Abstract: A methodology is provided for qualitatively identifying features of an article, such as defects on the surface of a semiconductor substrate, with a string of symbols, such as numbers, according to relevant defect characteristics and information relating to the processing tools visited by the wafer, including reliability information. Embodiments include generalizing, after a defect on a wafer is discovered and inspected (as by optical review, SEM, EDS, AFM, etc.), each quantitative attribute of the defect such as the defect's size, material composition, color, position on the surface of the wafer, etc. into a qualitative category, assigning a numerical symbol to each attribute for identification, and sequencing the symbols in a predetermined manner. The identification sequences of all defects are stored in a database, where they are easily compared with other correspondingly identified defects.

Abstract: In a substrate cleaning apparatus, particles attached to the surface of the substrate are dislodged and removed using a shock wave created by high-speed flow of a gas stream in a tube or slot that is juxtaposed with respect to the surface to be cleaned. The shock wave is generated in a controlled gap between the substrate and the tube or slot. The pressure differential may result from either a reduced pressure or an increased pressure in the tube or slot with respect to an external pressure. With this technique, particles and process residue (from etch, CMP, etc.) may be effectively removed from the surface. The substrate may be a reticle or a semiconductor wafer, though other types of substrates, including other substrates used in semiconductor manufacturing processes, also may be cleaned.