Abstract: A power panel for an electrical system includes a chassis having chassis slots for power modules, a bus body coupled to the chassis to connect the power panel to a power source, and first and second module connectors. The first and second module connectors are fixed relative to the bus body to connect the power modules to the bus body. The second module connector is movable relative to the first module connector to accommodate position of the power modules in the chassis slots. Electrical cabinets, power panels, and methods of seating power modules in power panels are also described.

Abstract: A high power module interface system, can include a blade contact configured to be mounted to a circuit board and a mounting fork having a conductive body including a first fork extension and a second fork extension defining a power interface feature opening therebetween. The mounting fork can be configured to provide electrical connection between the conductive body and the blade contact when the blade contact is positioned within the power interface opening.

Abstract: A semiconductor package includes a plurality of semiconductor devices disposed in an array surrounding a central electrode structure carried by a package support member. The package is capable of withstanding high voltages and currents and includes a heat exchanger integral therewith.

Abstract: A power semiconductor assembly, particularly a semiconductor switch assembly which has a number of discrete emitter connection pads, comprised of a metal matrix composite housing and a copper or aluminum post with a cross-sectional area sufficiently large to carry the rated current providing a single-point, external connection to all emitter pads. The post passes through and is supported by an insulating ceramic insert such as aluminum oxide in the wall of the metal matrix composite housing. The post is hollowed out in the region where it passes through the ceramic insert in order to reduce the mechanical stress between the post and the insulating insert as a result of the mismatch in their thermal expansion coefficients. Buses on either side of the semiconductor die provide surfaces for connection from the post to the discrete emitter connection pads on the die.

Abstract: A package for a high power electrical component includes a base and a plate disposed on a support surface of the base and having an electrically insulative layer and an outer layer having a conductive portion thereon. An electrically conductive pad is disposed on the electrically conductive portion of the plate and the electrical component is disposed on the pad. A cover is disposed atop the base and encloses the plate, the pad and the electrical component. First and second electrically conductive terminals extend through apertures in the cover and are electrically coupled to the electrodes of the electrical component. The cover is hermetically sealed to the base and to the first and second terminals. The coefficient of thermal expansion of the base and cover are substantially equal to minimize stresses developed therein.