Patents by Inventor Stephen J. Gschwend

Stephen J. Gschwend has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for solder bumping of printed circuit boards
    Patent number: 4752027
    Abstract: A method and apparatus for preparing printed circuit boards having flattened solder bumps for the mounting of surface mount components is provided. Using well-known techniques, solder paste is screen-printed onto printed circuit boards and reflowed and cleaned to form discrete solder bumps. Using roller machines, the peaks of the solder bumps are flattened and adhesive solder flux is applied to the flattened tops of the solder bumps. The adhesive solder flux holds the surface mount components in position after placement and during vapor phase reflow.
    Type: Grant
    Filed: February 20, 1987
    Date of Patent: June 21, 1988
    Assignee: Hewlett-Packard Company
    Inventor: Stephen J. Gschwend