Abstract: A connector arrangement for providing electrical interconnection between corresponding contact pads of opposed first and second circuit boards includes an electrically nonconductive support member disposed between the boards, a bodily-rotatable, electrically conductive interconnect element, generally of dumbbell shape, extending through the thickness of the support and having a pair of pad engagement surfaces disposed to engage the respective contact pads, and a clamp for retaining the circuit boards in a clamped-together relationship with the support member in a compressed, reduced thickness state and with the interconnect member bodily rotated. The support member includes a resilient elastomeric material, has support surfaces respectively opposed to the board surfaces, and is adapted to be compressed by urging of the boards together.