Patents by Inventor Stanton Earl Weaver, Jr.
Stanton Earl Weaver, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11503704Abstract: An electronics package is disclosed. The electronics package includes a first radio frequency (RF) substrate layer, a second RF substrate layer, and a plurality of conductive layers disposed adjacent to at least one of the first RF substrate layer and the second RF substrate layer and including an inner conductive layer disposed between and adjacent to both the first RF substrate layer and the second RF substrate layer. The inner conductive layer bonds the first RF substrate layer to the second RF substrate layer. The electronics package also includes a plurality of conductive interconnects extending through the first RF substrate layer and the second RF substrate layer and electrically coupled between at least two of the plurality of conductive layers.Type: GrantFiled: December 30, 2019Date of Patent: November 15, 2022Assignee: General Electric CompanyInventors: Christopher James Kapusta, Stanton Earl Weaver, Jr., Joseph Alfred Iannotti
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Publication number: 20210204397Abstract: An electronics package is disclosed. The electronics package includes a first radio frequency (RF) substrate layer, a second RF substrate layer, and a plurality of conductive layers disposed adjacent to at least one of the first RF substrate layer and the second RF substrate layer and including an inner conductive layer disposed between and adjacent to both the first RF substrate layer and the second RF substrate layer. The inner conductive layer bonds the first RF substrate layer to the second RF substrate layer. The electronics package also includes a plurality of conductive interconnects extending through the first RF substrate layer and the second RF substrate layer and electrically coupled between at least two of the plurality of conductive layers.Type: ApplicationFiled: December 30, 2019Publication date: July 1, 2021Inventors: Christopher James Kapusta, Stanton Earl Weaver, JR., Joseph Alfred Iannotti
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Patent number: 10667429Abstract: A system, such as a heat exchange assembly includes a support structure having a recess, a first support end, a second support end, and a support portion extending between the first and second support ends. The support structure further includes a plurality of projections protruding from a portion of a surface of the support structure, corresponding to the support portion. The support structure is a primary heat sink. The heat exchange assembly includes a vapor chamber having a casing and a wick disposed within the casing. The vapor chamber is disposed within the recess and coupled to a surface of the support structure such that the plurality of projections surrounds the vapor chamber. The casing includes a mid projected portion disposed at an evaporator portion of the vapor chamber. The first and second support ends, and the mid projected portion include a non-uniform surface configured to contact the circuit card.Type: GrantFiled: September 8, 2017Date of Patent: May 26, 2020Assignee: GENERAL ELECTRIC COMPANYInventors: Shakti Singh Chauhan, Hendrik Pieter Jacobus De Bock, Graham Charles Kirk, Stanton Earl Weaver, Jr., David Shannon Slaton, Tao Deng, Pramod Chamarthy
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Patent number: 10309587Abstract: In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.Type: GrantFiled: May 3, 2013Date of Patent: June 4, 2019Assignee: GE Lighting Solutions, LLCInventors: Srinath K. Aanegola, Emil V. Radkov, James Reginelli, Larry R. Stadelman, Matthew Mrakovich, Tomislav J. Stimac, Stanton Earl Weaver, Jr., Thomas F. Soules
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Patent number: 10244778Abstract: A method for monitoring cooking in an oven appliance includes drawing cooking vapors or gases from a cooking chamber to a fluid analysis assembly of the oven appliance during a gas or vapor analysis cooking cycle, determining a cooking status of the food item within the cooking chamber with the controller of the oven appliance based upon a response pattern of a plurality of fluid sensors of the fluid analysis assembly to the cooking vapors or gases during the gas or vapor analysis cooking cycle, and activating an alert with the controller of the oven appliance when the cooking status of the food item within the cooking chamber is a particular cooking status.Type: GrantFiled: November 5, 2015Date of Patent: April 2, 2019Assignee: Haier US Appliance Solutions, Inc.Inventors: James Lee Armstrong, Stanton Earl Weaver, Jr., Sabrina Marie Hannah, Nandini Nagraj, Manuel Alfredo Palacios
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Publication number: 20180080614Abstract: In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.Type: ApplicationFiled: May 3, 2013Publication date: March 22, 2018Inventors: Srinath K. Aanegola, Emil V. Radkov, James Reginelli, Larry R. Stadelman, Matthew Mrakovich, Tomislav J. Stimac, Stanton Earl Weaver, JR., Thomas F. Soules
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Publication number: 20170374764Abstract: A system, such as a heat exchange assembly includes a support structure having a recess, a first support end, a second support end, and a support portion extending between the first and second support ends. The support structure further includes a plurality of projections protruding from a portion of a surface of the support structure, corresponding to the support portion. The support structure is a primary heat sink. The heat exchange assembly includes a vapor chamber having a casing and a wick disposed within the casing. The vapor chamber is disposed within the recess and coupled to a surface of the support structure such that the plurality of projections surrounds the vapor chamber. The casing includes a mid projected portion disposed at an evaporator portion of the vapor chamber. The first and second support ends, and the mid projected portion include a non-uniform surface configured to contact the circuit card.Type: ApplicationFiled: September 8, 2017Publication date: December 28, 2017Inventors: SHAKTI SINGH CHAUHAN, HENDRIK PIETER JACOBUS DE BOCK, GRAHAM CHARLES KIRK, STANTON EARL WEAVER, JR., DAVID SHANNON SLATON, TAO DENG, PRAMOD CHAMARTHY
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Publication number: 20170130968Abstract: A method for monitoring cooking in an oven appliance includes drawing cooking vapors or gases from a cooking chamber to a fluid analysis assembly and exposing a plurality of fluid sensors of the fluid analysis assembly to the cooking vapors or gases. The method also includes establishing a response pattern of the plurality of fluid sensors with a machine or statistical learning model(s) and determining a cooking status of the food item within the cooking chamber based upon the response pattern of the plurality of fluid sensors.Type: ApplicationFiled: November 10, 2015Publication date: May 11, 2017Inventors: Nandini Nagraj, Stanton Earl Weaver, JR., Zhexiong Tang, Manuel Alfredo Palacios, Igor Tokarev, Matthew Vaughan Schulmerich
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Publication number: 20170127700Abstract: A method for monitoring cooking in an oven appliance includes drawing cooking vapors or gases from a cooking chamber to a fluid analysis assembly of the oven appliance during a gas or vapor analysis cooking cycle, determining a cooking status of the food item within the cooking chamber with the controller of the oven appliance based upon a response pattern of a plurality of fluid sensors of the fluid analysis assembly to the cooking vapors or gases during the gas or vapor analysis cooking cycle, and activating an alert with the controller of the oven appliance when the cooking status of the food item within the cooking chamber is a particular cooking status.Type: ApplicationFiled: November 5, 2015Publication date: May 11, 2017Inventors: James Lee Armstrong, Stanton Earl Weaver, JR., Sabrina Marie Hannah, Nandini Nagraj, Manuel Alfredo Palacios
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Publication number: 20170130967Abstract: The present subject matter provides an oven appliance with a fluid analysis assembly fluidly mounted to a duct. The fluid analysis assembly includes a casing and a sensor array. A fluid inlet of the casing extends between the duct and a dilution chamber of the casing. An ambient inlet of the casing is contiguous with ambient air about the casing and the dilution chamber. The sensor array includes a plurality of fluid sensors positioned at the dilution chamber of the casing.Type: ApplicationFiled: November 5, 2015Publication date: May 11, 2017Inventors: Stanton Earl Weaver, JR., Gary Dwayne Mandrusiak, Nandini Nagraj
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Publication number: 20160186979Abstract: The present invention provides an optoelectronic device comprising a heat source and a heat transfer fluid. The present invention also provides a method of preparing an optoelectronic device, which comprises (i) providing a heat source, and (ii) filling a space in the vicinity of the heat source with a heat transfer liquid. The optoelectronic device has gained technical merits such as improved heat removing efficiency, lower chip/junction temperature, increased lumen output, longer operational lifetime, and better reliability, among others.Type: ApplicationFiled: March 7, 2016Publication date: June 30, 2016Applicant: GE Lighting Solutions, LLCInventors: Mehmet Arik, Stanton Earl Weaver, JR.
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Patent number: 9333599Abstract: An electronics chassis is provided. The electronics chassis includes a plurality of panels that define an interior space. One panel of the plurality of panels has a composite segment having an internal face and an external face. The electronics chassis further includes a conductive thermal pathway that extends through the panel from the internal face of the composite segment to the external face of the composite segment.Type: GrantFiled: December 20, 2013Date of Patent: May 10, 2016Assignee: General Electric CompanyInventors: Hendrik Pieter Jacobus de Bock, Stanton Earl Weaver, Jr., Tao Deng, Jay Todd Labhart, Pramod Chamarthy, Shakti Singh Chauhan, Graham Charles Kirk, Brian Patrick Hoden
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Patent number: 9331477Abstract: A cooling system includes a synthetic jet having a first synthetic jet lead and a second synthetic jet lead. The cooling system also includes a capacitor having a first capacitor lead and a second capacitor lead. The first capacitor lead is coupled to the first synthetic jet lead. The synthetic jet is configured to be powered via an alternating current (AC) power source coupled to the second capacitor lead and to the second synthetic jet lead.Type: GrantFiled: October 22, 2013Date of Patent: May 3, 2016Assignee: General Electric CompanyInventors: Ramanujam Ramabhadran, Charles Erklin Seeley, John Stanley Glaser, Robert James Thomas, Stanton Earl Weaver, Jr.
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Patent number: 9303858Abstract: A cooling system is provided. The cooling system includes an enclosure. The enclosure is defined by walls among which at least one is movable. The enclosure further includes at least one aperture on at least one wall. The system further includes an amplification element that is coupled with at least one walls of the enclosure. Further, the cooling system includes an actuation unit mechanically coupled with the amplification element. The actuation unit includes at least one actuation signal triggered actuator configured to cause a displacement the amplification element. In the cooling system, the amplification element is configured to amplify the actuator caused displacement through to the at least one wall of the enclosure such that fluid enters and exits the enclosure from the at least one aperture.Type: GrantFiled: February 28, 2013Date of Patent: April 5, 2016Assignee: General Electric CompanyInventors: Charles Erklin Seeley, Stanton Earl Weaver, Jr., Brian Magann Rush, Mark Howard Giammattei
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Publication number: 20160033140Abstract: An oven appliance with a sensor for sensing gases in the cooking chamber is provided. One or more features and methods are provided for detecting the gas levels in the cooking chamber to determine if the cooking chamber is clean or unclean. Features for initiating and terminating an oven cleaning cycle are also provided.Type: ApplicationFiled: July 30, 2014Publication date: February 4, 2016Inventors: Stanton Earl Weaver, JR., Nandini Nagraj, William Guy Morris, Todd-Michael Striker, Zhexiong Tang, Manuel Alfredo Palacios
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Patent number: 9194575Abstract: A thermal management system for electronic devices is provided. The thermal management system includes a plurality of synthetic jets provided in a stacked arrangement and separated by respective spacers within the stacked arrangement. The stack of synthetic jets may be used to facilitate airflow in the thermal management system, such as to facilitate air flow over a heat sink in one implementation.Type: GrantFiled: June 29, 2012Date of Patent: November 24, 2015Assignee: GENERAL ELECTRIC COMPANYInventors: Rajdeep Sharma, Stanton Earl Weaver, Jr.
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Publication number: 20150181763Abstract: An electronics chassis is provided. The electronics chassis includes a plurality of panels that define an interior space. One panel of the plurality of panels has a composite segment having an internal face and an external face. The electronics chassis further includes a conductive thermal pathway that extends through the panel from the internal face of the composite segment to the external face of the composite segment.Type: ApplicationFiled: December 20, 2013Publication date: June 25, 2015Applicant: General Electric CompanyInventors: Hendrik Pieter Jacobus de Bock, Stanton Earl Weaver, JR., Tao Deng, Jay Todd Labhart, Pramod Chamarthy, Shakti Singh Chauhan, Graham Charles Kirk, Brian Patrick Hoden
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Publication number: 20150173243Abstract: A heat exchange assembly for dissipating heat from a hot component of a circuit card is disclosed. The heat exchange assembly includes a support structure having a first support end, a second support end, and a support portion extending between the first support end and the second support end. The support structure further includes a plurality of first projections protruding from a portion of a surface of the support structure, corresponding to the support portion. Further, the heat exchange assembly includes a vapor chamber having a casing and a wick disposed within the casing. The vapor chamber is coupled to a surface of the support structure.Type: ApplicationFiled: December 13, 2013Publication date: June 18, 2015Applicant: General Electric CompanyInventors: Shakti Singh Chauhan, Hendrik Pieter Jacobus de Bock, Graham Charles Kirk, Stanton Earl Weaver, JR., David Shannon Slaton, Tao Deng, Pramod Chamarthy
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Publication number: 20150108899Abstract: A cooling system includes a synthetic jet having a first synthetic jet lead and a second synthetic jet lead. The cooling system also includes a capacitor having a first capacitor lead and a second capacitor lead. The first capacitor lead is coupled to the first synthetic jet lead. The synthetic jet is configured to be powered via an alternating current (AC) power source coupled to the second capacitor lead and to the second synthetic jet lead.Type: ApplicationFiled: October 22, 2013Publication date: April 23, 2015Applicant: General Electric CompanyInventors: Ramanujam Ramabhadran, Charles Erklin Seeley, John Stanley Glaser, Robert James Thomas, Stanton Earl Weaver, Jr.
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Publication number: 20150060021Abstract: A heat transfer device includes a casing and a wick disposed within the casing. The wick includes a first sintered layer and a second sintered layer. The first sintered layer includes a plurality of first sintered particles, having a first porosity and a plurality of first pores. The first sintered layer is disposed proximate to an inner surface of the casing. The second sintered layer includes a plurality of second sintered particles, having a second porosity and a plurality of second pores. The second sintered layer is disposed on the first sintered layer. The heat transfer device includes at least one first sintered particle smaller than at least one second pore and the first porosity is smaller than the second porosity.Type: ApplicationFiled: September 5, 2013Publication date: March 5, 2015Applicant: General Electric CompanyInventors: Shakti Singh Chauhan, William Harold King, Stanton Earl Weaver, JR., Binoy Milan Shah, Tao Deng