Abstract: A semiconductor circuit comprises a fuse and a photoelement. A conduction layer of the fuse at least partly shades a photosensor region of the photoelement from a light bundle falling onto the semiconductor circuit. An arrangement for electro-optical monitoring of fuses of a semiconductor circuit additionally comprises an illumination device for generating the light bundle and a measuring device connected to two of the terminal contacts of the semiconductor circuit. In a method for the electro-optical monitoring of fuses of a semiconductor circuit a measuring device is connected to two of the terminal contacts and the semiconductor circuit is illuminated with a light bundle.

Abstract: A circuit for controlling an access to an integrated memory includes a command decoder for receiving at least one external command for an access to the memory. An access controller is connected to the command decoder for receiving internal command signals, which are output by the command decoder. In the course of a memory access, the command decoder outputs a precharge command signal for precharging a row of the memory cell array of the integrated memory. A control circuit, which can determine a temperature of the memory, is designed to temporally variably influence the transmission of the precharge command signal of the command decoder to the access controller in a manner dependent on the temperature of the memory. The write recovery time tWR can be retained even for higher operating frequencies of the memory.

Abstract: A method for repairing an integrated memory having first units of memory cells and second, redundant units of memory cells for replacing first units of memory cells. The first units of memory cells are tested with regard to their functionality. In the case of a defect ascertained in one of the first units, a number of redundant units is programmed as an associated cluster for replacing one or more of the first units. In this way, a repair element is formed with a cluster size corresponding to the number of redundant units. The cluster size of respective repair elements is set in a variable manner by a redundancy circuit. As a result, in a test and repair operation, a comparatively short test time of the memory is made possible in conjunction with a yield that remains good.

Abstract: An integrated circuit includes a programming circuit (10) for generating programming signals (PS1, . . . , PS4) with a first input terminal (E1) for applying a control voltage (ES), a second input terminal (E2) for applying a reference voltage (Vref), a storage circuit (30) with programmable switches (35, . . . , 38) and output terminals (A1, . . . , A4). The programming circuit in each case generates a programming signal (PS1, . . . , PS4) when the control voltage (ES) exceeds a predefined threshold voltage formed from the reference voltage. The number of programming signals (PS1, . . . , PS4) is dependent on the magnitude of the threshold voltage exceeded by the control voltage (ES). The programming signals are used for programming the programmable switches (35, . . . , 38). The programming state of the programmable switches can be read out via the output terminals (A1, . . . , A4) of the integrated circuit.

Abstract: A semiconductor memory and a method for operating the latter in order are provided, at least in testwise fashion, to deactivate a word line segment (12) of a segmented word line not via a first line (21) otherwise used for deactivation, but rather via a second line (22) via that the word line segment (12) is otherwise activated. The second line (22) can optionally be biased with a second potential (Vpp) provided for activation or with a third potential (Vgnd). If the third potential (Vgnd) is used for at least temporarily deactivating the word line segment (12), the word line segment can be driven via a switching element (17), which couples the word line segment to the second line (22), without the complementary switching element (16) of the driver segment (20) having to be used for deactivation.

Abstract: A device for cooling memory modules can include a plurality of elements. The elements can thermal couple at least two memory modules. The device can further include a body or a plurality of contact areas bearing in a planar manner.

Abstract: An apparatus for aging a chip, comprising a first bit line connected to a first memory cell; a second bit line connected to a second memory cell; an access circuit for accessing the first memory cell via the first bit line and for accessing the second memory cell via the second bit line; a first controller for selectively connecting/disconnecting the first bit line to the access circuit and from the access circuit, respectively; a second controller for selectively connecting/disconnecting the second bit line to the access circuit and from the access circuit, respectively; a normal operating mode controller for controlling the first and second controller, wherein the normal operating mode controller is formed such to select the first controller in a normal operating mode for accessing the first memory cell, and to connect the access circuit to the first bit line, while the second controller is controlled to disconnect the access circuit from the second bit line; wherein the apparatus comprises: an aging mode c

Abstract: A semiconductor memory and a test method for testing whether word line segments (12) are floating after an activation operation or a deactivation operation is disclosed. For this purpose, the charge-reversal current (I) that occurs in the event of a word line segment (12) being subjected to charge reversal or a charge quantity (Q) which is fed to the word line (12) or conducted away from the word line segment (12) as a result of this is measured. If, upon activation or deactivation of a word line segment (12), the measured charge-reversal current (I) or the corresponding charge quantity (Q) is less than a lower limit value, it is ascertained that the relevant word line segment (12) has a defective contact terminal. In this way, high-impedance or defective contact hole fillings can thereby be identified and the associated word line segments (12) can be replaced by redundant word lines.

Abstract: An integrated semiconductor circuit includes a cell array having memory cells which can be read by word lines and bit lines. Two bit lines in each case are connected to inputs of the same signal amplifier. In order to compensate for parasitic capacitances which arise at thin sidewall insulations between the patterned word lines and adjacent bit line contacts which connect the bit lines located at a higher level to the active regions located at a deeper level, two additional word lines and dummy contacts of the bit lines are dummy contacts lead past this additional word lines. The additional parasitic capacitances produced by the dummy contacts alter the electrical potential of the respective reference bit line at the signal amplifier in the same way as the parasitic capacitances of activated bit lines, as a result of which the measured differential potential is corrected with respect to the parasitic effects.

Abstract: A circuit arrangement for setting a voltage supply for a read/write amplifier of an integrated memory has a first voltage generator circuit for generating a supply voltage for application to the read/write amplifier during an assessment and amplification operation and a second voltage generator circuit for generating a precharge voltage for precharging bit lines of the memory which are connected to the read/write amplifier. A temperature detector circuit, which is connected to the first voltage generator circuit, is used to detect a temperature of the memory and interacts with the first voltage generator circuit to set the supply voltage applied to the read/write amplifier in a manner depending on a temperature of the memory.

Abstract: An integrated semiconductor memory includes at least one word line and a number of memory cells. Each memory cell has a selection transistor coupled to the word line. A word line driver is coupled to the word line. The word line driver provides a first electrical potential or a second electrical potential to the word line such that the word line is activated by the first electrical potential and is deactivated by the second electrical potential. A passive component (e.g., a diode or a resistor) is coupled between the word line and the second electrical potential such that the word line is coupled to the second electrical potential in a high-resistance fashion through the passive component. The passive component is transmissive for a leakage current between the word line and the contact connection.

Abstract: A semiconductor product includes a first semiconductor circuit and at least one further integrated semiconductor circuit arranged together on a semiconductor substrate. The first semiconductor circuit and the at least one further semiconductor circuit are separated from one another by a frame region and each including contact connections. Interconnects cross the frame region and short-circuit a contact connection of the first semiconductor circuit with a contact connection of the at least one further semiconductor circuit.

Abstract: An integrated memory can include a memory cell array, which has word lines for the selection of memory cells, bit lines for reading out or writing data signals of the memory cells, and a sense amplifier connected to bit lines of a bit line pair at one end of the bit line pair. In an activated state during a memory access, at least one activatable isolation circuit which is switched into one of the bit line pairs can isolate a part of the bit line pair, which is more remote from the sense amplifier from the sense amplifier. As a result, the effective capacitance of the bit lines can be significantly reduced during the memory access.

Abstract: An integrated semiconductor circuit can have memory cells, which can be read by word lines and bit lines. Two mutually adjacent bit lines in each case are connected to inputs of the same signal amplifier. In order to compensate for parasitic capacitors, which arise at thin sidewall insulations between the patterned word lines and adjacent bit line contacts, additional contact structures which lead past the word lines and represent dummy contacts can be provided. The additional parasitic capacitances produced by the dummy contact alter the electrical potential of the respective reference bit line at the signal amplifier like the parasitic capacitances of activated bit lines, as a result of which the measured differential potential can be corrected with respect to the parasitic effects.

Abstract: An integrated semiconductor memory includes a DRAM memory, in which primary sense amplifiers (SA) are coupled to a bit line (BL) of a respective cell block and can be connected to a common local data line (LDQ) by means of a respective assigned CSL switch in response to a CSL signal and in which an MDQ/LDQ switch arrangement connects a main data line (MDQ) to the local data line (LDQ) of a respective cell block in response to an MDQ/LDQ switch signal. In the case of the semiconductor memory, a control input of each CSL switch is connected to an AND element, which ANDs the CSL signal with the MDQ/LDQ switch signal and thereby activates the CSL switches only in cell blocks in which a word line has been activated.

Abstract: A voltage generator arrangement supplies a largely constant output voltage with a high current driver capability. A bandgap reference circuit drives a voltage generator on the output side, if necessary via an impedance converter. The bandgap reference circuit and the impedance converter on the one hand, and the voltage generator on the other hand, are connected to different reference ground potential lines. The voltage generator on the output side is preceded by a correction circuit, which corrects for the voltage drop on that reference ground potential line to which the output-side voltage generator is connected. The voltage generator arrangement is suitable for a greater integration density.

Abstract: An integrated memory has a memory cell array having word lines and bit lines. The bit lines are organized in bit line pairs. The bit lines of the bit line pairs cross one another at a crossing location and run parallel to one another. A sense amplifier is connected to one of the bit line pairs at one end. Two precharge circuits are provided. One precharge circuit is arranged on a side of the crossing location and the other precharge circuit is arranged on a side of the crossing location. The precharge circuit facing the sense amplifier is arranged at a first distance from the crossing location and at a second distance from the sense amplifier. The RC constant of the bit lines, which is effective during the precharge operation, is reduced, so that the time period required for a precharge operation is reduced.

Abstract: A RAM memory with a shared sense amplifier structure, in which sense amplifiers are arranged in strips between two adjacent cell blocks and are configured as differential amplifiers. In an exemplary embodiment, a one of four bit line pairs of the two adjacent cell blocks can be selected for connection to a sense amplifier at any one time using respective isolation transistor pairs, in response to a connection control signal fed to the latter. A signal sent on a word line coupled to a memory cell associated with the selected bit line pair, provides access to the memory cell by the sense amplifier.

Abstract: An integrated semiconductor memory, and method for operating such a memory, in particular a DRAM memory, having local data lines (LDQT, LDQC) segmented in the column direction (Y), which local data lines can be connected by a CSL switch in response to a column select signal fed via a CSL line (CSL) running in the row direction (X) to primary sense amplifiers for transferring or accepting spread data signals to or from bit lines of the respective segment (I, II, III), LDQ switches are arranged at the interfaces between adjacent segments of the local data lines (LDQT, LDQC) for their connection to the local data lines (LDQT, LDQC) of adjacent segments (I, II, III). LDQ switches, depending on a control signal fed separately to each of said LDQ switches, are closed during a precharge phase, which takes place before each read cycle, of at least two adjacent LDQ segments.

Abstract: A voltage generator arrangement supplies a largely constant output voltage with a high current driver capability. A bandgap reference circuit is downstream from an impedance converter and downstream a voltage generator. The bandgap reference circuit and the impedance converter on the one hand and the voltage generator on the other hand are connected to different reference ground potential line. The impedance converter contains a charge pump circuit to provide increased control potential, which drives the voltage generator. The voltage generator in contrast produces a reduced output potential. The influence of any voltage drop on that reference ground potential line to which the voltage generator is connected in the output potential is thus likewise reduced.