Abstract: A manufacturing process to a bis-mesylate salt 1b of the pan-RAF inhibitor 4-amino-n-(1-((3-chloro-2-fluorophenyl)amino)-6-methylisoquinolin-5-yl)thieno[3,2-d]pyrimidine-7-carboxamide. The process features a number of efficient key reactions, including a robust and scalable Pd-catalyzed carbonylation reaction to generate thienopyrimidine 2 and a highly chemoselective Pt/V/C-catalyzed nitro group reduction to access penultimate intermediate 7. The final amide coupling of 7 and 2 was accomplished by a mild and safe protocol employing N,N,N?,N?-tetramethylchloroformamidinium hexafluorophosphate (TCFH) as the coupling reagent, to produce a 1:1 adduct of the freebase and THF. The adduct afforded compound 1b with excellent yield, purity, and form stability on a multikilogram production scale after reaction with MsOH and recrystallization. The methods are able to produce a compound having upwards of 95% purity.

Abstract: The present invention relates to novel high-value polycarbonate polyols, to processes for the production thereof, to polyisocyanate prepolymers obtainable therefrom and also polyurethane (PUR) and polyurethane urea elastomers which under particularly demanding applications show unique combinations of processing characteristics, hydrolysis and oxidation stability, mechanical and dynamic mechanical properties.

Abstract: A cooling module, composed of at least one first and one second heat exchanger, are connected in a common frame or directly to one another, it being possible for cooling air to flow through both heat exchangers. The second heat exchanger has a greater structural depth than the first heat exchanger in the flow direction of the cooling air. The first heat exchanger and the second heat exchanger have a catalytic coating and the second heat exchanger is composed of at least one first and one second partial heat exchanger which are arranged one behind the other in the flow direction of the cooling air and which are operatively connected to one another. By means of the configuration according to the invention, the largest possible catalytically active coating surface area is attained.

Abstract: A cooling module, composed of at least one first and one second heat exchanger, are connected in a common frame or directly to one another, it being possible for cooling air to flow through both heat exchangers. The second heat exchanger has a greater structural depth than the first heat exchanger in the flow direction of the cooling air. The first heat exchanger and the second heat exchanger have a catalytic coating and the second heat exchanger is composed of at least one first and one second partial heat exchanger which are arranged one behind the other in the flow direction of the cooling air and which are operatively connected to one another. By means of the configuration according to the invention, the largest possible catalytically active coating surface area is attained.

Abstract: A sensor attachment device is provided for attaching a sensor device in such a way that removal of the sensor device without damage is ruled out, whereby the sensor device has a pair of holding fingers and a pin. The sensor attachment device has a first and a second pin recess corresponding to the pin of the sensor device. The sensor attachment device has a first and a second pair of holding finger recesses corresponding to the pair of holding fingers of the sensor device, whereby the second pin recess is offset by an offset distance with respect to the first pin recess and whereby the second pair of holding finger recesses is offset by the offset distance with respect to the first pair of holding finger recesses.

Abstract: A sensor attachment device is provided for attaching a sensor device in such a way that removal of the sensor device without damage is ruled out, whereby the sensor device has a pair of holding fingers and a pin. The sensor attachment device has a first and a second pin recess corresponding to the pin of the sensor device. The sensor attachment device has a first and a second pair of holding finger recesses corresponding to the pair of holding fingers of the sensor device, whereby the second pin recess is offset by an offset distance with respect to the first pin recess and whereby the second pair of holding finger recesses is offset by the offset distance with respect to the first pair of holding finger recesses.