Patents by Inventor Stephen J. Pereira
Stephen J. Pereira has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10741901Abstract: An apparatus includes a stacked patch radiator having (i) a lower patch and (ii) an upper patch located above and separated from the lower patch. The upper patch includes first and second conductive patches that are separated from one another. The apparatus also includes a heating circuit integrated in the stacked patch radiator. At least a portion of the heating circuit is positioned between the first and second conductive patches of the upper patch. The stacked patch radiator can be configured to radiate at a specified frequency band and can have a thickness that is less than one tenth of wavelengths within the specified frequency band. The upper patch can include conductive vias electrically connecting the conductive patches. The conductive patches and the conductive vias can form an isolation cage configured to reduce a signal loss associated with a presence of at least the portion of the heating circuit between the conductive patches.Type: GrantFiled: October 17, 2017Date of Patent: August 11, 2020Assignee: Raytheon CompanyInventors: Yueh-Chi Chang, Brandon K.W. Mui, Stephen J. Pereira, Richard S. Young, Gregory M. Fagerlund, Wayne B. Mattis
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Publication number: 20190115645Abstract: An apparatus includes a stacked patch radiator having (i) a lower patch and (ii) an upper patch located above and separated from the lower patch. The upper patch includes first and second conductive patches that are separated from one another. The apparatus also includes a heating circuit integrated in the stacked patch radiator. At least a portion of the heating circuit is positioned between the first and second conductive patches of the upper patch. The stacked patch radiator can be configured to radiate at a specified frequency band and can have a thickness that is less than one tenth of wavelengths within the specified frequency band. The upper patch can include conductive vias electrically connecting the conductive patches. The conductive patches and the conductive vias can form an isolation cage configured to reduce a signal loss associated with a presence of at least the portion of the heating circuit between the conductive patches.Type: ApplicationFiled: October 17, 2017Publication date: April 18, 2019Inventors: Yueh-Chi Chang, Brandon K. W. Mui, Stephen J. Pereira, Richard S. Young, Gregory M. Fagerlund, Wayne B. Mattis
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Patent number: 8451165Abstract: Described is a mobile radar system which provides both persistent surveillance and tracking of objects with adaptive measurement rates for both maneuvering and non-maneuvering objects. The mobile radar system includes a vehicle having mounted therein an active, electronically-steerable, phased array radar system movable between a stowed position and a deployed position and wherein the phased array radar system is operational in both the deployed and stored positions and also while the vehicle is either stationary or moving. Thus, the mobile radar system described herein provides for longer time on target and longer integration times, increased radar sensitivity and improved Doppler resolution and clutter rejection. This results in a highly mobile radar system appropriate for use in a battlefield environment and which supports single-integrated-air-picture metrics including but not limited to track purity, track completeness, and track continuity and thus improved radar performance in a battlefield.Type: GrantFiled: December 6, 2010Date of Patent: May 28, 2013Assignee: Raytheon CompanyInventors: Angelo M. Puzella, Steven T. Cummings, Joseph A. Licciardello, Jerome H. Pozgay, Stephen J. Pereira, Michael G. Sarcione, Peter D. Morico, James A. Roche, Jr.
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Publication number: 20120139786Abstract: Described is a mobile radar system which provides both persistent surveillance and tracking of objects with adaptive measurement rates for both maneuvering and non-maneuvering objects. The mobile radar system includes a vehicle having mounted therein an active, electronically-steerable, phased array radar system movable between a stowed position and a deployed position and wherein the phased array radar system is operational in both the deployed and stored positions and also while the vehicle is either stationary or moving. Thus, the mobile radar system described herein provides for longer time on target and longer integration times, increased radar sensitivity and improved Doppler resolution and clutter rejection. This results in a highly mobile radar system appropriate for use in a battlefield environment and which supports single-integrated-air-picture metrics including but not limited to track purity, track completeness, and track continuity and thus improved radar performance in a battlefield.Type: ApplicationFiled: December 6, 2010Publication date: June 7, 2012Applicant: Raytheon CompanyInventors: Angelo M. Puzella, Steven T. Cummings, Joseph A. Licciardello, Jerome H. Pozgay, Stephen J. Pereira, Michael G. Sarcione, Peter D. Morico, James A. Roche, JR.
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Patent number: 8174024Abstract: In one aspect, a device includes a gallium nitride (GaN) layer, a first diamond layer disposed on the GaN layer, a gate structure disposed in contact with the GaN layer and the first diamond layer, and a second diamond layer having a first thermal conductivity and disposed on a second surface of the GaN layer. The gate and the first diamond layer are disposed on a first surface of the GaN layer opposite the second surface of the GaN layer.Type: GrantFiled: June 10, 2011Date of Patent: May 8, 2012Assignee: Raytheon CompanyInventors: Ralph Korenstein, Steven D. Bernstein, Stephen J. Pereira
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Publication number: 20110241018Abstract: In one aspect, a method includes fabricating a device. The device includes a gallium nitride (GaN) layer, a diamond layer disposed on the GaN layer and a gate structure disposed in contact with the GaN layer and the diamond layer. In another aspect, a device includes a gallium nitride (GaN) layer, a diamond layer disposed on the GaN layer and a gate structure disposed in contact with the GaN layer and the diamond layer.Type: ApplicationFiled: June 10, 2011Publication date: October 6, 2011Applicant: Raytheon CompanyInventors: Ralph Korenstein, Steven D. Bernstein, Stephen J. Pereira
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Patent number: 7989261Abstract: In one aspect, a method includes fabricating a device. The device includes a gallium nitride (GaN) layer, a diamond layer disposed on the GaN layer and a gate structure disposed in contact with the GaN layer and the diamond layer. In another aspect, a device includes a gallium nitride (GaN) layer, a diamond layer disposed on the GaN layer and a gate structure disposed in contact with the GaN layer and the diamond layer.Type: GrantFiled: December 22, 2008Date of Patent: August 2, 2011Assignee: Raytheon CompanyInventors: Ralph Korenstein, Steven D. Bernstein, Stephen J. Pereira
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Patent number: 7898365Abstract: An integrated SAW device features an electronic assembly, a SAW device mounted to the electronic assembly, and a heater element on the SAW device to minimize thermal resistance between the SAW device and the heater element.Type: GrantFiled: September 6, 2006Date of Patent: March 1, 2011Assignee: Raytheon CompanyInventors: Mark A. Koehnke, Stephen J. Pereira
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Patent number: 7888171Abstract: In one aspect, a method includes fabricating a gallium nitride (GaN) layer with a first diamond layer having a first thermal conductivity and a second diamond layer having a second thermal conductivity greater than the first thermal conductivity. The fabricating includes using a microwave plasma chemical vapor deposition (CVD) process to deposit the second diamond layer onto the first diamond layer.Type: GrantFiled: December 22, 2008Date of Patent: February 15, 2011Assignee: Raytheon CompanyInventors: Ralph Korenstein, Steven D. Bernstein, Stephen J. Pereira
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Patent number: 7884373Abstract: In one aspect, a method includes fabricating a gallium nitride (GaN) layer with a first diamond layer having a first thermal conductivity and a second diamond layer having a second thermal conductivity greater than the first thermal conductivity. The fabricating includes using a microwave plasma chemical vapor deposition (CVD) process to deposit the second diamond layer onto the first diamond layer.Type: GrantFiled: April 2, 2010Date of Patent: February 8, 2011Assignee: Raytheon CompanyInventors: Ralph Korenstein, Steven D. Bernstein, Stephen J. Pereira
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Patent number: 7859835Abstract: A thermal management system includes an air duct assembly comprising a supply air duct having an air inlet opening, a return air duct having an air exit opening and a plurality of distribution air ducts configured to be in fluid communication with the air inlet opening of the supply air duct and with the air exit opening of the return air duct. A fan is disposed within the air duct assembly to direct air from the air inlet opening of the supply air duct through the supply air duct and out the air exit opening of the return air duct. The fan and supply duct are disposed to direct air over a first surface of a heat sink. A second opposing surface of the heat sink is disposed over and configured to be in thermal contact with a plurality of active circuits disposed on a first surface of a radio frequency (RF) multi-layer printing wiring board (PWB).Type: GrantFiled: June 10, 2009Date of Patent: December 28, 2010Assignee: Allegro Microsystems, Inc.Inventors: Angelo M. Puzella, Joseph A. Licciardello, Stephen J. Pereira, Joseph R. Ellsworth
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Publication number: 20100245179Abstract: A thermal management system includes an air duct assembly comprising a supply air duct having an air inlet opening, a return air duct having an air exit opening and a plurality of distribution air ducts configured to be in fluid communication with the air inlet opening of the supply air duct and with the air exit opening of the return air duct. A fan is disposed within the air duct assembly to direct air from the air inlet opening of the supply air duct through the supply air duct and out the air exit opening of the return air duct. The fan and supply duct are disposed to direct air over a first surface of a heat sink. A second opposing surface of the heat sink is disposed over and configured to be in thermal contact with a plurality of active circuits disposed on a first surface of a radio frequency (RF) multi-layer printing wiring board (PWB).Type: ApplicationFiled: June 10, 2009Publication date: September 30, 2010Applicant: Raytheon CompanyInventors: Angelo M. Puzella, Joseph A. Licciardello, Stephen J. Pereira, Joseph R. Ellsworth
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Publication number: 20100187544Abstract: In one aspect, a method includes fabricating a gallium nitride (GaN) layer with a first diamond layer having a first thermal conductivity and a second diamond layer having a second thermal conductivity greater than the first thermal conductivity. The fabricating includes using a microwave plasma chemical vapor deposition (CVD) process to deposit the second diamond layer onto the first diamond layer.Type: ApplicationFiled: April 2, 2010Publication date: July 29, 2010Applicant: Raytheon CompanyInventors: Ralph Korenstein, Steven D. Bernstein, Stephen J. Pereira
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Publication number: 20100155900Abstract: In one aspect, a method includes fabricating a device. The device includes a gallium nitride (GaN) layer, a diamond layer disposed on the GaN layer and a gate structure disposed in contact with the GaN layer and the diamond layer. In another aspect, a device includes a gallium nitride (GaN) layer, a diamond layer disposed on the GaN layer and a gate structure disposed in contact with the GaN layer and the diamond layer.Type: ApplicationFiled: December 22, 2008Publication date: June 24, 2010Inventors: Ralph Korenstein, Steven D. Bernstein, Stephen J. Pereira
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Publication number: 20100155901Abstract: In one aspect, a method includes fabricating a gallium nitride (GaN) layer with a first diamond layer having a first thermal conductivity and a second diamond layer having a second thermal conductivity greater than the first thermal conductivity. The fabricating includes using a microwave plasma chemical vapor deposition (CVD) process to deposit the second diamond layer onto the first diamond layer.Type: ApplicationFiled: December 22, 2008Publication date: June 24, 2010Inventors: Ralph Korenstein, Steven D. Bernstein, Stephen J. Pereira
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Patent number: 7742307Abstract: A printed circuit board (PCB) assembly is provided. The PCB assembly is adapted for mounting at least one heat-generating electrical device and providing integrated heat dissipating capability to dissipate heat generated by the electrical device. The PCB assembly has a top surface and a bottom surface and comprises a signal carrying layer and an insert of pyrolytic graphite (PG). The signal carrying layer, disposed between the top surface and the bottom surface, comprises a material that is both thermally conductive and electrically conductive (such as at least one of aluminum, copper, and silver and alloys thereof) and has at least a portion lying in a first plane. The insert of PG is disposed within at least a portion of the first plane of the signal carrying layer, is in thermal contact with the signal carrying layer, and is constructed and arranged to have its greatest electrical conductivity in the first plane.Type: GrantFiled: January 17, 2008Date of Patent: June 22, 2010Assignee: Raytheon CompanyInventors: Joseph R. Ellsworth, Michael P. Martinez, Stephen J. Pereira
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Publication number: 20090185352Abstract: A printed circuit board (PCB) assembly is provided. The PCB assembly is adapted for mounting at least one heat-generating electrical device and providing integrated heat dissipating capability to dissipate heat generated by the electrical device. The PCB assembly has a top surface and a bottom surface and comprises a signal carrying layer and an insert of pyrolytic graphite (PG). The signal carrying layer, disposed between the top surface and the bottom surface, comprises a material that is both thermally conductive and electrically conductive (such as at least one of aluminum, copper, and silver and alloys thereof) and has at least a portion lying in a first plane. The insert of PG is disposed within at least a portion of the first plane of the signal carrying layer, is in thermal contact with the signal carrying layer, and is constructed and arranged to have its greatest electrical conductivity in the first plane.Type: ApplicationFiled: January 17, 2008Publication date: July 23, 2009Inventors: Joseph R. Ellsworth, Michael P. Martinez, Stephen J. Pereira
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Publication number: 20080055022Abstract: An integrated SAW device features an electronic assembly, a SAW device mounted to the electronic assembly, and a heater element on the SAW device to minimize thermal resistance between the SAW device and the heater element.Type: ApplicationFiled: September 6, 2006Publication date: March 6, 2008Inventors: Mark A. Koehnke, Stephen J. Pereira