Abstract: A die package comprises a semiconductor die comprising a first face, a second face on an opposing second side, an active layer located between the first face and the second face, a first electrical pathway between the first face and the active layer, a second electrical pathway between the second face and the active layer, a first contact pad coupled to the first face and electrically connected to the first electrical pathway, and a second contact pad coupled to the second face and electrically connected to the second electrical pathway. In an example, the first electrical pathway is configured to transmit one or more signals between the first contact pad and the active layer and the second electrical pathway is configured to transmit electrical power between the second contact pad and the active layer.

Abstract: An electronic system has a printed circuit board and a substrate. The substrate has two sides, a top and bottom. At least one memory unit is connected to the bottom side of the substrate and at least one processor is connected to the top side of the substrate. The memory is connected to the processor with interconnects that pass through the substrate.

Abstract: A semiconductor package comprises a package substrate comprised of comprised of layers of a first material. The semiconductor package includes an integrated circuit (IC) attached to the substrate at a first surface of the IC through a plurality of vias. The semiconductor package includes at least one interface layer comprised of an interface material different from the first material and sealed from exposure to air. The interface material can comprise a moisture-sensitive nonconductive material and can be disposed within the package substrate or between the first surface of the IC and the package substrate, among other locations. Other systems, apparatuses and methods are described.

Abstract: A semiconductor package comprises a package substrate comprised of at least a first layer of dielectric material including a portion of diamond dust material. The diamond dust material is comprised of diamond dust particles. The semiconductor package includes at least one electrical connection coupled through layers of the package substrate.

Abstract: Disclosed herein are microelectronic assemblies, as well as related apparatuses and methods. In some embodiments, a microelectronic assembly may include a die having a first conductive contact on a surface; a substrate having a second conductive contact on a surface; and an interconnect electrically coupling the first conductive contact of the die and the second conductive contact of the substrate, wherein the interconnect includes a portion of a nanowire on the second conductive contact and an intermetallic compound (IMC) surrounding at least a portion of the nanowire on the second conductive contact.

Abstract: An electric hotplate has leads projecting from the underside and whose ends form connecting pins and provided with plugging pieces in the form of flat plugging tongues, connected by plugging connections to matching plugs of apparatus lines. On the plugging pieces is mounted an insulator which, like the plugging pieces, forms a preassembled unit and can be transferred from a stacking position into a connection position. The matching plug can be formed by a socket with stops acting in and counter to the plugging direction and whereof one is constructed so that it automatically snaps in.

Abstract: An electric hotplate has a hot plate body and plugging pieces for connection to connecting members of supply lines. A stacking aid is provided for receiving a plurality of hotplates in a multilayer stack, the stacking aid having pallet plates providing receptacles for receiving the plugging pieces of each single hotplate laterally outside of each single hotplate.

Abstract: For the in particular fully automated electrical connection of electric hotplates (2) to connecting lines (15) a connecting piece with an insulator (18) is provided, which is provided outside two remote end faces (25, 26) with pin-like connecting parts (20, 21) at right angles to its main longitudinal direction, in such a way that they are located in crossing manner to the incoming connecting parts (16, 17) to be connected thereto and are reliably connected thereto at the junctions (22, 23) by spot welding. On the end faces (25, 26) are also provided centering recesses (32) or guiding and orienting faces (35, 36) for the incoming connecting parts (16, 17), so that a self-orienting effect is obtained on assembly.

Abstract: The lower cover plate of an electric hotplate is fixed to the hotplate body by a resilient fixing structure provided on the cover plate, engaging with gripping edges on the outer face of a downwardly directed, central cast pin. The fixing structure can be defined by radial or flap-like, inwardly-directed portions of the cover plate and additionally can have portions engaging on the lower face of the pin and which are firmly held by the final screwing down of the electric hotplate.

Abstract: The present invention relates to an apparatus for connecting appliance lines to cooking plates, hobs or hotplates. Our of the bottom of the electric hotplate, connecting pins (19b) extend for connection to connecting members (33) of a connecting piece (31) that is part of the appliance line. From a passage through an insulating member (20b) in the bottom of the hotplate, the connecting pins (19b) project outwards towards the circumference of the hotplate body (2b). In a transportation mode the pins can be resiliently and completely countersunk in the underside of the hotplate. In the vicinity of the front end of the connecting members (33) of the appliance plug, the connecting piece (31) of the plug has a threading and guidance apparatus for the connecting pins (19b) that does not project beyond the outer circumference of hotplate body (2b), thereby ensuring an automatic, positonally correct connection between the connecting piece (31) and connecting pins (19b).

Abstract: A hotplate is provided on the bottom of its body with a cover plate, through which a lead is passed through an insulator. The stub-like ends of the leads are connected to the outer terminal portions of the multicore cable ends projecting from a positioning part and are squeezed at this point. The multicore cable ends are longer than conventional multicore cable ends.

Abstract: A hotplate has on the bottom of its hotplate body (11) a cover plate (15), through which is passed an electric conductor (18) mounted in an insulating bushing (19) and which only slightly projects over the end of the insulating bushing (19). For automatically placing the hotplate in a stove unit, electrical connecting lines (21) are guided by a positioning member (20) which can be fixed to the rim (14) of the hotplate body (11). On the inside, the connecting lines project far enough to be brought into contact with the electrical conductor (18) passing through the cover plate.