Patents by Inventor Sriram Srinivasan

Sriram Srinivasan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230086691
    Abstract: Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a microelectronic subassembly including a first bridge component in a first layer, the first bridge component having a first surface and an opposing second surface, and a die in a second layer, wherein the second layer is on the first layer, and the die is electrically coupled to the second surface of the first bridge component; a package substrate having a second bridge component embedded therein, wherein the second bridge component is electrically coupled to the first surface of the first bridge component; and a microelectronic component on the second surface of the package substrate and electrically coupled to the second bridge component, wherein the microelectronic component is electrically coupled to the die via the first and second bridge components.
    Type: Application
    Filed: September 23, 2021
    Publication date: March 23, 2023
    Applicant: Intel Corporation
    Inventors: Sriram Srinivasan, Sanka Ganesan, Timothy A. Gosselin
  • Publication number: 20230089093
    Abstract: Embodiments disclosed herein include electronic packages and methods of assembling such electronic packages. In an embodiment, an electronic package comprises a core, where the core comprises glass. In an embodiment, a plug is formed through the core, where the plug comprises a magnetic material. In an embodiment, an inductor is around the plug. In an embodiment, first layers are over the core, wherein where the first layers comprise a dielectric material; and second layers are under the core, where the second layers comprise the dielectric material.
    Type: Application
    Filed: September 23, 2021
    Publication date: March 23, 2023
    Inventors: Srinivas V. PIETAMBARAM, Tarek A. IBRAHIM, Krishna BHARATH, Bharat PENMECHA, Anderw COLLINS, Kaladhar RADHAKRISHNAN, Sriram SRINIVASAN
  • Publication number: 20230060727
    Abstract: A microelectronic assembly is provided comprising a first integrated circuit (IC) die having an electrical load circuit, a second IC die having a portion of a voltage regulator (VR), and a third IC die comprising inductors of the VR. The third IC die is between the first IC die and the second IC die, and the VR receives power at a first voltage and provides power at a second voltage to the electrical load circuit, the second voltage being lower than the first voltage. In various embodiments, the inductors in the third IC die comprise magnetic thin films. The third IC die may be a passive die without any active elements in some embodiments. In some embodiments, the microelectronic assembly further comprises a package substrate having conductive pathways, and the second IC die is between the third IC die and the package substrate.
    Type: Application
    Filed: August 26, 2021
    Publication date: March 2, 2023
    Applicant: Intel Corporation
    Inventors: Kaladhar Radhakrishnan, Krishna Bharath, William J. Lambert, Adel A. Elsherbini, Sriram Srinivasan, Christopher Schaef
  • Publication number: 20230068300
    Abstract: A microelectronic assembly is provided, comprising a first IC die having an electrical load circuit, a second IC die having a portion of a voltage regulator (VR) electrically coupled to the first IC die, a package substrate having inductors of the VR electrically coupled to the first IC die and the second IC die, and a mold compound between the first IC die and the package substrate. The VR receives power at a first voltage from the package substrate and provides power at a second voltage to the electrical load circuit, the second voltage being lower than the first voltage. In various embodiments, the second IC die is in the mold compound. In some embodiments, the mold compound and the second IC die are comprised in a discrete interposer electrically coupled to the first IC die with die-to-die interconnects and to the package substrate with die-to-package substrate interconnects.
    Type: Application
    Filed: August 26, 2021
    Publication date: March 2, 2023
    Applicant: INTEL CORPORATION
    Inventors: Krishna Bharath, William J. Lambert, Christopher Schaef, Alexander Lyakhov, Kaladhar Radhakrishnan, Sriram Srinivasan
  • Patent number: 11558275
    Abstract: Disclosed in some examples are methods, systems, and machine-readable mediums which determine jitter buffer delay by inputting jitter buffer and currently observed network status information to a machine learned model that is trained using a reinforcement learning (RL) method. The model maps these inputs to an action to compress, stretch, or hold the jitter buffer delay, which is used by a recipient computing device to optimize the jitter buffer delay. The model may be trained using a simulator that uses network traces of past real streaming sessions (e.g., communication sessions) of users. By training the model through reinforcement learning, the model learns to make better decisions through reinforcement in the form of reward signals that reflect the performance of each decision.
    Type: Grant
    Filed: May 18, 2020
    Date of Patent: January 17, 2023
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Xiulian Peng, Vinod Prakash, Xiangyu Kong, Sriram Srinivasan, Yan Lu
  • Patent number: 11557541
    Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises, a package substrate, an interposer on the package substrate, a first die cube and a second die cube on the interposer, wherein the interposer includes conductive traces for electrically coupling the first die cube to the second die cube, a die on the package substrate, and an embedded multi-die interconnect bridge (EMIB) in the package substrate, wherein the EMIB electrically couples the interposer to the die.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: January 17, 2023
    Assignee: Intel Corporation
    Inventors: Md Altaf Hossain, Ankireddy Nalamalpu, Dheeraj Subbareddy, Robert Sankman, Ravindranath V. Mahajan, Debendra Mallik, Ram S. Viswanath, Sandeep B. Sane, Sriram Srinivasan, Rajat Agarwal, Aravind Dasu, Scott Weber, Ravi Gutala
  • Publication number: 20230004185
    Abstract: Methods and apparatuses control electrical current supplied to a plurality of processing units in a multi-processor system. A plurality of current usage information corresponding to the processing units are received by a controller to determine a threshold current for each of the processing units. The controller determines a frequency reduction action and an instructions-per-cycle (IPC) reduction action for the each of the processing units based on the threshold current and regulates operations of the processing units based on the determined frequency and IPC reduction actions.
    Type: Application
    Filed: September 8, 2022
    Publication date: January 5, 2023
    Inventors: AMITABH MEHRA, RICHARD MARTIN BORN, SRIRAM SRINIVASAN, SNEHA KOMATIREDDY, MICHAEL L. GOLDEN, XIUTING KALEEN C. MAN, GOKUL SUBRAMANI RAMALINGAM LAKSHMI DEVI, XIAOJIE HE
  • Publication number: 20220393326
    Abstract: According to some aspects of this disclosure a radio frequency signal coupler is provided. The radio frequency coupler includes an input port, an output port, a main transmission line extending between the input port and the output port, a coupled transmission line electromagnetically coupled to the main transmission line, at least one coupled port coupled to the coupled transmission line, and a plurality of termination ports connected to the coupled transmission line, each termination port of the plurality of termination ports being connected to the coupled transmission line at a different location to provide a plurality of coupling factors corresponding to a plurality of signal frequencies.
    Type: Application
    Filed: May 31, 2022
    Publication date: December 8, 2022
    Inventors: Nuttapong Srirattana, Sriram Srinivasan, Zijiang Yang, Ujjwal Kumar
  • Publication number: 20220366920
    Abstract: Innovations in phase quantization during speech encoding and phase reconstruction during speech decoding are described. For example, to encode a set of phase values, a speech encoder omits higher-frequency phase values and/or represents at least some of the phase values as a weighted sum of basis functions. Or, as another example, to decode a set of phase values, a speech decoder reconstructs at least some of the phase values using a weighted sum of basis functions and/or reconstructs lower-frequency phase values then uses at least some of the lower-frequency phase values to synthesize higher-frequency phase values. In many cases, the innovations improve the performance of a speech codec in low bitrate scenarios, even when encoded data is delivered over a network that suffers from insufficient bandwidth or transmission quality problems.
    Type: Application
    Filed: July 27, 2022
    Publication date: November 17, 2022
    Applicant: Microsoft Technology Licensing, LLC
    Inventors: Soren Skak JENSEN, Sriram SRINIVASAN, Koen Bernard VOS
  • Publication number: 20220359971
    Abstract: Examples of the disclosure include a coupler comprising an input port, an output port, a coupled port, an isolated port, a main line coupled between the input port and the output port, a coupled line coupled between the coupled port and isolated port, and one or more elements switchably coupled between the coupled port and the isolated port, the one or more elements including at least one of an inductive, capacitive, or resistive element.
    Type: Application
    Filed: May 4, 2022
    Publication date: November 10, 2022
    Inventors: Sriram Srinivasan, Ujjwal Kumar, Nuttapong Srirattana, Zijiang Yang
  • Publication number: 20220360492
    Abstract: Computing systems, for example, multi-tenant systems create data centers in a cloud platform using a cloud platform infrastructure language that is cloud platform independent. The system receives a cloud platform independent declarative specification describing a new datacenter to be created and a customization specification for customizing the data center. The system compiles the declarative specification along with the customization specification to generate a metadata representation of the data center. The metadata representation is used to generate a data center on a target cloud platform. Different customization specifications can be provided to generate different customized datacenters based on the same declarative specification. For example, the different customized data centers may implement different policies, for example, network policies, security policies, and so on.
    Type: Application
    Filed: March 4, 2022
    Publication date: November 10, 2022
    Inventors: Sriram Srinivasan, Joshua Paul Meier, Varun Gupta, Mayakrishnan Chakkarapani, Neil Natarajan
  • Publication number: 20220359970
    Abstract: Examples of the disclosure include a coupler comprising an input port, an output port, a coupled port, an isolated port, a main line coupled between the input port and the output port, a coupled line coupled between the coupled port and the isolated port, and at least one capacitive element switchably coupled between at least one of the input port or the main line and at least one of the coupled port or the coupled line.
    Type: Application
    Filed: May 4, 2022
    Publication date: November 10, 2022
    Inventors: Sriram Srinivasan, Ujjwal Kumar, Nuttapong Srirattana, Zijiang Yang
  • Patent number: 11460879
    Abstract: Methods and apparatuses control electrical current supplied to a plurality of processing units in a multi-processor system. A plurality of current usage information corresponding to the processing units are received by a controller to determine a threshold current for each of the processing units. The controller determines a frequency reduction action and an instructions-per-cycle (IPC) reduction action for the each of the processing units based on the threshold current and regulates operations of the processing units based on the determined frequency and IPC reduction actions.
    Type: Grant
    Filed: June 25, 2021
    Date of Patent: October 4, 2022
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventors: Amitabh Mehra, Richard Martin Born, Sriram Srinivasan, Sneha Komatireddy, Michael L. Golden, Xiuting Kaleen C. Man, Gokul Subramani Ramalingam Lakshmi Devi, Xiaojie He
  • Publication number: 20220308901
    Abstract: In an approach for visualizing metrics towards optimizing application performance, a processor identifies an application, running in a user interface, on a cloud platform. A processor calculates information metrics of the application. A processor presents the information metrics on the user interface with the application.
    Type: Application
    Filed: March 29, 2021
    Publication date: September 29, 2022
    Inventors: Ankit Jha, Sundari Voruganti, Lalit Somavarapha, Vikram Sri Nitesh Tantravahi, Sriram Srinivasan
  • Patent number: 11443751
    Abstract: Innovations in phase quantization during speech encoding and phase reconstruction during speech decoding are described. For example, to encode a set of phase values, a speech encoder omits higher-frequency phase values and/or represents at least some of the phase values as a weighted sum of basis functions. Or, as another example, to decode a set of phase values, a speech decoder reconstructs at least some of the phase values using a weighted sum of basis functions and/or reconstructs lower-frequency phase values then uses at least some of the lower-frequency phase values to synthesize higher-frequency phase values. In many cases, the innovations improve the performance of a speech codec in low bitrate scenarios, even when encoded data is delivered over a network that suffers from insufficient bandwidth or transmission quality problems.
    Type: Grant
    Filed: February 12, 2021
    Date of Patent: September 13, 2022
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Soren Skak Jensen, Sriram Srinivasan, Koen Bernard Vos
  • Publication number: 20220271409
    Abstract: A radio frequency signal coupler includes an input port, an output port, a main transmission line coupled between the input port and the output port, and a coupled transmission line electromagnetically coupled to the main transmission line. The coupled transmission line includes a first transmission line, a second transmission line, and a switch configured to couple the first and second transmission lines during a first mode of operation and to decouple the first and second transmission lines during a second mode of operation. The radio frequency couple can be used in a front end module of a communications device, such as a mobile phone.
    Type: Application
    Filed: February 22, 2022
    Publication date: August 25, 2022
    Inventors: Zijiang Yang, Sriram Srinivasan, Nuttapong Srirattana
  • Patent number: 11408316
    Abstract: An aftertreatment system includes: a selective catalytic reduction (SCR) system configured to decompose constituents of exhaust gas; an exhaust conduit configured to deliver the exhaust gas to the SCR system; a hydrocarbon insertion assembly; a valve operably coupled to the exhaust conduit, the valve configured to be selectively opened so as to allow a first gas to enter the exhaust conduit and mix with the exhaust gas; and a controller configured to: determine a SCR system temperature, in response to the SCR system temperature being less than a target temperature, instruct the hydrocarbon insertion assembly to insert hydrocarbons into the exhaust gas, and in response to the SCR system temperature being greater than the target temperature, instruct the valve to open so as to allow the first gas to enter the exhaust conduit, a first gas temperature of the first gas being lower than the SCR system temperature.
    Type: Grant
    Filed: December 18, 2017
    Date of Patent: August 9, 2022
    Assignee: Cummins Emission Solutions Inc.
    Inventor: Sriram Srinivasan
  • Patent number: 11363050
    Abstract: A system for incompliance detection in data transmission extracts data features from a data file. The system compares each data feature with a corresponding historical data feature associated with a historical transmission of the data file. The system determines whether the data feature deviates from the corresponding historical data feature. In response to determining that the data feature deviates from the corresponding historical data feature, the system determines that the data feature does not comply with the corresponding historical data feature. The system determines whether more than a threshold percentage of the data features deviate from corresponding historical data features. If it is determined that more than the threshold percentage of the data features deviate from corresponding historical data features, the system sends a notification to update the data file, such that the updated data file corresponds to the data file in historical transmissions.
    Type: Grant
    Filed: March 25, 2021
    Date of Patent: June 14, 2022
    Assignee: Bank of America Corporation
    Inventor: Sriram Srinivasan
  • Patent number: 11363049
    Abstract: A system for anomaly detection in data transmission extracts data features from a data file. The system compares each data feature with a corresponding historical data feature associated with a historical transmission of the data file. The system determines whether the data feature deviates from the corresponding historical data feature. In response to determining that the data feature deviates from the corresponding historical data feature, the system determines that the data feature is associated with an anomaly. The system determines whether more than a threshold percentage of the data features are associated with anomalies. If it is determined that more than the threshold percentage of the data features are associated with anomalies, the system determines whether a transmission channel through which the data file is transmitted has failed. In response to determining that the transmission channel has failed, the system transmits the data file using another transmission channel.
    Type: Grant
    Filed: March 25, 2021
    Date of Patent: June 14, 2022
    Assignee: Bank of America Corporation
    Inventor: Sriram Srinivasan
  • Patent number: 11363048
    Abstract: A system for security threat detection in data transmission extracts data features from a data file. The system compares each data feature with a corresponding historical data feature associated with a historical transmission of the data file. The system determines whether the data feature deviates from the corresponding historical data feature. In response to determining that the data feature deviates from the corresponding historical data feature, the system determines that the data feature is associated with a security threat that makes the data file vulnerable to unauthorized access. The system determines whether more than a threshold percentage of the data features are associated with security threats. If it is determined that more than the threshold percentage of the data features are associated with security threats, the system terminates the transmission of the data file.
    Type: Grant
    Filed: March 25, 2021
    Date of Patent: June 14, 2022
    Assignee: Bank of America Corporation
    Inventor: Sriram Srinivasan