Abstract: An electronic component insertion machine includes an insertion head having a pair of finger assemblies which grip a component prior to insertion. Each finger assembly has an actuating lever secured to a pivot shaft and a finger holder releasably clamped to the pivot shaft. The actuating levers have surfaces which are maintained in engagement throughout their displacement so that rotation of one effects a conjoint rotation of the other and are displaced to advanced positions. The finger holders are then unclamped, oriented to their desired orientations relative to their actuating levers and then clamped in position.

Abstract: A mechanism for transferring chip components from a supply source onto a conveyor. A manifold of individual disc members receive the component from a supply and rotate to position the component onto a conveyor. A drive crank rotates the disc from the receiving to the release position and sensors tell a machine control the position of the component and the disc.

Abstract: An adhesive dispenser for metering very small quantities of viscious liquids (grease-like materials) or thick pastes (putty-like materials) and transferring the metered material as a hemispherical or conical dot to a substrate at a high rate of speed. This device can be used to place adhesives between the conductive lands of a printed circuit board to adhere "chip type" electronic components between the conductive lands of the board. The dispenser comprises an outer cylinder carried in a support housing for movement toward and away from the board, the outer cylinder carries an adhesive metering device which places a dot of adhesive on the board.

Abstract: A placement mechanism for vertically displacing a micro-electronic component to place the component on a printed circuit board. The mechanism has a spindle that is displaceable on a vertical axis and rotatable on the vertical axis to align the component leads with the lands of the circuit on the board. The spindle carries a placement rod in communication with a vacuum source to enable the component to be retrieved and placed on the board. The placement rod has a resilient interconnection with the spindle to allow for varying board heights and to buffer the impact of the placement of the component on the board.

Abstract: A component placement head for positioning micro-electronic components on a printed circuit board including an adjustable shelf for receiving the component from a stationary conveyor and accurately positioning the component below the placement nozzle on the head. The nozzle picks up the component from the shelf and aligns the component leads with the conductive lands on the board and then places the component on the board. There is a control limiting the position of the adjustable shelf to assure the component is properly positioned in the nozzle of the placement head.

Abstract: A mechanism for stripping the tape carrying an electrical component to expose the component for removal from the tape. The cover strip is removed from the tape to expose the component and the tape is passed between guides that retain the component in the tape until removed therefrom.

Abstract: A machine for automatically placing chips or similar micro-electronic components on a substrate carried on an X-Y type table, the machine having means to supply components, means to convey the components, means to transfer the components from the supply source to the conveyor, the conveyor transporting the components to a placement head located above the substrate to place the component on the substrate. The machine can also include a station for applying an adhesive or similar means on the substrate to adhere the component on the substrate.

Abstract: An insertion device for two or four pin dual in-line electronic insertion machines which include a radial array of transfer units associated with a picker unit which grasps a component and inserts it into a circuit board.

Abstract: A station for testing electrical components is provided with spaced pairs of cooperative lead-engageable contacts, these pairs being yieldingly openable to arrest a lead arriving therebetween for the test. At least one contact of each pair has an abrading edge which may be shaped to penetrate transversely any wire oxidation of the lead to obtain accurate electrical measurement though requiring only low contact force.

Abstract: A cut-clinch mechanism of compact structure operates on variably spaced leads of components after their insertion to clinch them directionally at an angle selectable between 90.degree. plus or minus 45.degree. to the line connecting the lead-receiving holes of a circuit board. The leads are clinched in parallel for optimum component stability, and their lengths are adjustable by shims. The movable one of each of two pairs of cutting knives pivots about an axis parallel to the board and has a configuration to wipe the cut lead thereagainst while exerting only small force tending to lift the board. For control purposes the presence of the component lead to be clinched is ascertained by the lead completing a circuit between the cooperating knives; and completion of its clinching by means of the movable knife.