Patents by Inventor Stephen Wagner
Stephen Wagner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10293436Abstract: Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.Type: GrantFiled: November 7, 2014Date of Patent: May 21, 2019Assignee: Corning IncorporatedInventors: Sasha Marjanovic, Garrett Andrew Piech, Shyamala Shanmugam, Sergio Tsuda, Robert Stephen Wagner
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Publication number: 20190083207Abstract: A method for producing a customized, digitally-designed prosthesis in three (3) patient interactions, the method comprising a first patient interaction including the optional tasks of acquiring a patient's intra-oral anatomy, natural anatomical measurements of the patient, and tooth data of the patient, the results of the first patient interaction producing a first data set; Utilizing the first data set to design a first digital prosthesis, the first digital prosthesis being manufactured into a first denture base and obtaining artificial teeth; a second patient interaction including the optional tasks of seating the first denture base in the patient, adjusting the positioning of the artificial teeth to the first denture base, making an interocclusal record with the first denture base, the results of the second patient interaction creating a second data set utilizing the second data set to create a final digital denture, the final digital prosthesis being manufactured into a final dental prosthesis; a third inType: ApplicationFiled: September 20, 2017Publication date: March 21, 2019Inventors: Stephen Wagner, Brian Goodacre, Charles Goodacre, Brent Thompson
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Publication number: 20190084090Abstract: Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.Type: ApplicationFiled: November 7, 2018Publication date: March 21, 2019Inventors: Sasha Marjanovic, Garrett Andrew Piech, Shyamala Shanmugam, Carlos Alberto Pons Siepermann, Sergio Tsuda, Zsigmond Varga, Robert Stephen Wagner
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Patent number: 10233112Abstract: The present invention relates to a process for cutting and separating interior contours in thin substrates of transparent materials, in particular glass. The method involves the utilization of an ultra-short pulse laser to form perforation or holes in the substrate, that may be followed by use of a CO2 laser beam to promote full separation about the perforated line.Type: GrantFiled: August 30, 2016Date of Patent: March 19, 2019Assignee: CORNING INCORPORATEDInventors: Thomas Hackert, Sasha Marjanovic, Garrett Andrew Piech, Sergio Tsuda, Robert Stephen Wagner
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Patent number: 10183885Abstract: The present disclosure relates to a process for cutting and separating arbitrary shapes of thin substrates of transparent materials, particularly tailored composite fusion drawn glass sheets, and the disclosure also relates to a glass article prepared by the method. The developed laser method can be tailored for manual separation of the parts from the panel or full laser separation by thermally stressing the desired profile. The self-separation method involves the utilization of an ultra-short pulse laser that can be followed by a CO2 laser (coupled with high pressure air flow) for fully automated separation.Type: GrantFiled: April 25, 2017Date of Patent: January 22, 2019Assignee: Corning IncorporatedInventors: Dana Craig Bookbinder, Stephan Lvovich Logunov, Sasha Marjanovic, Albert Roth Nieber, Garrett Andrew Piech, Kamjula Pattabhirami Reddy, Pushkar Tandon, Sergio Tsuda, Natesan Venkataraman, Robert Stephen Wagner
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Patent number: 10179748Abstract: A method of laser processing a material to form a separated part. The method includes focusing a pulsed laser beam into a laser beam focal line, viewed along the beam propagation direction, directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a hole or fault line along the laser beam focal line within the material, and directing a defocused carbon dioxide (CO2) laser from a distal edge of the material over the plurality of holes to a proximal edge of the material.Type: GrantFiled: May 3, 2017Date of Patent: January 15, 2019Assignee: Corning IncorporatedInventors: Sasha Marjanovic, Garrett Andrew Piech, Sergio Tsuda, Robert Stephen Wagner
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Patent number: 10144093Abstract: Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.Type: GrantFiled: August 30, 2016Date of Patent: December 4, 2018Assignee: Corning IncorporatedInventors: Sasha Marjanovic, Garrett Andrew Piech, Shyamala Shanmugam, Carlos Alberto Pons Siepermann, Sergio Tsuda, Zsigmond Varga, Robert Stephen Wagner
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Publication number: 20180237329Abstract: A method of printing a 3D object includes feeding one or more preformed materials from a feed outlet into a build zone in which a hot spot is located and using the hot spot to selectively heat the one or more preformed materials to a viscous state. Object layers are formed by depositing portions of the preformed materials on a build surface, or on another object layer on the build surface, while effecting relative motion between the build surface and the feed outlet.Type: ApplicationFiled: August 12, 2016Publication date: August 23, 2018Inventors: Christopher William Drewnowski, Michael Thomas Gallagher, Scott Michael Jarvis, Xinghua Li, Moussa N'Gom, Robert Stephen Wagner, Nicholas Ryan Wheeler
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Publication number: 20180186693Abstract: Strengthened glass articles having laser etched features, electronic devices, and methods of fabricating etched features in strengthened glass articles are disclosed. In one embodiment, a strengthened glass article includes a first strengthened surface layer and a second strengthened surface layer under a compressive stress and extending from a first surface and a second surface, respectively, of the strengthened glass article to a depth of layer, and a central region between the first strengthened surface layer and the second strengthened surface layer that is under tensile stress. The strengthened glass article further includes at least one etched feature formed by laser ablation within the first surface or the second surface having a depth that is less than the depth of layer and a surface roughness that is greater than a surface roughness of the first surface or second surface outside of the at least one etched feature.Type: ApplicationFiled: February 27, 2018Publication date: July 5, 2018Inventors: Johannes Moll, James Joseph Price, Alranzo Boh Ruffin, Sergio Tsuda, Robert Stephen Wagner, James Joseph Watkins
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Publication number: 20180179100Abstract: The present invention relates to a laser cutting technology for cutting and separating thin substrates of transparent materials, for example to cutting of display glass compositions mainly used for production of Thin Film Transistors (TFT) devices. The described laser process can be used to make straight cuts, for example at a speed of >1 m/sec, to cut sharp radii outer corners (<1 mm), and to create arbitrary curved shapes including forming interior holes and slots. A method of laser processing an alkaline earth boro-aluminosilicate glass composite workpiece includes focusing a pulsed laser beam into a focal line. The focal line is directed into the glass composite workpiece, generating induced absorption within the material. The workpiece and the laser beam are translated relative to each other to form a plurality of defect lines along a contour, with adjacent defect lines have a spacing of 0.1-20 microns.Type: ApplicationFiled: November 14, 2017Publication date: June 28, 2018Inventors: Sasha Marjanovic, Albert Roth Nieber, Garrett Andrew Piech, Helmut Schillinger, Sergio Tsuda, Robert Stephen Wagner
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Publication number: 20180141846Abstract: A method for making a laminate structure comprising a first glass layer, a second glass layer, and at least one polymer interlayer intermediate the first and second glass layers. The first glass layer can be comprised of a strengthened glass having a first portion with a first surface compressive stress and a first depth of layer of compressive stress and a second portion with a second surface compressive stress and a second depth of layer of compressive stress. In other embodiments, the second glass layer can be comprised of a strengthened glass having a third portion with a third surface compressive stress and a third depth of layer of compressive stress and a fourth portion with a fourth surface compressive stress and a fourth depth of layer of compressive stress.Type: ApplicationFiled: January 17, 2018Publication date: May 24, 2018Inventors: Thomas Michael Cleary, Mark Stephen Friske, Robert Stephen Wagner
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Patent number: 9938186Abstract: Strengthened glass articles having laser etched features, electronic devices, and methods of fabricating etched features in strengthened glass articles are disclosed. In one embodiment, a strengthened glass article includes a first strengthened surface layer and a second strengthened surface layer under a compressive stress and extending from a first surface and a second surface, respectively, of the strengthened glass article to a depth of layer, and a central region between the first strengthened surface layer and the second strengthened surface layer that is under tensile stress. The strengthened glass article further includes at least one etched feature formed by laser ablation within the first surface or the second surface having a depth that is less than the depth of layer and a surface roughness that is greater than a surface roughness of the first surface or second surface outside of the at least one etched feature.Type: GrantFiled: March 13, 2013Date of Patent: April 10, 2018Assignee: CORNING INCORPORATEDInventors: Johannes Moll, James Joseph Price, Alranzo Boh Ruffin, Sergio Tsuda, Robert Stephen Wagner, James Joseph Watkins
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Publication number: 20180068868Abstract: Articles including a glass-based substrate with holes, semiconductor packages including an article with holes, and methods of fabricating holes in a substrate are disclosed. In one embodiment, an article includes a glass-based substrate having a first surface, a second surface, and at least one hole extending from the first surface. The at least one hole has an interior wall having a surface roughness Ra that is less than or equal to 1 ?m. The at least one hole has a first opening having a first diameter that is present the first surface. A first plane is defined by the first surface of the glass-based substrate based on an average thickness of the glass-based substrate. A ratio of a depression depth to the first diameter of the at least one hole is less than or equal to 0.007.Type: ApplicationFiled: September 6, 2017Publication date: March 8, 2018Inventors: Andres Covarrubias Jaramillo, Yuhui Jin, Frank Andrew Kramer, IV, Ekaterina Aleksandrovna Kuksenkova, Daniel Wayne Levesque, JR., Garrett Andrew Piech, Aric Bruce Shorey, Robert Stephen Wagner
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Patent number: 9908805Abstract: A method of providing locally annealed regions for a glass article comprising: (a) providing a strengthened glass article having a first surface compressive stress and a first depth of layer of compressive stress; (b) targeting first portions of the glass article on a first side thereof; (c) annealing the targeted first portions to a second surface compressive stress and a second depth of layer of compressive stress; and (d) repeating steps (b) and (c) to create a pattern of annealed portions of the glass article on the first side thereof. Targeted annealing can be done e.g. by focusing a laser or using microwave energy or an induction source. A method for making a laminate structure comprising a first glass layer (12), a second glass layer (16), and at least one polymer interlayer (14) intermediate the first and second glass layers.Type: GrantFiled: August 21, 2014Date of Patent: March 6, 2018Assignee: CORNING INCORPORATEDInventors: Thomas Michael Cleary, Mark Stephen Friske, Robert Stephen Wagner
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Publication number: 20180057390Abstract: The present invention relates to a laser cutting technology for cutting and separating thin substrates of transparent materials, for example to cutting of display glass compositions mainly used for production of Thin Film Transistors (TFT) devices. The described laser process can be used to make straight cuts, for example at a speed of >0.25 m/sec, to cut sharp radii outer corners (<1 mm), and to create arbitrary curved shapes including forming interior holes and slots. A method of laser processing an alkaline earth boro-aluminosilicate glass composite workpiece includes focusing a pulsed laser beam into a focal line. The pulsed laser produces pulse bursts with 5-20 pulses per pulse burst and pulse burst energy of 300-600 micro Joules per burst. The focal line is directed into the glass composite workpiece, generating induced absorption within the material.Type: ApplicationFiled: March 23, 2016Publication date: March 1, 2018Inventors: Thomas Hackert, Xinghua Li, Sasha Marjanovic, Moussa N'Gom, David Andrew Pastel, Garrett Andrew Piech, Daniel Schnitzler, Robert Stephen Wagner, James Joseph Watkins
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Publication number: 20180044219Abstract: Processes of chamfering and/or beveling an edge of a glass or other substrate of arbitrary shape using lasers are described herein. Three general methods to produce chamfers on glass substrates are disclosed. The first method involves cutting the edge with the desired chamfer shape utilizing an ultra-short pulse laser. Treatment with the ultra-short laser may be optionally followed by a CO2 laser for fully automated separation. The second method is based on thermal stress peeling of a sharp edge corner, and it has been demonstrated to work with different combination of an ultrashort pulse and/or CO2 lasers. A third method relies on stresses induced by ion exchange to effect separation of material along a fault line produced by an ultra-short laser to form a chamfered edge of desired shape.Type: ApplicationFiled: July 26, 2017Publication date: February 15, 2018Inventors: Sasha Marjanovic, Albert Roth Nieber, Garrett Andrew Piech, Helmut Schillinger, Sergio Tsuda, Robert Stephen Wagner
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Publication number: 20180029920Abstract: Methods are provided for laser processing arbitrary shapes of molded 3D thin transparent brittle parts from substrates with particular interest in substrates formed from strengthened or non-strengthened Corning Gorilla® glass (all codes). The developed laser methods can be tailored for manual separation of the parts from the panel or full laser separation by thermal stressing the desired profile. Methods can be used to form 3D surfaces with small radii of curvature. The method involves the utilization of an ultra-short pulse laser that may be optionally followed by a CO2 laser for fully automated separation.Type: ApplicationFiled: July 28, 2017Publication date: February 1, 2018Inventors: Sasha Marjanovic, Albert Roth Nieber, Garrett Andrew Piech, Sergio Tsuda, Robert Stephen Wagner
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Patent number: 9850160Abstract: The present invention relates to a laser cutting technology for cutting and separating thin substrates of transparent materials, for example to cutting of display glass compositions mainly used for production of Thin Film Transistors (TFT) devices. The described laser process can be used to make straight cuts, for example at a speed of >1 m/sec, to cut sharp radii outer corners (<1 mm), and to create arbitrary curved shapes including forming interior holes and slots. A method of laser processing an alkaline earth boro-aluminosilicate glass composite workpiece includes focusing a pulsed laser beam into a focal line. The focal line is directed into the glass composite workpiece, generating induced absorption within the material. The workpiece and the laser beam are translated relative to each other to form a plurality of defect lines along a contour, with adjacent defect lines have a spacing of 0.1-20 microns.Type: GrantFiled: October 31, 2014Date of Patent: December 26, 2017Assignee: Corning IncorporatedInventors: Sasha Marjanovic, Albert Roth Nieber, Garrett Andrew Piech, Helmut Schillinger, Sergio Tsuda, Robert Stephen Wagner
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Publication number: 20170355633Abstract: An apparatus includes a fiber feeding system to deposit a fiber on an edge of the glass article and a laser system. The laser system is positioned to project a first and a second laser beam onto a first and a second side of the fiber, respectively. The laser system is positioned to project a third laser beam onto the edge of the glass article. A method includes advancing a glass article relative to a fiber; positioning the fiber in relation to an edge of the glass article, contacting a first side of the fiber with a first laser beam, contacting a second side of the fiber with a second laser beam, depositing the fiber on the edge of the glass article, and contacting the edge of the glass article with a third laser beam.Type: ApplicationFiled: October 29, 2015Publication date: December 14, 2017Inventors: Thomas Roger Cook, Christopher William Drewnowski, Peter Knowles, Geunsik Lim, Moussa N'Gom, Irene Mona Peterson, Robert Stephen Wagner
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Patent number: 9815730Abstract: Methods are provided for laser processing arbitrary shapes of molded 3D thin transparent brittle parts from substrates with particular interest in substrates formed from strengthened or non-strengthened Corning Gorilla® glass (all codes). The developed laser methods can be tailored for manual separation of the parts from the panel or full laser separation by thermal stressing the desired profile. Methods can be used to form 3D surfaces with small radii of curvature. The method involves the utilization of an ultra-short pulse laser that may be optionally followed by a CO2 laser for fully automated separation.Type: GrantFiled: October 31, 2014Date of Patent: November 14, 2017Assignee: CORNING INCORPORATEDInventors: Sasha Marjanovic, Albert Roth Nieber, Garrett Andrew Piech, Sergio Tsuda, Robert Stephen Wagner