Abstract: Embodiments of the present invention provide composite bodies having a discontinuous graphite preform and at least one silicon-bearing metal alloy infiltrant. Embodiments of the present invention also provide methods for producing such composite bodies. The metal alloy is preferably comprised of aluminum, copper, or magnesium, or combinations thereof. Certain preferred embodiments provide at least one aluminum alloy having from about 5% silicon to about 30% silicon, more preferably from about 11% to about 13% silicon, as an alloying element. Certain presently preferred embodiments provide an aluminum-silicon eutectic composition having about 12.5% silicon. Embodiments of the invention provide composite materials be “tuned” to more closely match thermal expansion characteristics of a number of semiconductor or integrated circuit materials such as, but not limited to, silicon, alumina, aluminum nitride, gallium nitride, and gallium arsenide while also providing high thermal conductivity.

Abstract: Embodiments of the present invention provide composite bodies having a discontinuous graphite preform and at least one silicon-bearing metal alloy infiltrant. Embodiments of the present invention also provide methods for producing such composite bodies. The metal alloy is preferably comprised of aluminum, copper, or magnesium, or combinations thereof. Certain preferred embodiments provide at least one aluminum alloy having from about 5% silicon to about 30% silicon, more preferably from about 11% to about 13% silicon, as an alloying element. Certain presently preferred embodiments provide an aluminum-silicon eutectic composition having about 12.5% silicon. Embodiments of the invention provide composite materials be “tuned” to more closely match thermal expansion characteristics of a number of semiconductor or integrated circuit materials such as, but not limited to, silicon, alumina, aluminum nitride, gallium nitride, and gallium arsenide while also providing high thermal conductivity.

Abstract: Disclosed are methods and materials for preparing metal matrix composite (MMC) components that have low weight, good thermal conductivity and a controllable in-plane coefficient of thermal expansion. One embodiment of the invention features a metal matrix composite that includes a metal alloy and random in-plane discontinuous fibers. In some embodiments, the metal alloy includes aluminum, copper or magnesium. In certain embodiments, the metal matrix composite includes additives that enable solution hardening. In other embodiments, the metal matrix composite includes additives that enable precipitation hardening. Another embodiment of the invention features a method of manufacturing a metal matrix composite. The method includes contacting random in-plane discontinuous fibers with a binder, and pressurizing the random in-plane discontinuous fibers and the binder to form a bound preform. The preform is pressurized to a pressure greater than the molten metal capillary breakthrough pressure of the bound preform.

Abstract: Disclosed are methods and materials for preparing metal matrix composite (MMC) components that have low weight, good thermal conductivity and a controllable in-plane coefficient of thermal expansion. One embodiment of the invention features a metal matrix composite that includes a metal alloy and random in-plane discontinuous fibers. In some embodiments, the metal alloy includes aluminum, copper or magnesium. In certain embodiments, the metal matrix composite includes additives that enable solution hardening. In other embodiments, the metal matrix composite includes additives that enable precipitation hardening. Another embodiment of the invention features a method of manufacturing a metal matrix composite. The method includes contacting random in-plane discontinuous fibers with a binder, and pressurizing the random in-plane discontinuous fibers and the binder to form a bound preform. The preform is pressurized to a pressure greater than the molten metal capillary breakthrough pressure of the bound preform.

Abstract: Disclosed are economical methods and apparatus for high throughput pressure infiltration casting. Methods of the invention use a mold vessel as an evacuation chamber along with an evacuation cap to produce superior quality near-net shape finished cast parts with low porosity. Other methods of the invention use an improved heat transfer technique for directionally solidifying molten infiltrant at an increased rate to increase further the throughput of the pressure infiltration casting cycle. The invention also provides apparatus for practicing methods for high throughput pressure infiltration casting. One embodiment of an apparatus of the invention is a removable evacuation cap, often used in conjunction with a fill tube. Another apparatus embodiment is an evacuation cap coupled to a mold vessel which is used as an evacuation chamber.

Abstract: A mold cavity in a mold vessel is evacuated. A charge of molten infiltrant is transported into the mold vessel while the vacuum is maintained in the mold cavity. Pressure is applied to the molten infiltrant to move the molten infiltrant from the mold vessel into the mold cavity. The molten infiltrant is cooled in the mold cavity to solidify the infiltrant. A fill tube can be used to transport the infiltrant to the mold vessel.