Patents by Inventor Stephen Phillip DaVanzo

Stephen Phillip DaVanzo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Enhanced boron nitride composition and polymer based high thermal conductivity molding compound
    Patent number: 5681883
    Abstract: The present invention relates to a boron nitride composition of particles of boron nitride and a nonionic surfactant for use as a filler with a distribution of agglomerates having an average particle size in the range of between 20-80 microns and to a molding compound having a high thermal conductivity of above at least 5 W/m.degree. K. The molding compound comprises a polymer base material, a filler and a nonionic surfactant with the filler comprising boron nitride in a concentration of at least 60% by weight of said composition and wherein the nonionic surfactant is selected from the class consisting of carboxylic acid amides and carboxylic acid esters.
    Type: Grant
    Filed: March 5, 1996
    Date of Patent: October 28, 1997
    Assignee: Advanced Ceramics Corporation
    Inventors: Richard Frank Hill, Stephen Phillip DaVanzo