Abstract: An apparatus for electroplating a metal on a semiconductor substrate with high control over plated thickness on a die-level includes an ionically resistive ionically permeable element (e.g., a plate with channels), where the element allows for flow of ionic current through the element towards the substrate during electroplating, where the element includes a plurality of regions, each region having a pattern of varied local resistance, and where the pattern of varied local resistance repeats in at least two regions. An electroplating method includes providing a semiconductor substrate to an electroplating apparatus having an ionically resistive ionically permeable element or a grid-like shield having a pattern correlating with a pattern of features on the substrate, and plating metal, while the pattern on the substrate remains spatially aligned with the pattern of the element or the grid-like shield for at least a portion of the total electroplating time.

Abstract: An ionically resistive ionically permeable element for use in an electroplating apparatus includes ribs to tailor hydrodynamic environment proximate a substrate during electroplating. In one implementation, the ionically resistive ionically permeable element includes a channeled portion that is at least coextensive with a plating face of the substrate, and a plurality of ribs extending from the substrate-facing surface of the channeled portion towards the substrate. Ribs include a first plurality of ribs of full maximum height and a second plurality of ribs of smaller maximum height than the full maximum height. In one implementation the ribs of smaller maximum height are disposed such that the maximum height of the ribs gradually increases in a direction from one edge of the element to the center of the element.

Abstract: Aqueous dispersions useful in adhesive and coating applications, and a method of preparing the same. The dispersion contains (a) an ethylene interpolymer having an acid number of at least 117, a melt flow of at least 50, and comprising from 15 to 24 percent by weight of the interpolymer of interpolymerized ethylenically unsaturated carboxylic acid, such as acrylic or methacrylic acid, (b) from about 5 to about 2,000 parts by weight per 100 parts of the interpolymer of a rosin tackifier having an acid number of at least about 76 and being compatible and codispersible with the interpolymer, (c) water in an amount sufficient to provide a solids content of the dispersion of from about 10 to about 60 percent, and (d) water soluble alkali in an amount effective to neutralize from 20 to 130 percent of the acid groups in the interpolymer and the tackifier, to disperse at least 99 percent by weight of the interpolymer and the tackifier, and to provide a viscosity of the dispersion which is less than about 1,500 Pa-s.

Abstract: Hot melt adhesive compositions consisting essentially of (a) a copolymer of ethylene and at least one unsaturated carboxylic acid such as acrylic or methacrylic acid, the copolymer containing from 12% to about 30% by weight of the acid; and (b) a tackifier which is compatible with the copolymer and which imparts adhesive strength to the composition when it is applied as a hot melt to a substrate of aluminum, glass, nylon, galvanized steel, polypropylene, polyvinyl chloride or polyacrylonitrile-butadiene-styrene, the tackifier being selected from the group consisting of: (i) rosins having an acid number of at least about 80 and rosins diluted with an aromatic hydrocarbon resin to have an acid number above approximately 80, and (ii) terpene resins.

Abstract: A hot melt adhesive and coating composition is provided comprising a copolymer of ethylene and acrylic acid or methacrylic acid; a compatible wax and a tackifier. The copolymer characterized as having a melt flow of at least about 0.77 and an acrylic acid or methacrylic acid content such that the copolymer has an acid number ranging from about 8 to about 93.

Abstract: The compatibility and thermal stability of blends of polyamides/carboxyl-containing ethylene polymers is improved by adding thereto an organic carboxylic acid compound, especially di-basic acids such as sebacic acid or tartaric acid. The blends may also contain free-radical scavengers and/or antioxidants. These blends are useful as heat-plasticized adhesives or bonding agents.