelectronic element and overlying the outer region of the substrate, the encapsulating mold material extending outside of the etched conductive posts for defining an outermost edge of the microelectronic package.Type: ApplicationFiled: July 14, 2011Publication date: November 3, 2011Applicant: TESSERA, INC.Inventors: Belgacem Haba, Masud Beroz, Teck-Gyu Kang, Yoichi Kubota, Sridhar Krishnan, John B. Riley, III, Ilyas Mohammed
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Patent number: 7999397Abstract: A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate overlying and spaced from a first face of the microelectronic element, whereby an outer region of the substrate extends beyond the outer perimeter of the microelectronic element. The microelectronic package includes a plurality of etched conductive posts exposed at a surface of the substrate and being electrically interconnected with the microelectronic element, whereby at least one of the etched conductive posts is disposed in the outer region of the substrate. The package includes an encapsulating mold material in contact with the microelectronic element and overlying the outer region of the substrate, the encapsulating mold material extending outside of the etched conductive posts for defining an outermost edge of the microelectronic package.Type: GrantFiled: May 28, 2010Date of Patent: August 16, 2011Assignee: Tessera, Inc.Inventors: Belgacem Haba, Masud Beroz, Teck-Gyu Kang, Yoichi Kubota, Sridhar Krishnan, John B. Riley, III, Ilyas Mohammed
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Publication number: 20100258956Abstract: A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate overlying and spaced from a first face of the microelectronic element, whereby an outer region of the substrate extends beyond the outer perimeter of the microelectronic element. The microelectronic package includes a plurality of etched conductive posts exposed at a surface of the substrate and being electrically interconnected with the microelectronic element, whereby at least one of the etched conductive posts is disposed in the outer region of the substrate. The package includes an encapsulating mold material in contact with the microelectronic element and overlying the outer region of the substrate, the encapsulating mold material extending outside of the etched conductive posts for defining an outermost edge of the microelectronic package.Type: ApplicationFiled: May 28, 2010Publication date: October 14, 2010Applicant: Tessera, Inc.Inventors: Belgacem Haba, Masud Beroz, Teck-Gyu Kang, Yoichi Kubota, Sridhar Krishnan, John B. Riley, III, Ilyas Mohammed
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Patent number: 7745943Abstract: A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate overlying and spaced from a first face of the microelectronic element, whereby an outer region of the substrate extends beyond the outer perimeter of the microelectronic element. The microelectronic package includes a plurality of etched conductive posts exposed at a surface of the substrate and being electrically interconnected with the microelectronic element, whereby at least one of the etched conductive posts is disposed in the outer region of the substrate. The package includes an encapsulating mold material in contact with the microelectronic element and overlying the outer region of the substrate, the encapsulating mold material extending outside of the etched conductive posts for defining an outermost edge of the microelectronic package.Type: GrantFiled: May 3, 2007Date of Patent: June 29, 2010Assignee: Tessera, Inc.Inventors: Belgacem Haba, Masud Beroz, Teck-Gyu Kang, Yoichi Kubota, Sridhar Krishnan, John B. Riley, III, Ilyas Mohammed
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Patent number: 7489524Abstract: An assembly is provided which includes a first circuit panel having a top surface, a first dielectric element and first conductive traces disposed on the first dielectric element. In addition, a second circuit panel has a bottom surface, a second dielectric element and second conductive traces disposed on the second dielectric element, where at least a portion of the second circuit panel overlies at least a portion of the first circuit panel. The assembly further includes an interconnect circuit panel having a third dielectric element which has a front surface, a rear surface opposite the front surface, a top end extending between the front and rear surfaces, a bottom end extending between the front and rear surfaces, and a plurality of interconnect traces disposed on the dielectric element.Type: GrantFiled: June 2, 2005Date of Patent: February 10, 2009Assignee: Tessera, Inc.Inventors: Ronald Green, Sridhar Krishnan, Stuart E. Wilson, James Gill Shook, Ming Tsai, Andy Stavros
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Patent number: 7453157Abstract: A microelectronic package includes a microelectronic element having faces, contacts and an outer perimeter, and a flexible substrate overlying and spaced from a first face of the microelectronic element, an outer region of the flexible substrate extending beyond the outer perimeter of the microelectronic element. The package includes a plurality of etched conductive posts exposed at a surface of the flexible substrate and being electrically interconnected with the microelectronic element, wherein at least one of the conductive posts is disposed in the outer region of the flexible substrate, and a compliant layer disposed between the first face of the microelectronic element and the flexible substrate, wherein the compliant layer overlies the at least one of the conductive posts that is disposed in the outer region of the flexible substrate.Type: GrantFiled: May 27, 2005Date of Patent: November 18, 2008Assignee: Tessera, Inc.Inventors: Belgacem Haba, Masud Beroz, Teck-Gyu Kang, Yoichi Kubota, Sridhar Krishnan, John B. Riley, III, Ilyas Mohammed
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Publication number: 20070205496Abstract: A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate overlying and spaced from a first face of the microelectronic element, whereby an outer region of the substrate extends beyond the outer perimeter of the microelectronic element. The microelectronic package includes a plurality of etched conductive posts exposed at a surface of the substrate and being electrically interconnected with the microelectronic element, whereby at least one of the etched conductive posts is disposed in the outer region of the substrate. The package includes an encapsulating mold material in contact with the microelectronic element and overlying the outer region of the substrate, the encapsulating mold material extending outside of the etched conductive posts for defining an outermost edge of the microelectronic package.Type: ApplicationFiled: May 3, 2007Publication date: September 6, 2007Applicant: Tessera, Inc.Inventors: Belgacem Haba, Masud Beroz, Teck-Gyu Kang, Yoichi Kubota, Sridhar Krishnan, John Riley, Ilyas Mohammed
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Publication number: 20070020908Abstract: A multilayer structure is provided that includes a semiconductor member having opposing first and second major surfaces, a warpage-compensating layer deposited on the first major surface, and a substrate bonded to the second major surface. The warpage-compensating layer has a stiffness and a coefficient of thermal expansion keyed to the substrate in a manner effective to reduce warpage of the semiconductor member. Also provided is a method for forming a multilayer structure.Type: ApplicationFiled: July 18, 2005Publication date: January 25, 2007Applicant: Tessera, Inc.Inventors: Kenneth Honer, Sridhar Krishnan
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Publication number: 20050285246Abstract: A microelectronic package includes a microelectronic element having faces, contacts and an outer perimeter, and a flexible substrate overlying and spaced from a first face of the microelectronic element, an outer region of the flexible substrate extending beyond the outer perimeter of the microelectronic element. The package includes a plurality of conductive posts exposed at a surface of the flexible substrate and being electrically interconnected with the microelectronic element, wherein at least one of the conductive posts is disposed in the outer region of the flexible substrate, and a compliant layer disposed between the first face of the microelectronic element and the flexible substrate, wherein the compliant layer overlies the at least one of the conductive posts that is disposed in the outer region of the flexible substrate.Type: ApplicationFiled: May 27, 2005Publication date: December 29, 2005Applicant: Tessera, Inc.Inventors: Belgacem Haba, Masud Beroz, Teck-Gyu Kang, Yoichi Kubota, Sridhar Krishnan, John Riley, Ilyas Mohammed
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Publication number: 20050269693Abstract: An assembly is provided which includes a first circuit panel having a top surface, a first dielectric element and first conductive traces disposed on the first dielectric element. In addition, a second circuit panel has a bottom surface, a second dielectric element and second conductive traces disposed on the second dielectric element, where at least a portion of the second circuit panel overlies at least a portion of the first circuit panel. The assembly further includes an interconnect circuit panel having a third dielectric element which has a front surface, a rear surface opposite the front surface, a top end extending between the front and rear surfaces, a bottom end extending between the front and rear surfaces, and a plurality of interconnect traces disposed on the dielectric element.Type: ApplicationFiled: June 2, 2005Publication date: December 8, 2005Applicant: Tessera, Inc.Inventors: Ronald Green, Sridhar Krishnan, Stuart Wilson, James Shook, Ming Tsai, Andy Stavros
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Patent number: 6537233Abstract: Computer-assisted auscultation of knee joints by auditory display of vibroarthrographic signals emitted during active movement of the leg include audification and sonification. In audification, the vibroarthrographic signals are scaled in time and frequency using a time-frequency distribution to facilitate aural analysis. In sonification, the instantaneous mean frequency and envelope of the vibroarthrographic signals are derived and used to synthesize sounds that may facilitate more accurate diagnosis than the original signals by improving their aural quality.Type: GrantFiled: November 6, 2000Date of Patent: March 25, 2003Assignee: University Technologies International Inc.Inventors: Rangaraj M. Rangayyan, Sridhar Krishnan, Douglas B. Bell, Cyril B. Frank