Patents by Inventor Stephan Bäurle

Stephan Bäurle has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Power semiconductor package with bottom surface protrusions
    Patent number: 8796560
    Abstract: A package includes a body that encapsulates a semiconductor die, the body having a first pair of opposing lateral sides, a second pair of opposing lateral sides, a top, and a bottom. The bottom has a primary surface and a plurality of protrusions that extend outward from the primary surface. When the package is mounted to a printed circuit board (PCB) the protrusions contact the PCB and the primary surface is disposed a first distance away from the PCB. The package further includes a plurality of leads that extend outward from the first pair of opposing lateral sides.
    Type: Grant
    Filed: June 25, 2012
    Date of Patent: August 5, 2014
    Assignee: Power Integrations, Inc.
    Inventors: Balu Balakrishnan, Brad L. Hawthorne, Stephan Bäurle