Abstract: An electronics package is disclosed. The electronics package includes a first radio frequency (RF) substrate layer, a second RF substrate layer, and a plurality of conductive layers disposed adjacent to at least one of the first RF substrate layer and the second RF substrate layer and including an inner conductive layer disposed between and adjacent to both the first RF substrate layer and the second RF substrate layer. The inner conductive layer bonds the first RF substrate layer to the second RF substrate layer. The electronics package also includes a plurality of conductive interconnects extending through the first RF substrate layer and the second RF substrate layer and electrically coupled between at least two of the plurality of conductive layers.

Abstract: An electronics package is disclosed. The electronics package includes a first radio frequency (RF) substrate layer, a second RF substrate layer, and a plurality of conductive layers disposed adjacent to at least one of the first RF substrate layer and the second RF substrate layer and including an inner conductive layer disposed between and adjacent to both the first RF substrate layer and the second RF substrate layer. The inner conductive layer bonds the first RF substrate layer to the second RF substrate layer. The electronics package also includes a plurality of conductive interconnects extending through the first RF substrate layer and the second RF substrate layer and electrically coupled between at least two of the plurality of conductive layers.

Abstract: A wireless access point is disclosed. The wireless access point includes a substrate, an antenna structure disposed on the substrate and configured to transmit and receive wireless electromagnetic communication signals, and a fiber-optic interface disposed on the substrate and communicatively coupled to the antenna structure and a fiber-optic cable. The fiber-optic interface is configured to transmit and receive optical communication signals through the fiber-optic cable.

Abstract: A system, such as a heat exchange assembly includes a support structure having a recess, a first support end, a second support end, and a support portion extending between the first and second support ends. The support structure further includes a plurality of projections protruding from a portion of a surface of the support structure, corresponding to the support portion. The support structure is a primary heat sink. The heat exchange assembly includes a vapor chamber having a casing and a wick disposed within the casing. The vapor chamber is disposed within the recess and coupled to a surface of the support structure such that the plurality of projections surrounds the vapor chamber. The casing includes a mid projected portion disposed at an evaporator portion of the vapor chamber. The first and second support ends, and the mid projected portion include a non-uniform surface configured to contact the circuit card.

Abstract: In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.

Abstract: A method for monitoring cooking in an oven appliance includes drawing cooking vapors or gases from a cooking chamber to a fluid analysis assembly of the oven appliance during a gas or vapor analysis cooking cycle, determining a cooking status of the food item within the cooking chamber with the controller of the oven appliance based upon a response pattern of a plurality of fluid sensors of the fluid analysis assembly to the cooking vapors or gases during the gas or vapor analysis cooking cycle, and activating an alert with the controller of the oven appliance when the cooking status of the food item within the cooking chamber is a particular cooking status.

Abstract: An electrical system includes an operation MEMS switch operable in on and off states to enable and disable current flow to a load and a fault interruption MEMS switch positioned in series with the operation MEMS switch. The fault interruption MEMS switch is operable in on and off states to enable and disable current flow to the electrical load, with operation of the fault interruption MEMS switch in the off state disabling current flow to the load regardless of the state of the operation MEMS switch. A fault sensor control system operate to sense a system variable, analyze the system variable to detect if a fault is affecting the electrical system and, upon detection of a fault, switch the fault interruption MEMS switch from the on state to the off state to interrupt current flowing through the operation MEMS switch to the load.

Abstract: A system and method for reducing or increasing the mechanical structure resonance of a synthetic jet device is disclosed. A synthetic jet device includes a first plate, a second plate spaced apart from the first plate, a spacing component coupled to and positioned between the first and second plates to form a chamber and including an orifice therein, and an actuator element coupled to at least one of the first and second plates to selectively cause deflection thereof, thereby changing a volume within the chamber so that a series of fluid vortices is generated and projected out from the orifice of the spacing component. At least one of the first and second plates includes a modified section that alters a mechanical resonance of the synthetic jet device, so as to control a level of acoustic noise generated by the synthetic jet device.

Abstract: A synthetic jet driven cooling device includes at least one synthetic jet actuator to generate and project a series of fluid vortices. A manifold coupled to the synthetic jet actuator(s) receives the fluid vortices and generates a primary air stream. An air amplifier connected to the manifold by a connecting pipe receives the primary air stream. The air amplifier includes an air intake oriented perpendicular to the connecting pipe and an air outlet positioned opposite the air intake, with a venturi section positioned between the air intake and air outlet that has a diameter smaller than the air intake diameter. A low pressure region in a center of the venturi section entrains a surrounding air in through the air intake to generate a secondary air stream that combines with the primary air stream to generate a combined air flow that flows through the venturi and exits the air outlet.

Abstract: A process for fabricating a LED lighting apparatus includes disposing a composite coating on a surface of a LED chip. The composite coating comprises a first composite layer having a manganese doped phosphor of formula I and a first binder, and a second composite layer comprising a second phosphor composition and a second binder. The first binder, the second binder or both include a poly(meth)acrylate. Ax[MFy]:Mn4+??(I) wherein A is Li, Na, K, Rb, Cs, or a combination thereof; M is Si, Ge, Sn, Ti, Zr, Al, Ga, In, Sc, Hf, Y, La, Nb, Ta, Bi, Gd, or a combination thereof; x is the absolute value of the charge of the [MFy] ion; y is 5, 6 or 7.

Abstract: In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.

Abstract: An electrical system includes an operation MEMS switch operable in on and off states to enable and disable current flow to a load and a fault interruption MEMS switch positioned in series with the operation MEMS switch. The fault interruption MEMS switch is operable in on and off states to enable and disable current flow to the electrical load, with operation of the fault interruption MEMS switch in the off state disabling current flow to the load regardless of the state of the operation MEMS switch. A fault sensor control system operate to sense a system variable, analyze the system variable to detect if a fault is affecting the electrical system and, upon detection of a fault, switch the fault interruption MEMS switch from the on state to the off state to interrupt current flowing through the operation MEMS switch to the load.

Abstract: A system, such as a heat exchange assembly includes a support structure having a recess, a first support end, a second support end, and a support portion extending between the first and second support ends. The support structure further includes a plurality of projections protruding from a portion of a surface of the support structure, corresponding to the support portion. The support structure is a primary heat sink. The heat exchange assembly includes a vapor chamber having a casing and a wick disposed within the casing. The vapor chamber is disposed within the recess and coupled to a surface of the support structure such that the plurality of projections surrounds the vapor chamber. The casing includes a mid projected portion disposed at an evaporator portion of the vapor chamber. The first and second support ends, and the mid projected portion include a non-uniform surface configured to contact the circuit card.

Abstract: A submersible liquid-vapor generator (LVG) includes an evaporator portion in heat transfer communication with a heat energy source. The LVG also includes a magnetic field apparatus coupled in flow communication with the evaporator portion. The LVG further includes a condenser portion coupled in flow communication with the magnetic field apparatus. The LVG also includes a hybrid working fluid including nanoparticles. The evaporator portion, the magnetic field portion, and the condenser portion at least partially define a hybrid working vapor flow path. The LVG further includes an electrically non-conductive wick structure coupled in flow communication with the evaporator portion and the condenser portion. The wick structure at least partially defines a hybrid working liquid flow path extending between the condenser portion and the evaporator portion.

Abstract: A method for monitoring cooking in an oven appliance includes drawing cooking vapors or gases from a cooking chamber to a fluid analysis assembly and exposing a plurality of fluid sensors of the fluid analysis assembly to the cooking vapors or gases. The method also includes establishing a response pattern of the plurality of fluid sensors with a machine or statistical learning model(s) and determining a cooking status of the food item within the cooking chamber based upon the response pattern of the plurality of fluid sensors.

Abstract: A method for monitoring cooking in an oven appliance includes drawing cooking vapors or gases from a cooking chamber to a fluid analysis assembly of the oven appliance during a gas or vapor analysis cooking cycle, determining a cooking status of the food item within the cooking chamber with the controller of the oven appliance based upon a response pattern of a plurality of fluid sensors of the fluid analysis assembly to the cooking vapors or gases during the gas or vapor analysis cooking cycle, and activating an alert with the controller of the oven appliance when the cooking status of the food item within the cooking chamber is a particular cooking status.

Abstract: The present subject matter provides an oven appliance with a fluid analysis assembly fluidly mounted to a duct. The fluid analysis assembly includes a casing and a sensor array. A fluid inlet of the casing extends between the duct and a dilution chamber of the casing. An ambient inlet of the casing is contiguous with ambient air about the casing and the dilution chamber. The sensor array includes a plurality of fluid sensors positioned at the dilution chamber of the casing.

Abstract: A synthetic jet includes a first backer structure, one and only one actuator, a wall member coupled to and positioned between the first backer structure and the one and only one actuator to form a cavity, and wherein the wall member has an orifice formed therethrough, and wherein the orifice fluidically couples the cavity to an environment external to the cavity.

Abstract: Lighting systems having unique configurations are provided. For instance, the lighting system may include a light source, a thermal management system and driver electronics, each contained within a housing structure. The light source is configured to provide illumination visible through an opening in the housing structure. The thermal management system is configured to provide an air flow, such as a unidirectional air flow, through the housing structure in order to cool the light source. The driver electronics are configured to provide power to each of the light source and the thermal management system.

Abstract: A mounting apparatus for a cooling device is disclosed. The mounting apparatus includes a plurality of connectors extending outwardly from the cooling device. The mounting apparatus also includes at least one mounting post coupled to the plurality of connectors and configured to mount the cooling device on a substrate.