Patents by Inventor Stephen C. Stoker

Stephen C. Stoker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8033643
    Abstract: A recyclable continuous ink jet print head is provided that includes a manifold formed from a metal such as stainless steel, a die having ink jet nozzles formed from a ceramic material such as silicon, a control circuit connected to the die via microwiring, and an interposing member disposed between the manifold and the die. The interposing member is formed from a composite material such as Al—SiC having a coefficient of thermal conductivity that is higher than that of the silicon die, and a coefficient of thermal expansion (CTE) that is between that of the die and the manifold. During manufacture, the CTE value of the interposing member allows long-lasting, heat-cured epoxy compositions to be used to bond the die to the manifold and to encapsulate the microwiring between the die and a control circuit with while maintaining proper alignment of the die ink jet nozzles on the manifold.
    Type: Grant
    Filed: May 15, 2009
    Date of Patent: October 11, 2011
    Assignee: Eastman Kodak Company
    Inventors: Samuel Chen, Stephen C. Stoker, Giana M. Phelan
  • Publication number: 20100289853
    Abstract: A recyclable continuous ink jet print head is provided that includes a manifold formed from a metal such as stainless steel, a die having ink jet nozzles formed from a ceramic material such as silicon, a control circuit connected to the die via microwiring, and an interposing member disposed between the manifold and the die. The interposing member is formed from a composite material such as Al—SiC having a coefficient of thermal conductivity that is higher than that of the silicon die, and a coefficient of thermal expansion (CTE) that is between that of the die and the manifold. During manufacture, the CTE value of the interposing member allows long-lasting, heat-cured epoxy compositions to be used to bond the die to the manifold and to encapsulate the microwiring between the die and a control circuit with while maintaining proper alignment of the die ink jet nozzles on the manifold.
    Type: Application
    Filed: May 15, 2009
    Publication date: November 18, 2010
    Inventors: Samuel Chen, Stephen C. Stoker, Giana M. Phelan
  • Patent number: 6548236
    Abstract: The present invention is directed to a photothermographic element comprising silver halide, a blocked developer, a coupler, and core/shell particles, each such particle comprising a mixture of at least two non-photosensitive organic silver salts, which particle comprises a center portion comprising a non-photosensitive first organic silver salt and at least one shell portion covering the center portion, the shell comprising a non-photosensitive second organic silver salt. The organic silver salt in the shell has a higher pKsp relative to the organic silver salt in the core. This invention also provides a composition comprising core/shell non-photosensitive organic silver salt particles, and a method of making the particles.
    Type: Grant
    Filed: November 21, 2001
    Date of Patent: April 15, 2003
    Assignee: Eastman Kodak Company
    Inventors: Mark E. Irving, David H. Levy, JoAnn D. Hanna, Stephen Swingley, Donald L. Black, Stephen C. Stoker