Patents by Inventor Stephen L. Martin

Stephen L. Martin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11949287
    Abstract: This disclosure provides a consolidated electric motor stator lamination for multiple enclosure types such that a single stator assembly can be used for different classifications of an electric motor. Each layer of the stator lamination includes external features that, when combined with the external features of the other layers in the lamination, can be adapted to conform the electric motor to one of a plurality of enclosure types. The external features include retaining features for one or more covers, fins, and a profile configured to accept cooling tubes. In various embodiments, a single consolidated stator lamination assembly can be adapted to provide a motor having at least two of an open-drip proof (ODP), a totally enclosed fan cooled (TEFC), or a totally enclosed water cooled (TEWC) enclosure classification.
    Type: Grant
    Filed: July 29, 2021
    Date of Patent: April 2, 2024
    Assignee: ABB Schweiz AG
    Inventors: William E. Martin, Stephen T. Evon, Jerry L. Martin, Barron D. Grant, John M. Zedek
  • Patent number: 8778031
    Abstract: Disclosed are limb prostheses for use when normal use of the lower leg is temporarily or permanently lost due to lower leg injury or disease, including below-knee amputation. Disclosed prostheses provide full body weight support and allow a wearer to maintain the use of the hands and arms during ambulation. In addition, a wearer can maintain use of their own knee to flex and extend during ambulation, thereby better controlling the prosthesis during motion and providing a more normal gait as compared to previously known devices. In the event of permanent loss of the lower leg due to below-knee amputation, the disclosed prosthesis provides an alternative to socket-type prosthetic devices.
    Type: Grant
    Filed: September 21, 2011
    Date of Patent: July 15, 2014
    Assignee: Clemson University
    Inventors: Robert A. Latour, Jr., Stephen L. Martin
  • Publication number: 20110044476
    Abstract: The present disclosure describes an apparatus and a system for generating electrical signals for a loudspeaker. The loudspeaker may include one or more piezoelectric actuators configured to deflect a diaphragm of the loudspeaker in response to an input signal. The apparatus may be configured to receive the input signal and to drive the piezoelectric actuators to deflect the diaphragm based on the received input signal.
    Type: Application
    Filed: August 16, 2010
    Publication date: February 24, 2011
    Applicant: EMO LABS, INC.
    Inventors: Gregory B. BURLINGAME, Stephen L. MARTIN, Jonathan R. WOOD
  • Patent number: 7171010
    Abstract: Audio processing methods and apparatus are provided for at least partially compensating for the Fletcher-Munson effect. An audio processor includes a variable filter receiving an input signal and providing a filtered output signal, the variable filter having a fixed cutoff frequency and a quality factor that is controllable in response to a control signal, and a control circuit configured to detect a signal level representative of input signal level in a selected band and to generate the control signal in response to the detected signal level. The control circuit may include a low-pass band select filter and a detector for detecting a signal level in the band selected by the low-pass filter and for generating the control signal.
    Type: Grant
    Filed: September 11, 2003
    Date of Patent: January 30, 2007
    Assignee: Boston Acoustics, Inc.
    Inventors: Stephen L. Martin, Gregory B. Burlingame, John R. David, Glenn G. Rogge
  • Patent number: 6768965
    Abstract: Methods and computer program products are provided for analyzing a crystalline structure, such as a wafer or an epitaxial layer in more detail, including the portion of the crystalline structure proximate the edge. The methods and computer program products of one aspect determine the average thickness and the normalized profile of a crystalline structure with enhanced detail. Additionally, the method and computer program product of another aspect represent the profile proximate the edge of the crystalline structure with a pair of lines that are selected to permit the profile of the crystalline structure proximate the edge of the crystalline structure to be characterized in more detail. Further, the method of yet another aspect permits the average edge profile for a plurality of crystalline structure to be defined.
    Type: Grant
    Filed: April 18, 2002
    Date of Patent: July 27, 2004
    Assignee: SEH America, Inc.
    Inventors: Stephen L. Martin, Shigeru Oba, Yoshinori Suzuki
  • Publication number: 20030200047
    Abstract: Methods and computer program products are provided for analyzing a crystalline structure, such as a wafer or an epitaxial layer in more detail, including the portion of the crystalline structure proximate the edge. The methods and computer program products of one aspect determine the average thickness and the normalized profile of a crystalline structure with enhanced detail. Additionally, the method and computer program product of another aspect represent the profile proximate the edge of the crystalline structure with a pair of lines that are selected to permit the profile of the crystalline structure proximate the edge of the crystalline structure to be characterized in more detail. Further, the method of yet another aspect permits the average edge profile for a plurality of crystalline structure to be defined.
    Type: Application
    Filed: April 18, 2002
    Publication date: October 23, 2003
    Applicant: SEH America, Inc.
    Inventors: Stephen L. Martin, Shigeru Oba, Yoshinori Suzuki
  • Patent number: 6286685
    Abstract: A system and method for sorting semiconductor substrates based on substrate thickness. The invention includes weighing each semiconductor substrate to be sorted, and then calculating the thickness of each substrate from its mass, area and density. The system may be configured to automatically sort the substrates according to the weight-based thickness calculations.
    Type: Grant
    Filed: December 8, 1999
    Date of Patent: September 11, 2001
    Assignee: SEH America, Inc.
    Inventors: Oleg V. Kononchuk, Stephen L. Martin