Patents by Inventor Stephen F. Heng
Stephen F. Heng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10389053Abstract: Various apparatus and methods of electrically connecting a packaged integrated circuit to a circuit board are disclosed. In one aspect, an apparatus includes a first frame to be mounted on the circuit board and having a first end. An insulating housing is adapted to be mounted on the circuit board and positioned in the first frame. A second frame is pivotally coupled to the first frame. The second frame includes two spaced-apart rail members and a cross member coupled to and between the rail members opposite the first end of the second frame. The rail members are operable to receive the packaged integrated circuit. The second frame has at least one engagement member to engage a first portion of the insulating housing when the second frame is pivoted toward the insulating housing. A third frame is pivotally coupled to the first frame to apply force to the packaged integrated circuit.Type: GrantFiled: September 23, 2016Date of Patent: August 20, 2019Assignee: Advanced Micro Devices, Inc.Inventors: Stephen F. Heng, Mahesh S. Hardikar, Sanjay Dandia
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Publication number: 20170104286Abstract: Various apparatus and methods of electrically connecting a packaged integrated circuit to a circuit board are disclosed. In one aspect, an apparatus includes a first frame to be mounted on the circuit board and having a first end. An insulating housing is adapted to be mounted on the circuit board and positioned in the first frame. A second frame is pivotally coupled to the first frame. The second frame includes two spaced-apart rail members and a cross member coupled to and between the rail members opposite the first end of the second frame. The rail members are operable to receive the packaged integrated circuit. The second frame has at least one engagement member to engage a first portion of the insulating housing when the second frame is pivoted toward the insulating housing. A third frame is pivotally coupled to the first frame to apply force to the packaged integrated circuit.Type: ApplicationFiled: September 23, 2016Publication date: April 13, 2017Inventors: Stephen F. Heng, Mahesh S. Hardikar, Sanjay Dandia
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Patent number: 9466900Abstract: Various apparatus and methods of electrically connecting a packaged integrated circuit to a circuit board are disclosed. In one aspect, an apparatus includes a first frame to be mounted on the circuit board and having a first end. An insulating housing is adapted to be mounted on the circuit board and positioned in the first frame. A second frame is pivotally coupled to the first frame. The second frame includes two spaced-apart rail members and a cross member coupled to and between the rail members opposite the first end of the second frame. The rail members are operable to receive the packaged integrated circuit. The second frame has at least one engagement member to engage a first portion of the insulating housing when the second frame is pivoted toward the insulating housing. A third frame is pivotally coupled to the first frame to apply force to the packaged integrated circuit.Type: GrantFiled: October 7, 2015Date of Patent: October 11, 2016Assignee: Advanced Micro Devices, Inc.Inventors: Stephen F. Heng, Mahesh S. Hardikar, Sanjay Dandia
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Patent number: 8938876Abstract: Various circuit board sockets and methods of manufacturing and using the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a socket that is operable to receive a circuit board. The socket includes a surface for seating a first portion of a circuit board, a floor and a first support structure projecting away from the floor to support a second portion of the circuit board. The support structure includes a plurality of nested frames. In another aspect, a socket with a with socket cover coupled to a socket housing is disclosed. The socket housing includes a support structure to support a portion of the socket cover.Type: GrantFiled: December 6, 2011Date of Patent: January 27, 2015Assignee: Advanced Micro Devices, Inc.Inventors: Stephen F. Heng, Mahesh S. Hardikar
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Publication number: 20140043768Abstract: The present invention provides embodiments of a package retention frame. One embodiment of the package retention frame is configured for deployment adjacent a top surface of an integrated circuit package. A grid of contacts is on a bottom surface of the integrated circuit package. The package retention frame when deployed substantially maintains alignment of the grid of contacts with a grid of pins in a socket. An outer boundary of the package retention frame is substantially encompassed by an outer boundary of the socket.Type: ApplicationFiled: August 9, 2012Publication date: February 13, 2014Applicant: Advanced Micro Devices, Inc.Inventors: Mahesh Hardikar, Stephen F. Heng
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Patent number: 8425246Abstract: Various circuit board sockets and methods of manufacturing and using the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a socket operable to receive a first circuit board. The socket includes a housing and a cover slidedly coupled to the housing. The cover has an opening sized to enable the first circuit board to seat on the housing.Type: GrantFiled: December 1, 2011Date of Patent: April 23, 2013Assignee: Advanced Micro Devices, Inc.Inventor: Stephen F. Heng
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Patent number: 8216887Abstract: Various semiconductor chip packages and methods of assembling and making the same are disclosed. In one aspect, a method of manufacturing is provided that includes coupling a stiffener frame to a first side of a substrate. The stiffener frame has a central opening to accommodate a semiconductor chip and an outer edge surface. A semiconductor chip is coupled to the first side in the opening. A lid is coupled to the stiffener frame with an adhesive. The lid has a first edge surface set back from the outer edge surface of the stiffener frame. The adhesive is set back from the outer edge surface of the stiffener frame.Type: GrantFiled: May 4, 2009Date of Patent: July 10, 2012Assignee: Advanced Micro Devices, Inc.Inventors: Stephen F. Heng, Sanjay Dandia, Chia-Ken Leong
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Publication number: 20120083169Abstract: Various circuit board sockets and methods of manufacturing and using the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a socket that is operable to receive a circuit board. The socket includes a surface for seating a first portion of a circuit board, a floor and a first support structure projecting away from the floor to support a second portion of the circuit board. The support structure includes a plurality of nested frames. In another aspect, a socket with a with socket cover coupled to a socket housing is disclosed. The socket housing includes a support structure to support a portion of the socket cover.Type: ApplicationFiled: December 6, 2011Publication date: April 5, 2012Inventors: Stephen F. Heng, Mahesh S. Hardikar
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Publication number: 20100276799Abstract: Various semiconductor chip packages and methods of assembling and making the same are disclosed. In one aspect, a method of manufacturing is provided that includes coupling a stiffener frame to a first side of a substrate. The stiffener frame has a central opening to accommodate a semiconductor chip and an outer edge surface. A semiconductor chip is coupled to the first side in the opening. A lid is coupled to the stiffener frame with an adhesive. The lid has a first edge surface set back from the outer edge surface of the stiffener frame. The adhesive is set back from the outer edge surface of the stiffener frame.Type: ApplicationFiled: May 4, 2009Publication date: November 4, 2010Inventors: Stephen F. Heng, Sanjay Dandia, Chia-Ken Leong