Abstract: A cooling system includes an evaporator assembly configured to thermally contact one or more memory modules and absorb thermal energy from the one or more memory modules. A condenser assembly is thermally coupled to the evaporative assembly and configured to receive and dissipate at least a portion of the thermal energy absorbed by the evaporative assembly.

Abstract: A cooling system having a enclosure, a plurality of disk drives stored in the enclosure, a first portion of the disk drives having housings with a first form factor and a second portion of the disk drives having housings with a second form factor smaller than the first form factor, and an air baffle system for directing a flow of air internal the enclosure over portions of the housing of the second portion of the disk drives while at the same time creating a wall to maintain the flow of air over neighboring ones of the first portion of the disk drives (the external flow).

Abstract: This invention is a support carrier for attaching a smaller format disk drive into a chassis bay sized for receiving a larger disk drive, the support carrier includes a heat-sink surface with pin fins for conducting and removing heat from the smaller disk drive.