Abstract: In an apparatus for the reactive coating of a substrate (1) with an electrically conductive material (FIG. 1 ), for example with silicon dioxide (SiO.sub.

Abstract: A coating, composed of an optically effective layer system for substrates, whereby the layer system has a high antireflective effect. On a front side of the substrate, facing the observer, in sequence from the front side to the observer, a first layer is arranged on the substrate, functioning as dielectric and comprising metal oxide. Thereupon follows a second layer comprising nitride, preferably TiN.sub.x (x is equal to or greater than 1, preferably x=1.05). A third layer follows functioning as dielectric and comprising metal oxide. Thereupon a fourth layer follows comprising nitride, preferably TiN.sub.x (x is equal to or greater than 1, preferably x=1.05). A fifth layer follows functioning as dielectric comprising metal oxide. On a backside of the substrate a TiN.sub.x -layer (x.gtoreq.1, preferably x=1.05) is arranged.

Abstract: An apparatus for the reactive coating of a substrate 1 with an electrically insultive material, silicon dioxide SiO.sub.2, for example, comprises a power supply 10 connected to a cathode 5 which is disposed in an evacuable coating chamber 15, 15a and surrounds the magnets 7, 8, 9. This cathode electrically interacts with the target 3 which is sputtered and the sputtered particles thereof are deposited on the substrate 1. A process gas and a reactive gas, e.g. argon with oxygen, are introduced into the coating chamber 15, 15a. The apparatus comprises two electrodes 44, 5 which are electrically insulated from one another and from the sputtering chamber 25. The one electrode is a magnetron cathode 5 where the cathode base 11 and the material of the target 3 are electrically connected to each other and the other electrode functions as an anode 44 in the plasma discharge.

Abstract: An apparatus for the reactive coating of a substrate 1 with an electrically insulative material, for example silicon dioxide SiO.sub.2, comprises a power supply source 10 connected to a cathode 5 which is disposed in an evacuable coating chamber 15, 15a and surrounds the magnets 7, 8, 9. This cathode electrically interacts with the target 3 which is sputtered and the sputtered particles thereof are deposited on the substrate 1. A process gas and a reactive gas, e.g. argon with oxygen, are introduced into the coating chamber 15, 15a. The apparatus comprises two electrodes 44, 5 which are electrically insulated from one another and from the sputtering chamber 26, wherein the one electrode is a magnetron cathode 5 where the cathode base 11 and the material of the target 3 are electrically connected to each other and the other electrode functions as an anode 44 in the plasma discharge.

Abstract: An apparatus for reactively coating a substrate 1 with an electrically insulative material comprising an ac power supply connected to the cathodes 5, 5a which are disposed in an evacuable coating chamber 15, 15a. These cathodes interact electrically with the targets 3, 3a, and 3b, 3c to be to be sputtered. The apparatus has three electrodes 6, 5, 5a which are electrically separate from one another and from the sputtering chamber 26. Two electrodes are configured as magnetron cathodes 5, 5a wherein one of the cathode bases 11, 11a and the material of the targets 3, 3a, and 3b, 3c are electrically separate, and the third electrode functions as an anode 6 during the plasma discharge. For this purpose, a power supply source 10 for alternating current is connected to each of the two cathodes 5, 5a which, during a period of alternating current, function as a negative electrode and as a positive electrode. The power supply source 10 has a floating output with three terminals 12, 13, 14.