Abstract: An apparatus for retaining a pacifier within reach of a mouth of a child is disclosed. The apparatus includes a cord connected at both ends to a garment, wherein a first end of the cord is detachably coupled to the garment so as to allow the insertion of the cord into a pacifier ring when the first end of the cord is detached from the garment. The cord may be positioned horizontally across a chest area of the child's garment, such that a midpoint of the cord is located substantially on a midpoint of the garment. Further, the cord may be an elastic cord covered in an inelastic fabric. Also, the first end of the cord may be a piece of hook and loop fabric for coupling with a hook and loop fabric on the garment.

Abstract: An apparatus for retaining a pacifier within reach of a mouth of a child is disclosed. The apparatus includes a cord connected at both ends to a garment, wherein a first end of the cord is detachably coupled to the garment so as to allow the insertion of the cord into a pacifier ring when the first end of the cord is detached from the garment. The cord may be positioned horizontally across a chest area of the child's garment, such that a midpoint of the cord is located substantially on a midpoint of the garment. Further, the cord may be an elastic cord covered in an inelastic fabric. Also, the first end of the cord may be a piece of hook and loop fabric for coupling with a hook and loop fabric on the garment.

Abstract: A heat sink retention module for an electronic device includes a base comprising mounting lugs configured to be mounted to a circuit board, and frame elements extending between the mounting lugs to define at least one keep out area interior to the frame elements and at least one keep out area exterior to the frame elements. The frame elements include at least one frame element extending at an oblique angle to another of the frame elements, and heat sink retention posts extend vertically upward from the frame elements.

Abstract: Resilient electrical interconnects are provided which have a non-uniform cross section which achieves an increased range of deflection and a predetermined relationship between compression force and deflection of the interconnect, and between resistance and deflection of the interconnect. A smaller cross sectional area decreases the spring rate, or compression force, of the interconnect during compression. Increased range of deflection and reduced spring rate enables improved compensation for surface irregularities and facilitates mounting of integrated circuit or other devices having large arrays of interconnects. The non-uniform cross section is provided by a single or compound slope, or alternatively a nonlinear curve, from the end of smaller cross-section to the end of larger cross-section.

Abstract: A socket for a BGA package is provided which is of relatively simple construction and which provides reliable and efficient interconnection of a BGA package and a printed circuit board. The socket comprises a contact assembly having an array of resilient conductive columns having respective contact ends, the columns being mounted on a thin insulative sheet. The contact assembly is supported on a frame of insulating material and which has alignment posts for alignment of the contact assembly to the frame and for alignment of the frame and mounted contact assembly to an associated circuit board. The frame also includes latch elements for retaining the contact assembly on the frame. The socket is mounted onto a printed circuit board which has an array of contact areas corresponding to the array of resilient contacts of the socket.