Patents by Inventor Stephen John Macica

Stephen John Macica has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermally interfacing chip on glass assembly
    Patent number: 10571637
    Abstract: In one example embodiment, an optoelectronic assembly includes an electronic substrate, a transparent component coupled on a first side of the electronic substrate, and a first component coupled to a second side of the electronic substrate opposite the first side. The electronic substrate, the transparent component, and the first component may define a hermetically sealed enclosure. A laser array or a receiver array may be mechanically coupled to the transparent component inside of the enclosure and oriented to transmit or receive optical signals through the transparent component. The laser array or the receiver array may be electrically coupled to the electronic substrate. A second component may be positioned between the first component and the transparent component in the hermetically sealed enclosure with a thermal interface material forming a first interface between the second component and the transparent component.
    Type: Grant
    Filed: May 1, 2017
    Date of Patent: February 25, 2020
    Assignee: Finisar Corporation
    Inventors: Idan Mizrahi, Stephen John Macica
  • THERMALLY INTERFACING CHIP ON GLASS ASSEMBLY
    Publication number: 20170315314
    Abstract: In one example embodiment, an optoelectronic assembly includes an electronic substrate, a transparent component coupled on a first side of the electronic substrate, and a first component coupled to a second side of the electronic substrate opposite the first side. The electronic substrate, the transparent component, and the first component may define a hermetically sealed enclosure. A laser array or a receiver array may be mechanically coupled to the transparent component inside of the enclosure and oriented to transmit or receive optical signals through the transparent component. The laser array or the receiver array may be electrically coupled to the electronic substrate. A second component may be positioned between the first component and the transparent component in the hermetically sealed enclosure with a thermal interface material forming a first interface between the second component and the transparent component.
    Type: Application
    Filed: May 1, 2017
    Publication date: November 2, 2017
    Inventors: Idan Mizrahi, Stephen John Macica