Abstract: The embodiments described herein relate to anodic films and methods for forming anodic films. The methods described can be used to form anodic films that have a white appearance. Methods involve positioning reflective particles on or within a substrate prior to or during an anodizing process. The reflective particles are positioned within the metal oxide of the resultant anodic film but substantially outside the pores of the anodic film. The reflective particles scatter incident light giving the resultant anodic film a white appearance.

Abstract: Embodiments are described herein in the context of housings for electronic devices. In one embodiment, a housing can make use of an outer member, which can be formed of glass. The outer member can be secured with respect to other portions of the housing for the electronic device. The output member can also be protected at its edges by a protective side member. Still further, one or more antenna can be provided at least partially internal to the protective side member. The electronic devices can be portable and in some cases handheld.

Abstract: The embodiments described herein relate to forming anodized films that have a white appearance. In some embodiments, an anodized film having pores with light diffusing pore walls created by varying the current density during an anodizing process is described. In some embodiments, an anodized film having light diffusing micro-cracks created by a laser cracking procedure is described. In some embodiments, a sputtered layer of light diffusing aluminum is provided below an anodized film. In some embodiments, light diffusing particles are infused within openings of an anodized layer.

Abstract: Embodiments are generally directed to methods and apparatuses having electronic device cover glass that includes embedded sensors. In particular, one embodiment may take the form of a device having a device housing and a cover glass coupled to the device housing. The device includes a plurality of sensors coupled to the cover glass and configured to acquire data related to stress and strain experienced by the cover glass. The plurality of sensors is embedded within the cover glass.

Abstract: The described embodiments relate generally to cosmetic surfaces and associated treatments to form cosmetic surfaces. Cosmetic surface treatments as described herein both increase durability and decrease the appearance of physical damage through implementation of an intermediate barrier layer having a first physical attribute (e.g., color of barrier layer) of a predetermined relationship with a second physical attribute of a second layer (e.g., color of a cosmetic layer). The intermediate barrier layer separates the second layer (e.g., a cosmetic or external layer) from internal material supporting both. The first physical attribute may be chosen to be of a similar appearance to the second physical attribute (e.g., matching and/or somewhat closely matching in color) such that physical damage to the cosmetic layer is made less visible.

Abstract: A patch for a device in an electronic housing including an aluminum layer having a threshold thickness, a non-conductive layer on a first side of the aluminum layer, and a radio-frequency (RF) transparent layer on a second side of the aluminum layer is provided. A method for manufacturing an antenna window including a patch as above is also provided, the method including determining a thickness of the aluminum layer adjacent to an anodized aluminum layer. A method for manufacturing an antenna window including coating an aluminum layer having a threshold thickness on a radio-frequency (RF) transparent layer to form an RF transparent laminate is also provided. A method for manufacturing an antenna window including removing a thickness of aluminum is also provided. A method for manufacturing an antenna window including disposing a mask on an aluminum substrate and anodizing the aluminum substrate to a selected thickness is also provided.

Abstract: A housing for an electronic device, including an aluminum layer enclosing a volume that includes a radio-frequency (RF) antenna is provided. The housing includes a window aligned with the RF antenna; the window including a non-conductive material filling a cavity in the aluminum layer; and a thin aluminum oxide layer adjacent to the aluminum layer and to the non-conductive material; wherein the non-conductive material and the thin aluminum oxide layer form an RF-transparent path through the window. A housing for an electronic device including an integrated RF-antenna is also provided. A method of manufacturing a housing for an electronic device as described above is provided.

Abstract: Embodiments are described herein in the context of housings for electronic devices. In one embodiment, a housing can make use of an outer member, which can be formed of glass. The outer member can be secured with respect to other portions of the housing for the electronic device. The output member can also be protected at its edges by a protective side member. Still further, one or more antenna can be provided at least partially internal to the protective side member. The electronic devices can be portable and in some cases handheld.

Abstract: Methods and apparatus for forming a housing, such as for an electronic device, from multi-layer materials are disclosed. The multi-layer materials include at least two layers. Typically, one or more of the layers are metal. However, different layers of the multi-layer materials can be different metals. In one embodiment, an inner layer of the multi-layer materials can be provided with or form internal features that can be for attaching parts or components to the multi-layer materials. In another embodiment, processing of an inner layer of the multi-layer materials can facilitate part formation with increased curvature and/or internal part clearance. In another embodiment, the multi-layer materials can include an intermediate layer that facilitates creation of internal features that can be for attaching parts or components to the multi-layer materials.

Abstract: This is directed to several handheld device components to be placed in a handheld device, as well as methods or systems for mounting or retaining components within the device. In particular, this is directed to a rigid shield used in an SMT process and securing connected flex connectors by adhering the flexes together. This is also directed to using foam in combination with a hard material to create an acoustic seal, or several layers of foam to create an acoustic and mechanical seal. This is also directed to selectively folding a sheet of material placed around a battery cell.

Abstract: This is directed to several handheld device components to be placed in a handheld device, as well as methods or systems for mounting or retaining components within the device. In particular, this is directed to a rigid shield used in an SMT process and securing connected flex connectors by adhering the flexes together. This is also directed to using foam in combination with a hard material to create an acoustic seal, or several layers of foam to create an acoustic and mechanical seal. This is also directed to selectively folding a sheet of material placed around a battery cell.

Abstract: The embodiments described herein relate to forming anodized films that have a white appearance. In some embodiments, an anodized film having pores with light diffusing pore walls created by varying the current density during an anodizing process is described. In some embodiments, an anodized film having light diffusing micro-cracks created by a laser cracking procedure is described. In some embodiments, a sputtered layer of light diffusing aluminum is provided below an anodized film. In some embodiments, light diffusing particles are infused within openings of an anodized layer.

Abstract: Systems and methods for cutting a cover from a portion of a housing of an electronic device, and positioning the cover within the housing are provided. An electronic device can include an interface having an actuator over which a cover is placed. The cover can be constructed by cutting away a portion of a housing of the electronic device. To improve the aesthetic appeal of the device, the orientation of the cover can be maintained while and after it is cut away from the housing by a fixture used for the cutting process. An adhesive sheet can be placed over the housing and the cover to ensure that the cover remains stationary relative to the housing once it is separated from the housing.

Abstract: Attachment mechanisms that may be employed to attach accessory devices to electronic devices are provided. The attachment mechanism may include a displaceable post that is moveable between deployed and stored configurations. In the deployed configuration an accessory may be attached to the displaceable post, whereas in the stored configuration the displaceable post may be at least partially inaccessible. Movement of the displaceable post may be controlled by cam surfaces, a spring, and a follower. The spring may be conical and configured to fold flat to reduce the height of the attachment mechanism.

Abstract: Techniques for attachment of sapphire substrates with other materials and the resulting structures are provided. One embodiment may take the form of an attachment method including creating an aperture within a sapphire substrate and filling the aperture with an attachment material. The method also includes mechanically coupling a member to the sapphire substrate using the attachment material.

Abstract: Embodiments are generally directed to methods and apparatuses having electronic device cover glass that includes embedded sensors. In particular, one embodiment may take the form of a device having a device housing and a cover glass coupled to the device housing. The device includes a plurality of sensors coupled to the cover glass and configured to acquire data related to stress and strain experienced by the cover glass. The plurality of sensors is embedded within the cover glass.

Abstract: An electronic device including a processor, at least one sensor in communication with the processor, wherein the processor is configured to determine an orientation of the device and drop event based on input from the at least one sensor. The electronic device further includes a motor in communication with the processor and a mass operably connected to the motor. The processor is configured to drive the motor when a drop event is determined and the mass is configured to rotate with respect to the motor to alter the orientation of the device.

Abstract: A buckling shock mounting and method related thereto are discussed herein. In one embodiment, the buckling shock mounting may take the form of a plurality of panels oriented uprightly within a plane to form at least one geometric shape. The plurality of panels are made of a uniform material and each of the panels is configured to buckle when a threshold amount of force is applied perpendicularly to the plane.

Abstract: Embodiments are described herein in the context of housings for electronic devices. In one embodiment, a housing can make use of an outer member, which can be formed of glass. The outer member can be secured with respect to other portions of the housing for the electronic device. The output member can also be protected at its edges by a protective side member. Still further, one or more antenna can be provided at least partially internal to the protective side member. The electronic devices can be portable and in some cases handheld.

Abstract: An electronic device having a housing structure that is configured to receive at least one glass cover is disclosed. The glass cover serves to cover a display assembly provided within the electronic device. The glass cover can be secured to the housing structure so as to facilitate providing a narrow border between an active display area and an outer edge of the housing structure. The enclosure for the electronic device can be thin yet be sufficiently strong to be suitable for use in electronic devices, such as portable electronic devices.