Patents by Inventor Stephen H. Meisner

Stephen H. Meisner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for directly joining a chip to a heat sink
    Patent number: 5533256
    Abstract: The present invention relates generally to a new apparatus and method for directly joining a chip to a heat sink. More particularly, the invention encompasses an apparatus and a method that uses a double-sided, pressure-sensitive, thermally-conductive adhesive tape to directly join a chip or similar such device to a heat sink.
    Type: Grant
    Filed: June 5, 1995
    Date of Patent: July 9, 1996
    Assignee: International Business Machines Corporation
    Inventors: Anson J. Call, Stephen H. Meisner, Frank L. Pompeo, Jeffrey A. Zitz
  • Method for forming chip carrier with a single protective encapsulant
    Patent number: 5471027
    Abstract: The present invention relates generally to a new apparatus and method for a chip carrier. More particularly, the invention encompasses an apparatus and a method that uses a chip carrier having a single encapsulant to provide both flip chip fatigue life enhancement and environmental protection. A double-sided, pressure-sensitive, thermally-conductive adhesive tape could also be used with the encapsulated chip to directly attach the chip to a heat sink. Similarly, also disclosed is a method and apparatus for directly joining a heat sink to the chip carrier.
    Type: Grant
    Filed: July 22, 1994
    Date of Patent: November 28, 1995
    Assignee: International Business Machines Corporation
    Inventors: Anson J. Call, Stephen H. Meisner, Frank L. Pompeo, Jeffrey A. Zitz