Patents by Inventor Sterling Chaffins
Sterling Chaffins has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11911825Abstract: In an example, a method is described that includes building a first layer of a three-dimensional heterogeneous object in a first plurality of passes of an additive manufacturing system. An electronic component is inserted directly into the first layer. The electronic component is then fused to the first layer in a second plurality of passes of the additive manufacturing system.Type: GrantFiled: March 13, 2018Date of Patent: February 27, 2024Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Kristopher J. Erickson, David George, Sterling Chaffins, Lihua Zhao
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Publication number: 20230398732Abstract: The present disclosure describes materials, methods, and systems for three-dimensional printing. In one example, a three-dimensional printing kit can include a fusing agent and a microbe-inhibiting agent. The fusing agent can include water and an electromagnetic radiation absorber. The electromagnetic radiation absorber can absorb radiation and convert the radiation energy to heat. The microbe-inhibiting agent can include a liquid vehicle and a metal bis(dithiolene) complex. The disclosure also describes methods of three-dimensional printing that utilize a metal-containing microbe-inhibiting material, which can be a metal bis(dithiolene) complex or other materials.Type: ApplicationFiled: October 30, 2020Publication date: December 14, 2023Inventors: JARRID ALEXANDER WITTKOPF, KRISTOPHER J ERICKSON, EMRE HIRO DISCEKICI, STERLING CHAFFINS, KEVIN P DeKAM, RAGHUVIR N SENGUPTA, ALBERT LIU, ELIZABETH GALATI
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Publication number: 20230373157Abstract: In an example method for forming three-dimensional (3D) printed electronic parts, a build material is applied. An electronic agent is selectively applied in a plurality of passes on a portion of the build material. A fusing agent is also selectively applied on the portion of the build material. The build material is exposed to radiation in a plurality of heating events. During at least one of the plurality of heating events, the portion of the build material in contact with the fusing agent fuses to form a region of a layer. The region of the layer exhibits an electronic property. An order of the plurality of passes, the selective application of the fusing agent, and the plurality of heating events is controlled to control a mechanical property of the layer and the electronic property of the region.Type: ApplicationFiled: July 31, 2023Publication date: November 23, 2023Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Yan ZHAO, Kristopher J. ERICKSON, Aja HARTMAN, Lihua ZHAO, Sterling CHAFFINS, Kevin P. DEKAM
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Publication number: 20230347586Abstract: The present disclosure is drawn to 3D printing kits, multi-fluid kits for 3D printing, and methods of making 3D printed articles. In one example, a 3D printing kit can include a powder bed material, a fusible fluid, and a magnetic fluid. The powder bed material can include polymer particles. The fusible fluid can include water and a radiation absorber. The fusible fluid can be to selectively apply to the powder bed material. The magnetic fluid can include magnetic particles, and the magnetic fluid can be to selectively apply to the powder bed material.Type: ApplicationFiled: July 7, 2023Publication date: November 2, 2023Inventors: Kevin P. DeKam, Sterling Chaffins, Cassady Sparks Roop
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Patent number: 11795338Abstract: An example of a build material composition for three-dimensional (3D) printing includes a polymeric or polymeric composite build material and a wetting modifying agent. The wetting modifying agent is: (i) incorporated into the polymeric component of the polymeric or polymeric composite build material and changes the wetting behavior of the polymeric component; or (ii) selected from the group consisting of: a fluorotelomer; a C8-C20 alcohol; a methyltrialkyl ammonium chloride; docusate sodium salt; a polymer having a chemical structure of the polymeric component of the polymeric or polymeric composite build material modified to include a hydrophobic group or a hydrophilic group; and a combination thereof.Type: GrantFiled: January 26, 2018Date of Patent: October 24, 2023Assignee: Hewlett-Packard Development Company, L.P.Inventors: Sterling Chaffins, Anthony P. Holden, Katrina Donovan, Garry Hinch
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Publication number: 20230303884Abstract: A method for forming parts with electrically conductive features includes applying a layer of thermoplastic polymer powder particles in a powder bed and selectively applying an aqueous pretreat composition including a metal chloride salt on a portion of the layer. A conductive fusing ink including transition metal particles and a dispersing agent is selectively applied onto the applied aqueous pretreat composition on the portion of the layer, wherein the dispersing agent binds to, and passivates surfaces of the transition metal particles. The layer is exposed to electromagnetic radiation to fuse the thermoplastic polymer powder particles in the portion of the layer and sinter the transition metal particles, thereby forming a conductive feature.Type: ApplicationFiled: June 1, 2023Publication date: September 28, 2023Inventors: Sterling Chaffins, Kevin P. DeKam, Michael G. Monroe
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Patent number: 11760010Abstract: In an example method for forming three-dimensional (3D) printed electronic parts, a build material is applied. An electronic agent is selectively applied in a plurality of passes on a portion of the build material. A fusing agent is also selectively applied on the portion of the build material. The build material is exposed to radiation in a plurality of heating events. During at least one of the plurality of heating events, the portion of the build material in contact with the fusing agent fuses to form a region of a layer. The region of the layer exhibits an electronic property. An order of the plurality of passes, the selective application of the fusing agent, and the plurality of heating events is controlled to control a mechanical property of the layer and the electronic property of the region.Type: GrantFiled: December 23, 2021Date of Patent: September 19, 2023Assignee: Hewlett-Packard Development Company, L.P.Inventors: Yan Zhao, Kristopher J. Erickson, Aja Hartman, Lihua Zhao, Sterling Chaffins, Kevin P. DeKam
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Patent number: 11738508Abstract: In an example, a composition for three-dimensional (3D) printing includes a polymer build material and a non-conductive fusing agent dispensable onto the polymer build material to form a polymer-fusing agent composite portion when heated to a sintering temperature, a conductive agent dispensable onto on the polymer build material to form a polymer-conductive agent composite portion when heated at least to the sintering temperature, the conductive agent comprising: at least one conductive particulate present in an amount of from about 10% to about 60% of a total weight of the conductive agent; at least one co-solvent present in an amount of from about 10% to about 50% of a total weight of the conductive agent; and an additive present in an amount of from about 0% to about 10% of a total weight of the conductive agent.Type: GrantFiled: November 17, 2017Date of Patent: August 29, 2023Assignee: Hewlett-Packard Development Company, L.P.Inventors: Sterling Chaffins, Kevin P DeKam, Kristopher J Erickson, Cory J Ruud, Jami Ryan Barone, Ruhua Cai, Anthony J Galvan
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Patent number: 11733020Abstract: A first object for assembly with a second object, the first object comprising: a body having a first mating portion; and a first electronic element fabricated on the body; wherein the first electronic element is provided to establish an electrical coupling with a second electronic element fabricated on one of: the body and the second object, wherein a second mating portion is provided on the second object, and wherein the electrical coupling is configured to provide a measurable output for positioning the first mating portion at a desired position relative to the second mating portion according to an analysis of the measurable output against a predetermined reference output.Type: GrantFiled: November 2, 2020Date of Patent: August 22, 2023Assignees: NANYANG TECHNOLOGICAL UNIVERSITYInventors: William J. Allen, Quang Cuong Pham, Dinh Huy Nguyen, Sterling Chaffins
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Patent number: 11712845Abstract: The present disclosure is drawn to 3D printing kits, multi-fluid kits for 3D printing, and methods of making 3D printed articles. In one example, a 3D printing kit can include a powder bed material, a fusible fluid, and a magnetic fluid. The powder bed material can include polymer particles. The fusible fluid can include water and a radiation absorber. The fusible fluid can be to selectively apply to the powder bed material. The magnetic fluid can include magnetic particles, and the magnetic fluid can be to selectively apply to the powder bed material.Type: GrantFiled: October 16, 2018Date of Patent: August 1, 2023Assignee: Hewlett-Packard Development Company, L.P.Inventors: Kevin P. DeKam, Sterling Chaffins, Cassady Sparks Roop
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Patent number: 11642842Abstract: In an example of a method for three-dimensional (3D) printing, a build material composition is applied to form a build material layer. The build material composition includes a polymeric or polymeric composite build material, and a precipitating agent. Based on a 3D object model, a fusing agent is selectively applied on at least a portion of the build material composition. The fusing agent includes a radiation absorber, which the precipitating agent precipitates. The build material composition is exposed to radiation to fuse the at least the portion to form a layer of a 3D part.Type: GrantFiled: January 26, 2018Date of Patent: May 9, 2023Assignee: Hewlett-Packard Development Company, L.P.Inventors: Sterling Chaffins, Anthony P. Holden, Katrina Donovan, Noemie Midrez, Garry Hinch
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Publication number: 20220402205Abstract: A 3-dimensional printed part can include a part body including a first matrix of fusing agent and thermoplastic polymer powder, a security feature including a second matrix of fusing agent, thermoplastic polymer powder, and photoluminescent agent, and a masking feature including a third matrix of fusing agent and thermoplastic polymer powder. The security feature can be positioned beneath and visible through the masking feature upon photoluminescent emission of the security feature.Type: ApplicationFiled: August 19, 2022Publication date: December 22, 2022Inventors: Garry Hinch, Kevin P. DeKam, Sterling Chaffins, James William Stasiak
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Publication number: 20220388239Abstract: The present disclosure is drawn to 3-dimensional printed parts that can include a conductive composite portion and an insulating portion. The conductive composite portion can include a matrix of fused thermoplastic polymer particles interlocked with a matrix of sintered elemental transition metal particles. The insulating portion can include a matrix of fused thermoplastic polymer particles that are continuous with the matrix of fused thermoplastic polymer particles in the conductive composite portion. The insulating portion can be substantially free of sintered elemental transition metal particles and can include transition metal oxide bronze particles.Type: ApplicationFiled: August 19, 2022Publication date: December 8, 2022Applicant: Hewlett-Packard Development Company, L.P.Inventors: Sterling CHAFFINS, Cassady Sparks ROOP, Kevin P. DEKAM, Vladek KASPERCHIK, Ali EMAMJOMEH, Johnathon HOLROYD, Stephen G. RUDISILL, Alexey S. KABALNOV
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Patent number: 11465341Abstract: A 3-dimensional printed part can include a part body including a first matrix of fusing agent and thermoplastic polymer powder, a security feature including a second matrix of fusing agent, thermoplastic polymer powder, and photoluminescent agent, and a masking feature including a third matrix of fusing agent and thermoplastic polymer powder. The security feature can be positioned beneath and visible through the masking feature upon photoluminescent emission of the security feature.Type: GrantFiled: April 28, 2016Date of Patent: October 11, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Garry Hinch, Kevin P. DeKam, Sterling Chaffins, James William Stasiak
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Patent number: 11458675Abstract: The present disclosure is drawn to material sets for 3-dimensional printing. The material set can include a thermoplastic polymer powder having an average particle size from 20 ?m to 200 ?m, a conductive fusing agent composition including a transition metal, and nonconductive fusing agent composition. The nonconductive fusing agent composition can include transition metal oxide bronze particles.Type: GrantFiled: October 25, 2016Date of Patent: October 4, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Sterling Chaffins, Cassady Sparks Roop, Kevin P DeKam, Vladek Kasperchik, Ali Emamjomeh, Johnathon Holroyd, Stephen G Rudisill, Alexey S Kabalnov
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Patent number: 11426932Abstract: In an example of a method for reducing oxidation of a build material during three-dimensional printing, a portion of a layer of a polymeric build material is patterned by selectively applying a fusing agent on the portion. A detailing agent selectively applied on a non-patterned portion of the layer. The detailing agent includes a stabilizer to reduce oxidation of the polymeric build material. The layer is exposed to electromagnetic radiation to fuse the portion to form a 3D object layer. The stabilizer at least minimizes discoloration of the non-patterned portion.Type: GrantFiled: May 15, 2018Date of Patent: August 30, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Sterling Chaffins, Anthony P. Holden
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Patent number: 11427725Abstract: The present disclosure is drawn to material sets for 3-dimensional printing, 3-dimensional printing systems, and 3-dimensional printed parts. A material set can include a thermoplastic polymer powder having an average particle size from 20 ?m to 100 ?m, a photoluminescent ink including a photoluminescent agent, and a fusing ink. The fusing ink can include a fusing agent capable of absorbing electromagnetic radiation to produce heat.Type: GrantFiled: April 28, 2016Date of Patent: August 30, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: James William Stasiak, Garry Hinch, Sterling Chaffins, Kevin P. DeKam
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Patent number: 11312877Abstract: The present disclosure is drawn to fluid sets, material sets, and 3-dimensional printing systems. A fluid set can include a pretreat composition that includes a salt of an alkali metal with bromide or iodide. The fluid set can also include a conductive fusing agent composition including a transition metal for fusing thermoplastic powder when exposed to electromagnetic radiation.Type: GrantFiled: October 25, 2016Date of Patent: April 26, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Sterling Chaffins, Kevin P. Dekam
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Publication number: 20220118694Abstract: In an example method for forming three-dimensional (3D) printed electronic parts, a build material is applied. An electronic agent is selectively applied in a plurality of passes on a portion of the build material. A fusing agent is also selectively applied on the portion of the build material. The build material is exposed to radiation in a plurality of heating events. During at least one of the plurality of heating events, the portion of the build material in contact with the fusing agent fuses to form a region of a layer. The region of the layer exhibits an electronic property. An order of the plurality of passes, the selective application of the fusing agent, and the plurality of heating events is controlled to control a mechanical property of the layer and the electronic property of the region.Type: ApplicationFiled: December 23, 2021Publication date: April 21, 2022Inventors: Yan Zhao, Kristopher J. Erickson, Aja Hartman, Lihua Zhao, Sterling Chaffins, Kevin P. DeKam
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Patent number: 11304313Abstract: According to examples, a method of making a three-dimensional conductive printed part, including forming a layer of polymeric build material; selectively applying a fusing agent on a first selected area of the formed polymeric build material; selectively applying a conductive agent on a second selected area of the formed polymeric build material; and applying a solder receiving material to a portion of the first selected area and a portion of the second selected area; in which the solder receiving material is present on a surface of the conductive three-dimensional printed part is disclosed.Type: GrantFiled: December 15, 2017Date of Patent: April 12, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Sterling Chaffins, Kevin P. Dekam, Thomas A. Saksa, Juan Sebastian Ramirez