Abstract: The invention includes lead forming and trimming apparatus particularly for transistors with a flat side on the body. Such transistors have a plurality of wire leads extending from the bottom of the body. These wire leads are in an alignment and are fed to a guideway between two strips with these strips at a slope sufficient to cause gravitational advancement of the components on their bottom. A finger metering means is provided and is cam actuated so as to cause one finger to be brought in way of the leading wire of a component as the other finger is being withdrawn from in way of a component in the metering station. The die for shaping and trimming consists of two halves moved first toward each other and then away from each other. The die halves are carried by slide supports and are removably mounted on support blocks. The slides are moved by circular cams enclosed in rectangular followers.