Patents by Inventor Stephen John Kosteva

Stephen John Kosteva has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integral design features for heatsink attach for electronic packages
    Patent number: 6373703
    Abstract: An apparatus and method attaching a heatsink to a surface of an electronic package comprising a substrate, an integrated circuit chip attached to the surface of the substrate, an encapsulant encapsulating the integrated circuit chip and contacting at least a portion of the surface of the substrate, and an orifice formed in the top portion of the encapsulant to attach the heatsink to the surface of the electronic package. The heatsink may be attached and removed as desired to allow for package identification or rework.
    Type: Grant
    Filed: January 3, 2001
    Date of Patent: April 16, 2002
    Assignee: International Business Machines Corporation
    Inventors: Eric Arthur Johnson, Stephen John Kosteva, Stephen Wesley MacQuarrie
  • Integral design features for heatsink attach for electronic packages
    Publication number: 20010005312
    Abstract: An apparatus and method attaching a heatsink to a surface of an electronic package comprising a substrate, an integrated circuit chip attached to the surface of the substrate, an encapsulant encapsulating the integrated circuit chip and contacting at least a portion of the surface of the substrate, and an orifice formed in the top portion of the encapsulant to attach the heatsink to the surface of the electronic package. The heatsink may be attached and removed as desired to allow for package identification or rework.
    Type: Application
    Filed: January 3, 2001
    Publication date: June 28, 2001
    Inventors: Eric Arthur Johnson, Stephen John Kosteva, Stephen Wesley MacQuarrie
  • Integral design features for heatsink attach for electronic packages
    Patent number: 5969947
    Abstract: An apparatus and method attaching a heatsink to a surface of an electronic package comprising a substrate, an integrated circuit chip attached to the surface of the substrate, an encapsulant encapsulating the integrated circuit chip and contacting at least a portion of the surface of the substrate, and an orifice formed in the top portion of the encapsulant to attach the heatsink to the surface of the electronic package. The heatsink may be attached and removed as desired to allow for package identification or rework.
    Type: Grant
    Filed: December 17, 1997
    Date of Patent: October 19, 1999
    Assignee: International Business Machines Corporation
    Inventors: Eric Arthur Johnson, Stephen John Kosteva, Stephen Wesley MacQuarrie
  • Apparatus and process for improved die adhesion to organic chip carriers
    Patent number: 5955782
    Abstract: A semiconductor package and method for preparing same to obtain improved die adhesion to organic chip carriers has been developed. A copper die bond pad is coated with a passivation material and attached to an organic card with the same passivation material. A semiconductor die may be adhered to the coated die bond pad with either the same passivation material or a common die bond adhesive. Alternatively, the passivation material is coated only on the portion of the die bond pad where the die is attached, and common die bond adhesive attaches the die bond pad to the organic card.
    Type: Grant
    Filed: November 4, 1997
    Date of Patent: September 21, 1999
    Assignee: International Business Machines Corporation
    Inventors: Stephen John Kosteva, David Michael Passante, William John Rudik, David John Russell, Jonathan Craig Whitcomb
  • Assembly mounting techniques for heat sinks in electronic packaging
    Patent number: 5870285
    Abstract: An assembly support mount includes at least two flexible, retention posts spaced apart with ends to engage a heat sink frictionally to support the heat sink relative to an electronic device. The flexible retention posts are attached to a substrate without the need for holes in the substrate and extend past a heat generating device into openings in a heat sink where they are attached by any number of means, preferrably by frictionally engaging the openings in the heat sink.
    Type: Grant
    Filed: October 25, 1996
    Date of Patent: February 9, 1999
    Assignee: International Business Machines Corporation
    Inventors: Stephen John Kosteva, Bahgat Ghaleb Sammakia