Patents by Inventor Stephen J. Reinhart

Stephen J. Reinhart has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • VLSI integration into a 3-D WSI dual composite module
    Patent number: 5229917
    Abstract: The difficulty with integrating packaged devices into a dual composite module design for wafer scale devices is the height difference between the WSI and packaged devices a typical wafer scale device is 0.025 (in) high while typical packaged VLSI components are 0.080 (in) or more. This leaves little room for the other 5 layers of interconnect boards and PCI layers required for the dual composite module. The solution is that the PWB on the side of the composite heat sink has been shortened to support only the wafer scale device on the heat sink. This eliminated PWB thickness and PCI interfaces from the side with the VLSI components. Also 3-P connectors are made with a pressure contact interconnecting (PCI) board.
    Type: Grant
    Filed: July 24, 1992
    Date of Patent: July 20, 1993
    Assignee: The United States of America as represented by the Secretary of the Air Force
    Inventors: David B. Harris, Scott P. Karr, Stephen J. Reinhart