Abstract: The disclosure is generally directed to abrasive rotary tools capable of expanding into a substrate. Exemplary abrasive rotary tools include an expandable collet configured to expand an abrasive surface of the abrasive rotary tool. The expandable collet may be positioned proximate to a multi-planar edge of a substrate, such as a hole, and expanded into the edge to more fully and/or evenly contact the edge of the substrate. In this way, an abrasive rotary tool may more quickly and/or consistently abrade the edge.

Abstract: The disclosure is generally directed to a method of manufacturing an abrasive rotary tool using a molded elastic layer. A mold includes a cavity with a peripheral surface. An abrasive sheet is positioned so that a working surface of the abrasive sheet is positioned along at least a portion of the peripheral surface. A spindle is positioned within the mold to create a region between the spindle and the abrasive sheet. An elastomeric precursor material is injected into the region and solidified to form an elastic layer. As a result, the elastic layer is in direct contact with at least a portion of the opposed surface of the abrasive sheet and at least a portion of the exterior surface of the spindle. In this way, an abrasive rotary tool may be manufactured without using adhesive layers and/or fastening means.

Abstract: The present disclosure provides abrasive articles that include an abrasive layer having a contact surface, a first layer coupled to the abrasive layer, and a second layer coupled to the first layer. The first layer is configured to provide contact pressure to the abrasive layer, such as through a higher hardness than the second layer. The second layer is configured to provide conformability to the abrasive layer, such as through a higher compressibility than the first layer. The resulting abrasive articles may exert a consistent contact pressure against a substrate with increased conformability around the substrate, reduced hysteresis, improved removal rate consistency, and/or improved lifetime over abrasive articles that do not use the multiple layer construction described above.

Abstract: Polishing pads containing a phase-separated polymer blend, and methods of making and using such pads in a polishing process. In one exemplary embodiment, the polishing pads include a multiplicity of polishing elements integrally formed in a sheet. In another exemplary embodiment, the polishing elements are bonded to a support layer, for example by thermal bonding. In certain embodiments, the polishing pad may additionally include a compliant layer affixed to the support layer, and optionally, a polishing composition distribution layer.

Abstract: A structured abrasive article is provided that has a backing having first and second opposed major surfaces and a structured abrasive layer disposed on and secured to the first major surface of the backing. The structured abrasive layer includes a polymeric binder, abrasive particles dispersed in the binder and an additive dispersed in the binder. The additive provides improved chemical mechanical planarization (CMP) polish performance, including high oxide/nitride selectively, high removal rates, lower nitride loss and improved with-in-wafer non-uniformity (WIWNU).

Abstract: Polishing pads containing a phase-separated polymer blend, and methods of making and using such pads in a polishing process. In one exemplary embodiment, the polishing pads include a multiplicity of polishing elements integrally formed in a sheet. In another exemplary embodiment, the polishing elements are bonded to a support layer, for example by thermal bonding. In certain embodiments, the polishing pad may additionally include a compliant layer affixed to the support layer, and optionally, a polishing composition distribution layer.

Abstract: Improved methods of rinsing and drying microelectronic devices by way of an immersion processing apparatus are provided for effectively cleaning microelectronic devices. Methods and arrangements control the separation of one or more microelectronic devices from a liquid environment as part of a replacement of the liquid environment with a gas environment. Cleaning enhancement substance, such as IPA, is introduced into the gas environment according to a controlled profile while the separation step is conducted. The controlled profile being directed to the timing of introduction of cleaning enhancement substance, the concentration of cleaning enhancement substance and/or flow rates thereof into the vessel. Controlled timing of gas and cleaning enhancement substance delivery can also improve effectiveness of separation.