Abstract: The present invention relates to an isolated antibody or antigen-binding fragment thereof that binds to human A2AP. The isolated antibody or antigen-binding fragment according to the present invention i) cross-reacts with rabbit and/or cynomolgus A2AP, ii) does not inhibit human plasmin activity, and iii) increases plasmin mediated clot lysis in the presence of A2AP.

Abstract: The invention relates to a method for the precision processing of substrates, in particular for the microstructuring of thin layers, local dopant introduction and also local application of a metal nucleation layer in which a liquid-assisted laser, i.e. laser irradiation of a substrate which is covered in the regions to be processed by a suitable reactive liquid, is implemented.

Abstract: The present invention relates to rear-side contact solar cells and also solar cell modules manufactured therefrom, said modules having a special electrode structure, and also to a method for the production thereof. The electrodes, via which the current of the rear-side contact cell is tapped, are thereby separated by an insulating layer from the finger contacts which are in contact with the n- or p-semiconductor element of the solar cell through an insulating layer. The method makes possible a substantial simplification relative to the production methods described in the state of the art by means of spatial decoupling of the structuring of the electrodes from the solar cell.

Abstract: The invention relates to a hetero solar cell which comprises silicon, doped silicon layers and tunnel passivation layers. This is concluded by an indium-tin oxide layer on the front-side and by an aluminium layer on the rear-side. Furthermore, the invention relates to a method for producing hetero solar cells.

Abstract: The present invention relates to a metal-containing composition, a method for producing electrical contact structures on electronic components and also an electronic component provided with such a contacting.

Abstract: The present invention relates to a novel method for applying conductive structures on solar cells, a hot melt aerosol ink being atomised by means of an aerosol jet printing system and being discharged from the printing system in the direction of the solar cell, the printing system being heated at least partially in order to keep low the viscosity of the ink which is used. When impinging on the non-heated substrate (solar cell), the ink solidifies.

Abstract: An electrical contact is applied on a semiconducting substrate, such as a solar cell. A layer of metallic powder is applied on the substrate. A laser beam is the guided over the substrate for local sintering and/or melting of the metallic powder. The non-sintered or non-melted metallic powder is then removed from the substrate.

Abstract: The invention relates to a method for the precision processing of substrates, in particular for the microstructuring of thin layers, local dopant introduction and also local application of a metal nucleation layer in which a liquid-assisted laser, i.e. laser irradiation of a substrate which is covered in the regions to be processed by a suitable reactive liquid, is implemented.

Abstract: A method for producing a metal contact structure of a solar cell is provided and includes the following steps: applying a metal contact structure to a surface of the solar cell, reinforcing the metal contact structure in an electrolytic bath. The invention is characterized by the metal contact structure being applied by applying a metal-containing ink to the surface of the solar cell by at least one pressurized nozzle.

Abstract: A semiconductor component includes at least one surface, at least one trench formed in the at least one surface and at least one edge structured and arranged on the at least one surface and formed by the at least one trench. Additionally, the semiconductor component includes an electric contact arranged on the at least one edge, wherein the at least one surface provides for at least one of electric and optical power input and output to the semiconductor component.

Abstract: A method of electrically contacting a semiconductor layer (13) coated with at least one dielectic layer (12) which is coated with a metal layer the metal layer (11) is applied on the dielectric layer (12) and the metal layer (11) is temporarily locally heated in a line, linear or dotted pattern by means of a source of radiation (9) in a controlled manner in such a way that a local molten mixture, is formed consisting exclusively of the metal layer (11), the dielectric layer (12) and the semiconductor layer (13) are located directly underneath the metal layer (11) and upon solidification, leads to an electrical contact between the semiconductor layer (13) and the metal layer (11).

Abstract: What is described here is a method of electrically contacting a semiconductor layer (13) coated with at least one dielectric layer (12).

Abstract: Disclosed is a process for fabricating a solar cell as well as the solar cell itself having a grid-shaped surface texture provided with a n-doped emitter layer provided on a base material.The invention is distinguished by the fact that the base material is first covered full-surface with a n.sup.++ doping layer in the course of diffusion doping followed by a selective etching procedure on the emitter layer using a mask which produces the surface texture in such a manner that a multiplicity of crisscrossing rows of pointed ribs is created whose top section is composed of the n.sup.++ doped doping layer and bottom section of the base material.