Abstract: Methods of forming semiconductor packages include providing a lead frame having leads and no tie-bars. Tape is attached to the lead frame and one or more semiconductor die are coupled therewith. Electrical contacts of the die are interconnected with the leads using electrical connectors. An encapsulated assembly is formed by at least partially encapsulating the die and electrical connectors. The assembly is singulated to form a semiconductor package. The tape is detached from the package or encapsulated assembly. One or more die attach flags may be attached to the tape and the die may be attached thereto. Semiconductor packages formed using the methods include one or more semiconductor die at least partially encapsulated, pins exposed through the encapsulant, electrical connectors within the encapsulant and electrically interconnecting the pins with electrical contacts of the die, and no tie-bars coupling the die with the pins. Packages may also include die attach flags.

Abstract: The present invention relates, in one aspect, to a vector comprising (a) a first polynucleotide capable of encoding a first (poly)peptide comprising at least one cysteine residue, and (b) a second polynucleotide capable of encoding a second (poly)peptide which is a cell surface anchor comprising at least one cysteine residue, wherein the vector is operable in a eukaryotic host cell to express and to cause or allow the attachment of said first (poly)peptide to said second (poly)peptide by formation of a disulfide bond between said cysteine residues comprised within said first (polypeptide and said second (poly)peptide, respectively, wherein said first (poly)peptide is exhibited at the surface of a eukaryotic host cell.

Abstract: A connector for securing a memory card within an electronics device such as a PDA, digital camera, cell phone, or downloadable Internet music player. The connector includes a housing and a receptacle formed in the housing for receiving at least partially the memory card therein. Further included in the housing is an ejector mechanism for ejecting the memory card at least partially from the receptacle, which comprises an actuator rod that is preferably integrally formed with the housing and a lever arm that is also preferably integrally formed with the housing.