Abstract: A pressure sensing element includes a sensing sub-element disposed on a diaphragm, the element including a shield disposed over the sub-element and configured to substantially eliminate influence of external charge on the sub-element during operation. A method of fabrication and a pressure sensor making use of the pressure sensing element are disclosed.

Abstract: A pressure sensing element includes a sensing sub-element disposed on a diaphragm, the element including a shield disposed over the sub-element and configured to substantially eliminate influence of external charge on the sub-element during operation. A method of fabrication and a pressure sensor making use of the pressure sensing element are disclosed.

Abstract: A pressure sensing element includes a sensing sub-element disposed on a diaphragm, the element including a shield disposed over the sub-element and configured to substantially eliminate influence of external charge on the sub-element during operation. A method of fabrication and a pressure sensor making use of the pressure sensing element are disclosed.

Abstract: A pressure sensing device (10, 40) is shown having a ceramic capacitive sensing element (12) received in a chamber formed in a hexport housing (16). The hexport housing has a fluid passageway (16c) communicating with a recessed chamber (16d) formed in a bottom wall circumscribed by an annular platform shoulder (16e). A thin flexible metal diaphragm (18) is hermetically attached to the bottom wall along the platform shoulder. A curable adhesive resin having a thermal coefficient of expansion and modulus of elasticity appropriately matching that of sensing element (12), such as polyurethane, is cast between the sensing element (12) and the metal diaphragm (18) forming, when cured, a layer bonded to both members resulting in a sensor that is effective in monitoring negative as well as positive fluid pressures.

Abstract: A capacitive fluid pressure transducer (10′) has a sensing element (12) received in an electrically conductive cup-shaped shield member (24) which is crimped onto the base of an electrical connector (20′). A conditioning circuit (14) is received in a circuit chamber formed between the sensor element and the connector and is provided with a tab carrying a conductive trace for electrical connection of the shield member with the circuit. The shield member is received in an electrically insulating sleeve (28) which in turn is received in a cavity formed in a metallic, high strength hexport housing so that the shield member is electrically isolated from the hexport housing.