Abstract: A power module having a power circuit board free of mounting holes and more usable surface area for disposition of copper traces is shown. The power module includes a power shell that snaps onto the underside of the power circuit board. The power shell has embedded therein a thermally conductive substrate. One or a plurality of power semiconductor devices are disposed over one side of the thermally conductive substrate. A heatsink is mounted to the underside of the power shell in thermal contact with the thermally conductive substrate. The heatsink is mounted to the underside of the power shell by a heatsink retainer which biases the heatsink against the substrate. The heatsink retainer is mounted on retainer posts which extend from the underside of the power shell.

Abstract: A power module having a power circuit board free of mounting holes and more usable surface area for disposition of copper traces is shown. The power module includes a power shell that snaps onto the underside of the power circuit board. The power shell has embedded therein a thermally conductive substrate. One or a plurality of power semiconductor devices are disposed over one side of the thermally conductive substrate. A heatsink is mounted to the underside of the power shell in thermal contact with the thermally conductive substrate. The heatsink is mounted to the underside of the power shell by a heatsink retainer which biases the heatsink against the substrate. The heatsink retainer is mounted on retainer posts which extend from the underside of the power shell.

Abstract: A flexible power assembly (FPA) provides a new packaging concept suitable for motor control and other functions. An insulated metal substrate (IMS) supports power semiconductor devices and is mounted directly on a heatsink, which supports a circuit board that is mounted above and spaced from the top side of the IMS. There are provided devices that are mounted on the circuit board which are electrically connected to the power semiconductor devices. There may be a cavity in the circuit board allowing the top of the IMS to be exposed, and optionally providing access for bonding wires to the top of the circuit. Bonding pads may be provided on the circuit board for electrical connection with the bonding wires. A cover may be optionally provided to enclose a space over the cavity. Potting compound may be contained in the space created by the cavity.