Abstract: The invention relates to a method for repairing coating damage and/or erosion damage on the internal surface of a weapon barrel by overlaying the respectively damaged barrel region with a suitable coating material and, if necessary, reworking it mechanically. To ensure that coating damages and/or erosion damages on a weapon barrel can be repaired easily, safely and cost-effectively, without resulting in a considerable weakening of the weapon barrel, according to the invention, deposit of the coating material is via overlay welding onto the respectively damaged barrel region.

Abstract: The power semiconductor includes a module housing having a conductive cover plate and a conductive baseplate and also an insulating housing wall arranged between the cover plate and the baseplate. A power semiconductor circuit is accommodated in the module housing. Two terminals of the power semiconductor circuit are led out of the module housing, a first of the at least two terminals being provided for the contact connection of the cover plate. The two terminals are arranged on opposite areas of a printed circuit board led out of the module housing, which printed circuit board can be contact-connected by means of a standard connector. The power semiconductor module according to the invention has improved contacts with regard to stability and inductance.

Abstract: The stackable power semiconductor module comprises electrically conductive base plates, an electrically conductive cover plate and a plurality of semiconductor chips. The semiconductor chips are arranged in groups of several on separate base plates in preassembled submodules. The base plates are moveable towards the cover plate. The submodules are paralleled inside the module housing. The submodules are fully testable according to their current ratings. Altering the number of submodules paralleled inside the housing can vary the overall current rating of a module.

Abstract: The power semiconductor module comprises a module housing having a conductive cover plate (2) and a conductive baseplate and also an insulating housing wall (3) arranged between the cover plate and the baseplate. A power semiconductor circuit is accommodated in the module housing. Two terminals (5, 6) of the power semiconductor circuit are led out of the module housing, a first (5) of the at least two terminals being provided for the contact connection of the cover plate. The two terminals (5, 6) are arranged on opposite areas of a printed circuit board (4) led out of the module housing, which printed circuit board can be contact-connected by means of a standard connector.

Abstract: A method for coating the inside surface (5) of a gun barrel (1), at least in a partial region (2), with a layer of a layer material (9) for avoiding erosion. For the simple application of layer materials that melt at high temperatures to the inside surface (5) of the gun barrel (1), with the internal-stress state of the barrel (1) only being influenced to a small extent by the heat input, the coating is applied to the inside surface of the respective barrel (1) through plasma spraying, and simultaneously directing a laser beam (7) toward the inside surface (5) of the barrel (1), to melt the near-surface gun-barrel region (10) that is already coated or is to be coated. This causes the formation of a molten bath (11) that contains the melted gun-barrel material and the layer material in the near-surface region (10) of the barrel, with the bath hardening as the laser beam (7) continues to move.

Abstract: The power semiconductor submodule (1) has at least two semiconductor chips (21, 22), which have two main electrodes (3, 4), between two main connections (6, 7), with a contact force being exerted by a contact die (8) on the one main electrode (3), and the other main electrode (4) of the semiconductor chip (21, 22) thus being pressed against a base plate (5). The two semiconductor chips (21, 22) are electrically connected in series between the two main connections (6, 7) of the power semiconductor submodule.

Abstract: A cooling device for a high-power semiconductor module has a cooler lower part (1) and a cooler upper part (2), with the cooler upper part (2) being connected to the cooler lower part (1) by an integral material connection. The cooler upper part (2) has a cooling plate (20) composed of metal matrix composite, for at least one semiconductor component (4) to be fitted to. A metal border (21) is integrally formed on the cooling plate (20) in order to allow an integral material connection between the cooler upper part (2) and the cooler lower part (1). This results in a cooling device which can be produced easily and whose cost is low.

Abstract: The method for the manufacture of unidirectionally fiber reinforced thermoplastic bands comprises a pressure impregnation of a fiber strand in a bath with a dispersion of thermoplastic particles. Heat treatments for the drying of the strand and a melting on of the particles taken up by the strand follow the pressure impregnation. The strand is drawn through the bath at a predetermined draw-off speed about a plurality of deflection elements. The dispersion of the bath is largely held in a stationary state, namely through the supply of an infeed dispersion with a first particle concentration and through an initial setting of a second particle concentration in the bath: The infeed dispersion is fed in continuously or periodically, with the first particle concentration being held constant. A corresponding feeding in of a dispersion of higher particle concentrations as well as an additional amount of dispersing medium is possible.

Abstract: A cooling device for a high-power semiconductor module has a cooler lower part (1) and a cooler upper part (2), with the cooler upper part (2) being connected to the cooler lower part (1) by an integral material connection. The cooler upper part (2) has a cooling plate (20) composed of metal matrix composite, for at least one semiconductor component (4) to be fitted to. A metal border (21) is integrally formed on the cooling plate (20) in order to allow an integral material connection between the cooler upper part (2) and the cooler lower part (1). This results in a cooling device which can be produced easily and whose cost is low.