Abstract: A device and method for wave soldering work pieces is disclosed which moves the workpiece to undergo soldering along a specific path across at least one wave of solder created by a solder reservoir. An inert gas atmosphere is located above the solder reservoir, with oxygen largely excluded, where the path runs such that at least one part of the workpiece comes into contact with the wave of solder. A hood and tubes to supply the inert gas below the workpiece are provided. To prevent flooding, two or more tubes are provided with upwardly directed holes or slits which are covered by U-shaped protective housings which are open in a substantially downward direction.