Abstract: Photosensitive elastomeric compositions comprising about 40 to 90 weight percent of a heat workable, carboxyl- and sulfur-containing polymer of a diene; about 2 to 50 weight percent of a nongaseous, ethylenically unsaturated compound; and about 0.001 to 10 weight percent of a radical generating system; the compositions being useful for making flexographic printing plates.

Abstract: Photosensitive elastomeric compositions comprising about 40 to 90 weight percent of a heat workable, carboxyl- and sulfur-containing polymer of a diene; about 2 to 50 weight percent of a nongaseous, ethylenically unsaturated compound; and about 0.001 to 10 weight percent of a radical generating system; the compositions being useful for making flexographic printing plates.

Abstract: Three-component aqueous processable, positive-working photopolymer compositions comprising (i) an unsaturated polymer comprising (a) about 20 to 1000 milliequivalents of reactive unsaturated carbon to carbon groups per 100 g of polyene and (b) about 10 to 50 mol percent of N-alkenylmaleimide units; (ii) a reactive mercapto acid and (iii) a radiation-sensitive, radical-generating initiator; substrates coated with such compositions; and a photoimaging process.

Abstract: Three-component aqueous processable, positive-working photopolymer compositions comprising (i) an unsaturated polymer, (ii) a reactive mercapto acid and (iii) a radiation-sensitive, radical-generating initiator; substrates coated with such compositions; and a photoimaging process.

Abstract: A polymeric heat resistant photopolymerizable composition of a polyamide ester resin containing photopolymerizable groups useful for forming relief structures on electrical devices such as capacitors, integrated circuits, printed circuits and semiconductors; a solution of the composition is applied to a substrate such as a coated silicon wafer which is the base for an electrical device, dried to form a film, the film is exposed to radiation through a pattern and photopolymerized; the unexposed and unpolymerized part of the film is dissolved off and the resulting relief structure is converted to a polyimide structure with sharp definition and has good mechanical, chemical and electrical properties; to reduce radiation exposure time and increase the rate of photopolymerization the following constituents are used in the composition:radiation sensitive polymerizable polyfunctional acrylate compound and photopolymerization initiators containing hydrogen donor initiator and aromatic biimidazole, and an oxygen scave

Abstract: An electrical device formed from a polymeric heat resistant photopolymerizable composition of a polyamide ester, resin containing photopolymerizable groups which forms a relief structures on electrical devices such as capacitors, integrated circuits, printed circuits, multilayer circuits or semiconductors; a solution of the composition is applied to a substrate such as a coated silicon wafer, dried to form a film, the film is exposed to radiation through a pattern and photopolymerized; the unexposed and unpolymerized part of the film is dissolved off and the resulting relief structure is converted to a polyimide structure with sharp definition and has good mechanical, chemical and electrical properties; to reduce radiation exposure time and increase the rate of photopolymerization the following constituents are used in the composition: a radiation sensitive polymerizable polyfunctional acrylate compound and a photopolymerization initiator of an aromatic biimidazole.

Abstract: An improved process for forming relief structures on electrical devices such as capacitors, integrated circuits, printed circuits and semiconductors; a solution of a composition a polymeric heat resistant photopolymerizable composition of a polyamide ester resin containing photopolymerizable groups is applied to substrate such as a coated silicon wafer, which forms the base an electrical device, and is dried to form a film, the film is exposed to radiation through a pattern and photopolymerized; the unexposed and unpolymerized part of the film is dissolved off and the resulting relief structure is converted to a polyimide structure having a sharp definition and good mechanical, chemical and electrical properties; to reduce radiation exposure time and increase the rate of photopolymerization the following constituents are used in the composition:a radiation sensitive polymerizable polyfunctional acrylate compound and a photopolymerization initiator of an aromatic biimidazole.

Abstract: A polymeric heat resistant photopolymerizable composition of a polyamide ester resin containing photopolymerizable groups useful for forming relief structures on electrical devices such as capacitors, integrated circuits and semiconductors; a solution of the composition is applied to a substrate such as a coated silicon wafer which forms an electrical device, dried to form a film, the film is exposed to radiation through a pattern and photopolymerized; the unexposed and unpolymerized part of the film is dissolved off and the resulting relief structure is baked to form a polyimide structure with sharp definition and has good mechanical, chemical and electrical properties; to reduce radiation exposure time and increase the rate of photopolymerization the following constituents are used in the composition:a radiation sensitive polymerizable polyfunctional acrylate compound and a photopolymerization initiator of an aromatic biimidazole.

Abstract: Photosensitive, elastomeric compositions comprising(1) a high molecular weight carboxylated butadiene/acrylonitrile copolymer in which at least about 25% of the carboxyl groups are neutralized with a metal cation of Groups IIA or IIB of the Periodic Table,(2) an ethylenically unsaturated monomer, and(3) a free radical generating system, having outstanding properties as photosensitive elements for flexographic printing plates.

Abstract: Photosensitive, elastomeric compositions containing(1) a high molecular weight butadiene/acrylonitrile copolymer,(2) a low molecular weight butadiene polymer,(3) an ethylenically unsaturated monomer, and(4) a free-radical generating systemhave outstanding properties as photosensitive coatings for flexographic printing plates. When the combination of high and low molecular weight polymers contains at least about 2% by weight of carboxyl groups, the compositions are processable in aqueous or semiaqueous basic solutions.

Abstract: Monomers of the formulas ##STR1## WHEREIN R and R.sup.1 are generally lower hydrocarbyl groups, R.sup.2 is an aromatic ultraviolet light-absorbing moiety bonded by aromatic carbon, a is 0 or 1 and b is 1 or 2 are useful in the formulation of light- and abrasion-resistant coatings for polymers.

Abstract: Monomers of the formulas R.sup.2 (O-CH.sub.2 CH(OH)(R).sub.a Si(OR.sup.1).sub.3).sub.b and ##STR1## WHEREIN R and R.sup.1 are generally lower hydrocarbyl groups, R.sup.2 is an aromatic ultraviolet light-absorbing moiety bonded by aromatic carbon, a is 0 or 1 and b is 1 or 2 are useful in the formulation of light- and abrasion-resistant coatings for polymers.