Abstract: A method is provided for texturing the surface of a substrate to enhance the adhesion and to reduce the stress concentration of coatings applied to the substrate. In one embodiment, a first layer of first spheres is applied to the substrate to provide a textured surface onto which is deposited a second layer of larger second spheres. The layered substrate is then reflowed to melt the first layer of first spheres so that the second layer of second spheres is embedded in the formed first reflowed layer and which second layer of second spheres protrudes above the top of the reflowed layer and forms a textured surface corresponding to the shape of abutted and/overlapping second spheres. In another embodiment, the first layer of first spheres is reflowed and then a second layer of second spheres deposited thereon. The first layer is then again reflowed embedding the second spheres therein.

Abstract: A method is provided for texturing the surface of a substrate to enhance the adhesion and to reduce the stress concentration of coatings applied to the substrate. In one embodiment, a first layer of first spheres is applied to the substrate to provide a textured surface onto which is deposited a second layer of larger second spheres. The layered substrate is then reflowed to melt the first layer of first spheres so that the second layer of second spheres is embedded in the formed first reflowed layer and which second layer of second spheres protrudes above the top of the reflowed layer and forms a textured surface corresponding to the shape of abutted and/overlapping second spheres. In another embodiment, the first layer of first spheres is reflowed and then a second layer of second spheres deposited thereon. The first layer is then again reflowed embedding the second spheres therein.

Abstract: An adapter for locating an integrated circuit having a plurality of pin-like elements extending therefrom which are adapted to be electrically interconnected with electrical contacts on a printed circuit board includes a plurality of generally cylindrical socket contact receiving members in each of which is located a socket contact for receiving one of the pin-like elements extending from the integrated circuit. The receiving members are spaced apart from one another so that a space exists between adjacent receiving members to allow inspection of the solder joints. The adjacent receiving members are connected to one another so that the plurality of receiving members form a single unit. The adapter can be used in connection with various types of integrated chip packages.