Patents by Inventor Stephen Moffatt

Stephen Moffatt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11981999
    Abstract: Embodiments of the present disclosure generally relate to semiconductor processing, and specifically to methods and apparatus for surface modification of substrates. In an embodiment, a substrate modification method is provided. The method includes positioning a substrate within a processing chamber; and depositing a material on a portion of the substrate by a deposition process, wherein the deposition process comprises: thermally heating the substrate to a temperature of less than about 500° C.; delivering a first electromagnetic energy from an electromagnetic energy source to the substrate to modify a first region of the substrate, the first region of the substrate being at or near an upper surface of the substrate; and depositing a first material on the first region while delivering the first electromagnetic energy.
    Type: Grant
    Filed: November 12, 2021
    Date of Patent: May 14, 2024
    Assignee: Applied Materials, Inc.
    Inventors: David K. Carlson, Stephen Moffatt
  • Publication number: 20240145274
    Abstract: Examples described herein generally relate to apparatus and methods for rapid thermal processing (RTP) of a substrate. The present disclosure discloses pulsed radiation sources used to measure a broad range of low to high temperatures in the RTP chamber, each at a discrete wavelength, are used at a low temperature regime before using one laser at a discrete wavelength for higher temperatures. In another example, a single laser is used for both the low temperature regime and higher temperatures. These methods are useful for detection of a broad range of low to high temperatures in the RTP chamber with varying substrate types.
    Type: Application
    Filed: October 23, 2023
    Publication date: May 2, 2024
    Inventors: Wolfgang R. ADERHOLD, Stephen MOFFATT
  • Patent number: 11947888
    Abstract: Embodiments disclosed herein include a semiconductor manufacturing tool with a hybrid model and methods of using the hybrid model for processing wafers and/or developing process recipes. In an embodiment, a method for developing a semiconductor manufacturing process recipe comprises selecting one or more device outcomes, and querying a hybrid model to obtain a process recipe recommendation suitable for obtaining the device outcomes. In an embodiment, the hybrid process model comprises a statistical model and a physical model. In an embodiment, the method may further comprise executing a design of experiment (DoE) on a set of wafers to validate the process recipe recommended by the hybrid process model.
    Type: Grant
    Filed: January 19, 2023
    Date of Patent: April 2, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Stephen Moffatt, Sheldon R. Normand, Dermot P. Cantwell
  • Patent number: 11735447
    Abstract: Embodiments disclosed herein include a processing tool for semiconductor processing. In an embodiment, the processing tool comprises a chamber, and a plurality of witness sensors integrated with the chamber. In an embodiment, the processing tool further comprises a drift detection module. In an embodiment, data from the plurality of witness sensors is provided to the drift detection module as input data. In an embodiment, the processing tool further comprises a dashboard for displaying output data from the drift detection module.
    Type: Grant
    Filed: October 20, 2020
    Date of Patent: August 22, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Kartik Santhanam, Kartik Shah, Wolfgang Aderhold, Martin Hilkene, Stephen Moffatt
  • Publication number: 20230178346
    Abstract: In an embodiment, a plasma processing tool with an extendable probe is described. In an embodiment, the plasma processing tool comprises a chamber, and a pedestal for supporting a substrate. In an embodiment, an edge ring is around a perimeter of the pedestal. Additionally, a sensor at an end of a probe is provided. In an embodiment, the probe is configured to extend over the pedestal.
    Type: Application
    Filed: December 8, 2021
    Publication date: June 8, 2023
    Inventors: Stephen Moffatt, Martin Hilkene
  • Publication number: 20230153503
    Abstract: Embodiments disclosed herein include a semiconductor manufacturing tool with a hybrid model and methods of using the hybrid model for processing wafers and/or developing process recipes. In an embodiment, a method for developing a semiconductor manufacturing process recipe comprises selecting one or more device outcomes, and querying a hybrid model to obtain a process recipe recommendation suitable for obtaining the device outcomes. In an embodiment, the hybrid process model comprises a statistical model and a physical model. In an embodiment, the method may further comprise executing a design of experiment (DoE) on a set of wafers to validate the process recipe recommended by the hybrid process model.
    Type: Application
    Filed: January 19, 2023
    Publication date: May 18, 2023
    Inventors: Stephen Moffatt, SHELDON R. NORMAND, DERMOT P. CANTWELL
  • Patent number: 11586794
    Abstract: Embodiments disclosed herein include a semiconductor manufacturing tool with a hybrid model and methods of using the hybrid model for processing wafers and/or developing process recipes. In an embodiment, a method for developing a semiconductor manufacturing process recipe comprises selecting one or more device outcomes, and querying a hybrid model to obtain a process recipe recommendation suitable for obtaining the device outcomes. In an embodiment, the hybrid process model comprises a statistical model and a physical model. In an embodiment, the method may further comprise executing a design of experiment (DoE) on a set of wafers to validate the process recipe recommended by the hybrid process model.
    Type: Grant
    Filed: July 30, 2020
    Date of Patent: February 21, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Stephen Moffatt, Sheldon R. Normand, Dermot P. Cantwell
  • Patent number: 11529592
    Abstract: Gas injectors for providing uniform flow of fluid are provided herein. The gas injector includes a plenum body. The plenum body includes a recess, a protrusion adjacent to the recess and extending laterally away from the plenum body, and a plurality of nozzles extending laterally from an exterior surface of the plenum body. The plenum body has a plurality of holes in an exterior wall of the plenum body. Each nozzle is in fluid communication with an interior volume of the plenum body. By directing the flow of fluid, the gas injector provides for a uniform deposition.
    Type: Grant
    Filed: July 1, 2021
    Date of Patent: December 20, 2022
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Vishwas Kumar Pandey, Lara Hawrylchak, Eric Kihara Shono, Kartik Shah, Christopher S. Olsen, Sairaju Tallavarjula, Kailash Pradhan, Rene George, Johanes F. Swenberg, Stephen Moffatt
  • Patent number: 11411039
    Abstract: Generally, examples described herein relate to methods and processing chambers and systems for forming a stacked pixel structure using epitaxial growth processes and device structures formed thereby. In an example, a first sensor layer is epitaxially grown on a crystalline surface on a substrate. A first isolation structure is epitaxially grown on the first sensor layer. A second sensor layer is epitaxially grown on the first isolation structure. A second isolation structure is epitaxially grown on the second sensor layer. A third sensor layer is epitaxially grown on the second isolation structure.
    Type: Grant
    Filed: May 19, 2020
    Date of Patent: August 9, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Papo Chen, John Boland, Schubert S. Chu, Errol Antonio C. Sanchez, Stephen Moffatt
  • Patent number: 11348769
    Abstract: Implementations described herein provide for thermal substrate processing apparatus including two thermal process chambers, each defining a process volume, and a substrate support disposed within each process volume. One or more remote plasma sources may be in fluid communication with the process volumes and the remote plasma sources may be configured to deliver a plasma to the process volumes. Various arrangements of remote plasma sources and chambers are described.
    Type: Grant
    Filed: September 8, 2020
    Date of Patent: May 31, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Lara Hawrylchak, Matthew D. Scotney-Castle, Norman L. Tam, Matthew Spuller, Kong Lung Samuel Chan, Dongming Iu, Stephen Moffatt
  • Publication number: 20220162756
    Abstract: Embodiments of the present disclosure generally relate to semiconductor processing, and specifically to methods and apparatus for surface modification of substrates. In an embodiment, a substrate modification method is provided. The method includes positioning a substrate within a processing chamber; and depositing a material on a portion of the substrate by a deposition process, wherein the deposition process comprises: thermally heating the substrate to a temperature of less than about 500° C.; delivering a first electromagnetic energy from an electromagnetic energy source to the substrate to modify a first region of the substrate, the first region of the substrate being at or near an upper surface of the substrate; and depositing a first material on the first region while delivering the first electromagnetic energy.
    Type: Application
    Filed: November 12, 2021
    Publication date: May 26, 2022
    Inventors: David K. CARLSON, Stephen MOFFATT
  • Publication number: 20220122865
    Abstract: Embodiments disclosed herein include a processing tool for semiconductor processing. In an embodiment, the processing tool comprises a chamber, and a plurality of witness sensors integrated with the chamber. In an embodiment, the processing tool further comprises a drift detection module. In an embodiment, data from the plurality of witness sensors is provided to the drift detection module as input data. In an embodiment, the processing tool further comprises a dashboard for displaying output data from the drift detection module.
    Type: Application
    Filed: October 20, 2020
    Publication date: April 21, 2022
    Inventors: Kartik Santhanam, Kartik Shah, Wolfgang Aderhold, Martin Hilkene, Stephen Moffatt
  • Publication number: 20220084842
    Abstract: Embodiments disclosed herein include a processing tool and methods of using the processing tool. In an embodiment, the processing tool comprises a chamber, and a cartridge for flowing one or more processing gasses into the chamber from a plurality of gas sources. In an embodiment, the processing tool further comprises a mass flow controller for each of the plurality of gas sources, and a mass flow meter between the gas sources and the cartridge. In an embodiment, the processing tool further comprises a first pressure gauge between the mass flow meter and the cartridge, a second pressure gauge fluidically coupled to the chamber, and an exhaust line coupled to the chamber.
    Type: Application
    Filed: September 11, 2020
    Publication date: March 17, 2022
    Inventors: Martin Hilkene, Kartik Shah, Stephen Moffatt
  • Publication number: 20220035979
    Abstract: Embodiments disclosed herein include a semiconductor manufacturing tool with a hybrid model and methods of using the hybrid model for processing wafers and/or developing process recipes. In an embodiment, a method for developing a semiconductor manufacturing process recipe comprises selecting one or more device outcomes, and querying a hybrid model to obtain a process recipe recommendation suitable for obtaining the device outcomes. In an embodiment, the hybrid process model comprises a statistical model and a physical model. In an embodiment, the method may further comprise executing a design of experiment (DoE) on a set of wafers to validate the process recipe recommended by the hybrid process model.
    Type: Application
    Filed: July 30, 2020
    Publication date: February 3, 2022
    Inventors: Stephen Moffatt, Sheldon R. Normand, Dermot P. Cantwell
  • Publication number: 20210366976
    Abstract: Generally, examples described herein relate to methods and processing chambers and systems for forming a stacked pixel structure using epitaxial growth processes and device structures formed thereby. In an example, a first sensor layer is epitaxially grown on a crystalline surface on a substrate. A first isolation structure is epitaxially grown on the first sensor layer. A second sensor layer is epitaxially grown on the first isolation structure. A second isolation structure is epitaxially grown on the second sensor layer. A third sensor layer is epitaxially grown on the second isolation structure.
    Type: Application
    Filed: May 19, 2020
    Publication date: November 25, 2021
    Inventors: Papo CHEN, John BOLAND, Schubert S. CHU, Errol Antonio C. SANCHEZ, Stephen MOFFATT
  • Publication number: 20210322934
    Abstract: Gas injectors for providing uniform flow of fluid are provided herein. The gas injector includes a plenum body. The plenum body includes a recess, a protrusion adjacent to the recess and extending laterally away from the plenum body, and a plurality of nozzles extending laterally from an exterior surface of the plenum body. The plenum body has a plurality of holes in an exterior wall of the plenum body. Each nozzle is in fluid communication with an interior volume of the plenum body. By directing the flow of fluid, the gas injector provides for a uniform deposition.
    Type: Application
    Filed: July 1, 2021
    Publication date: October 21, 2021
    Inventors: Vishwas Kumar PANDEY, Lara HAWRYLCHAK, Eric Kihara SHONO, Kartik SHAH, Christopher S. OLSEN, Sairaju TALLAVARJULA, Kailash PRADHAN, Rene GEORGE, Johanes F. SWENBERG, Stephen MOFFATT
  • Patent number: 11077410
    Abstract: Gas injectors for providing uniform flow of fluid are provided herein. The gas injector includes a plenum body. The plenum body includes a recess, a protrusion adjacent to the recess and extending laterally away from the plenum body, and a plurality of nozzles extending laterally from an exterior surface of the plenum body. The plenum body has a plurality of holes in an exterior wall of the plenum body. Each nozzle is in fluid communication with an interior volume of the plenum body. By directing the flow of fluid, the gas injector provides for a uniform deposition.
    Type: Grant
    Filed: August 29, 2018
    Date of Patent: August 3, 2021
    Assignee: Applied Materials, Inc.
    Inventors: Vishwas Kumar Pandey, Lara Hawrylchak, Eric Kihara Shono, Kartik Shah, Christopher S. Olsen, Sairaju Tallavarjula, Kailash Pradhan, Rene George, Johanes F. Swenberg, Stephen Moffatt
  • Publication number: 20210220949
    Abstract: The present invention generally describes apparatuses and methods used to perform an annealing process on desired regions of a substrate. In one embodiment, pulses of electromagnetic energy are delivered to a substrate using a flash lamp or laser apparatus. The pulses may be from about 1 nsec to about 10 msec long, and each pulse has less energy than that required to melt the substrate material. The interval between pulses is generally long enough to allow the energy imparted by each pulse to dissipate completely. Thus, each pulse completes a micro-anneal cycle. The pulses may be delivered to the entire substrate at once, or to portions of the substrate at a time. Further embodiments provide an apparatus for powering a radiation assembly, and apparatuses for detecting the effect of pulses on a substrate.
    Type: Application
    Filed: March 16, 2021
    Publication date: July 22, 2021
    Inventors: Stephen MOFFATT, Joseph M. RANISH
  • Patent number: 11040415
    Abstract: The present invention generally describes apparatuses and methods used to perform an annealing process on desired regions of a substrate. In one embodiment, pulses of electromagnetic energy are delivered to a substrate using a flash lamp or laser apparatus. The pulses may be from about 1 nsec to about 10 msec long, and each pulse has less energy than that required to melt the substrate material. The interval between pulses is generally long enough to allow the energy imparted by each pulse to dissipate completely. Thus, each pulse completes a micro-anneal cycle. The pulses may be delivered to the entire substrate at once, or to portions of the substrate at a time. Further embodiments provide an apparatus for powering a radiation assembly, and apparatuses for detecting the effect of pulses on a substrate.
    Type: Grant
    Filed: November 16, 2016
    Date of Patent: June 22, 2021
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Stephen Moffatt, Joseph M. Ranish
  • Patent number: D959490
    Type: Grant
    Filed: October 7, 2020
    Date of Patent: August 2, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Kartik Bhupendra Shah, Kartik Santhanam, Bindusagar Marath Sankarathodi, Abhilash J. Mayur, Dayal Ramachandran, Amritha Rammohan, Stephen Moffatt, Eugene Lobanov