Patents by Inventor Steve ABOAGYE
Steve ABOAGYE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230225090Abstract: An optical communication system includes a co-packaged optical module and a heatsink mounted to the co-packaged optical module. The co-packaged optical module includes a processor disposed on a substrate and a plurality of light engines disposed at different locations around the processor on the substrate. The processor and the light engines generating different amounts of heat during operation. The heatsink includes a plurality of heat pipes non-uniformly distributed throughout the heatsink to remove the different amounts of heat generated at a location of the processor and respective locations of the different ones of the light engines.Type: ApplicationFiled: March 16, 2023Publication date: July 13, 2023Inventors: Radhakrishnan L. NAGARAJAN, Liang Ding, Mark Patterson, Roberto Coccioli, Steve Aboagye
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Patent number: 11677478Abstract: A co-packaged optical module includes a substrate, a processor arranged on the substrate and a plurality of light engines mounted around the processor on the substrate using mounting assemblies configured to attach the respective light engines to the substrate. The light engines and the mounting assemblies are disposed along a perimeter of the substrate, including at corners of the substrate. Each of the mounting assemblies includes a socket, a metal clamp clamping a corresponding one of the light engines into the socket, and a plurality of pins which when mated with corresponding holes in the substrate cause peripheries of the mounting assemblies, including the light engines, the sockets and the metal clamps, to be flush with the perimeter of the substrate.Type: GrantFiled: August 10, 2021Date of Patent: June 13, 2023Assignee: MARVELL ASIA PTE LTDInventors: Radhakrishnan L. Nagarajan, Liang Ding, Mark Patterson, Roberto Coccioli, Steve Aboagye
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Patent number: 11612079Abstract: An optical communication system includes a co-packaged optical module and a heatsink mounted to the co-packaged optical module. The co-packaged optical module includes a processor disposed on a substrate and a plurality of light engines disposed at different locations around the processor on the substrate. The processor and the light engines generating different amounts of heat during operation. The heatsink includes a plurality of heat pipes non-uniformly distributed throughout the heatsink to remove the different amounts of heat generated at a location of the processor and respective locations of the different ones of the light engines.Type: GrantFiled: August 10, 2021Date of Patent: March 21, 2023Assignee: MARVELL ASIA PTE LTD.Inventors: Radhakrishnan L. Nagarajan, Liang Ding, Mark Patterson, Roberto Coccioli, Steve Aboagye
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Publication number: 20210385975Abstract: An optical communication system includes a co-packaged optical module and a heatsink mounted to the co-packaged optical module. The co-packaged optical module includes a processor disposed on a substrate and a plurality of light engines disposed at different locations around the processor on the substrate. The processor and the light engines generating different amounts of heat during operation. The heatsink includes a plurality of heat pipes non-uniformly distributed throughout the heatsink to remove the different amounts of heat generated at a location of the processor and respective locations of the different ones of the light engines.Type: ApplicationFiled: August 10, 2021Publication date: December 9, 2021Inventors: Radhakrishnan L. NAGARAJAN, Liang DING, Mark PATTERSON, Roberto COCCIOLI, Steve ABOAGYE
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Publication number: 20210385560Abstract: A co-packaged optical-electrical module includes a module substrate with a minimum lateral dimension no greater than 100 mm. The co-packaged optical-electrical module further includes a main die with a processor chip disposed at a central region of the module substrate, the processor chip being configured to operate with a digital-signal processing (DSP) interface for extra-short-reach data interconnect. Additionally, the co-packaged optical-electrical module includes a plurality of chiplet dies disposed densely along a peripheral region of the module substrate. Each chiplet die is configured to be self-packaged light engine on a sub-module substrate with a minimum lateral dimension to allow a maximum number of chiplet dies on the module substrate with a distance of any chiplet die from the main die smaller than 50 mm for extra-short-reach interconnect operation.Type: ApplicationFiled: June 5, 2020Publication date: December 9, 2021Inventors: Radhakrishnan L. NAGARAJAN, Liang DING, Mark PATTERSON, Roberto COCCIOLI, Steve ABOAGYE
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Publication number: 20210384989Abstract: A co-packaged optical module includes a substrate, a processor arranged on the substrate and a plurality of light engines mounted around the processor on the substrate using mounting assemblies configured to attach the respective light engines to the substrate. The light engines and the mounting assemblies are disposed along a perimeter of the substrate, including at corners of the substrate. Each of the mounting assemblies includes a socket, a metal clamp clamping a corresponding one of the light engines into the socket, and a plurality of pins which when mated with corresponding holes in the substrate cause peripheries of the mounting assemblies, including the light engines, the sockets and the metal clamps, to be flush with the perimeter of the substrate.Type: ApplicationFiled: August 10, 2021Publication date: December 9, 2021Inventors: Radhakrashnan L. NAGARAJAN, Liang DING, Mark PATTERSON, Roberto COCCIOLI, Steve ABOAGYE
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Patent number: 11178473Abstract: A co-packaged optical-electrical module includes a module substrate with a minimum lateral dimension no greater than 100 mm. The co-packaged optical-electrical module further includes a main die with a processor chip disposed at a central region of the module substrate, the processor chip being configured to operate with a digital-signal processing (DSP) interface for extra-short-reach data interconnect. Additionally, the co-packaged optical-electrical module includes a plurality of chiplet dies disposed densely along a peripheral region of the module substrate. Each chiplet die is configured to be self-packaged light engine on a sub-module substrate with a minimum lateral dimension to allow a maximum number of chiplet dies on the module substrate with a distance of any chiplet die from the main die smaller than 50 mm for extra-short-reach interconnect operation.Type: GrantFiled: June 5, 2020Date of Patent: November 16, 2021Assignee: MARVELL ASIA PTE, LTD.Inventors: Radhakrishnan L. Nagarajan, Liang Ding, Mark Patterson, Roberto Coccioli, Steve Aboagye
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Patent number: 11165509Abstract: A method for co-packaging multiple light engines in a switch module is provided. The method includes providing a module substrate with a minimum lateral dimension no greater than 110 mm. The module substrate is configured with a first mounting site at a center region and a plurality of second mounting sites distributed densely along the peripheral sides. The method includes disposing a main die with a switch processor chip at the first mounting site. The switch processor chip is configured to operate with a digital-signal processing (DSP) interface for extra-short-reach data interconnect. The method further includes mounting a plurality of chiplet dies respectively into the plurality of second mounting sites. Each chiplet die is configured to be a packaged light engine with a minimum lateral dimension to allow a maximum number of chiplet dies with <50 mm from the main die for extra-short-reach data interconnect.Type: GrantFiled: June 5, 2020Date of Patent: November 2, 2021Assignee: MARVELL ASIA PTE, LTD.Inventors: Radhakrishnan L. Nagarajan, Liang Ding, Mark Patterson, Roberto Coccioli, Steve Aboagye
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Patent number: 11109515Abstract: An integrated heatsink for a co-packaged optical-electrical module includes a base plate attached on top of a co-packaged optical-electrical module. The integrated heatsink further includes a plurality of fin structures extended upward from the base plate except a central cavity region with missing sections of fins, each fin extended along an axial direction from a front edge to a back edge of the base plate except some trenches shallow in depth across some fin structures and some other trenches deep in depth down to the base plate either along or across some fin structures. Additionally, the integrated heatsink includes multiple heat pipes including shaped portions embedded in the trenches in the plurality of fin structures. At least one bottom horizontal portion per heat pipe is brazed to the base plate in a corresponding region that is superimposed on hot spots of the co-packaged optical-electrical module under the base plate.Type: GrantFiled: June 5, 2020Date of Patent: August 31, 2021Assignee: INPHI CORPORATIONInventors: Radhakrishnan L. Nagarajan, Liang Ding, Mark Patterson, Roberto Coccioli, Steve Aboagye
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Patent number: 10119192Abstract: Embodiments described herein relate to a base ring assembly for use in a substrate processing chamber. In one embodiment, the base ring assembly comprises a ring body sized to be received within an inner circumference of the substrate processing chamber, the ring body comprising a loading port for passage of the substrate, a gas inlet, and a gas outlet, wherein the gas inlet and the gas outlet are disposed at opposing ends of the ring body, and an upper ring configured to dispose on a top surface of the ring body, and a lower ring configured to dispose on a bottom surface of the ring body, wherein the upper ring, the lower ring, and the ring body, once assembled, are generally concentric or coaxial.Type: GrantFiled: April 22, 2016Date of Patent: November 6, 2018Assignee: APPLIED MATERIALS, INC.Inventors: Steve Aboagye, Paul Brillhart, Surajit Kumar, Anzhong Chang, Satheesh Kuppurao, Mehmet Tugrul Samir, David K. Carlson
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Publication number: 20180005856Abstract: Embodiments of the invention relate to a dome assembly. The dome assembly includes an upper dome comprising a central window, and an upper peripheral flange engaging the central window at a circumference of the central window, wherein a tangent line on an inside surface of the central window that passes through an intersection of the central window and the upper peripheral flange is at an angle of about 8° to about 16° with respect to a planar upper surface of the peripheral flange, a lower dome comprising a lower peripheral flange and a bottom connecting the lower peripheral flange with a central opening, wherein a tangent line on an outside surface of the bottom that passes through an intersection of the bottom and the lower peripheral flange is at an angle of about 8° to about 16° with respect to a planar bottom surface of the lower peripheral flange.Type: ApplicationFiled: September 18, 2017Publication date: January 4, 2018Inventors: Anzhong CHANG, Paul BRILLHART, Surajit KUMAR, Satheesh KUPPURAO, Mehmet Tugrul SAMIR, David K. CARLSON, Steve ABOAGYE, Anh N. NGUYEN, Kailash Kiran PATALAY, Joseph M. RANISH, Oleg V. SEREBRYANOV, Dongming IU, Shu-Kwan LAU, Zuoming ZHU, Herman DINIZ
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Patent number: 9768043Abstract: Embodiments of the present disclosure relate to a dome assembly. The dome assembly includes an upper dome including a central window, and an upper peripheral flange engaging the central window at a circumference of the central window, wherein a tangent line on an inside surface of the central window that passes through an intersection of the central window and the upper peripheral flange is at an angle of about 8° to about 16° with respect to a planar upper surface of the peripheral flange, a lower dome comprising a lower peripheral flange and a bottom connecting the lower peripheral flange with a central opening, wherein a tangent line on an outside surface of the bottom that passes through an intersection of the bottom and the lower peripheral flange is at an angle of about 8° to about 16° with respect to a planar bottom surface of the lower peripheral flange.Type: GrantFiled: December 18, 2013Date of Patent: September 19, 2017Assignee: APPLIED MATERIALS, INC.Inventors: Anzhong Chang, Paul Brillhart, Surajit Kumar, Satheesh Kuppurao, Mehmet Tugrul Samir, David K. Carlson, Steve Aboagye, Anh N. Nguyen, Kailash Kiran Patalay, Joseph M. Ranish, Oleg Serebryanov, Dongming Iu, Shu-Kwan Lau, Zuoming Zhu, Herman Diniz
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Publication number: 20160230276Abstract: Embodiments described herein relate to a base ring assembly for use in a substrate processing chamber. In one embodiment, the base ring assembly comprises a ring body sized to be received within an inner circumference of the substrate processing chamber, the ring body comprising a loading port for passage of the substrate, a gas inlet, and a gas outlet, wherein the gas inlet and the gas outlet are disposed at opposing ends of the ring body, and an upper ring configured to dispose on a top surface of the ring body, and a lower ring configured to dispose on a bottom surface of the ring body, wherein the upper ring, the lower ring, and the ring body, once assembled, are generally concentric or coaxial.Type: ApplicationFiled: April 22, 2016Publication date: August 11, 2016Inventors: Steve ABOAGYE, Paul BRILLHART, Surajit KUMAR, Anzhong CHANG, Satheesh KUPPURAO, Mehmet Tugrul SAMIR, David K. CARLSON
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Patent number: 9322097Abstract: Embodiments described herein relate to a base ring assembly for use in a substrate processing chamber. In one embodiment, the base ring assembly comprises a ring body sized to be received within an inner circumference of the substrate processing chamber, the ring body comprising a loading port for passage of the substrate, a gas inlet, and a gas outlet, wherein the gas inlet and the gas outlet are disposed at opposing ends of the ring body, and an upper ring configured to dispose on a top surface of the ring body, and a lower ring configured to dispose on a bottom surface of the ring body, wherein the upper ring, the lower ring, and the ring body, once assembled, are generally concentric or coaxial.Type: GrantFiled: March 18, 2013Date of Patent: April 26, 2016Assignee: APPLIED MATERIALS, INC.Inventors: Steve Aboagye, Paul Brillhart, Surajit Kumar, Anzhong Chang, Satheesh Kuppurao, Mehmet Tugrul Samir, David K. Carlson
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Publication number: 20140261185Abstract: Embodiments described herein relate to a base ring assembly for use in a substrate processing chamber. In one embodiment, the base ring assembly comprises a ring body sized to be received within an inner circumference of the substrate processing chamber, the ring body comprising a loading port for passage of the substrate, a gas inlet, and a gas outlet, wherein the gas inlet and the gas outlet are disposed at opposing ends of the ring body, and an upper ring configured to dispose on a top surface of the ring body, and a lower ring configured to dispose on a bottom surface of the ring body, wherein the upper ring, the lower ring, and the ring body, once assembled, are generally concentric or coaxial.Type: ApplicationFiled: March 18, 2013Publication date: September 18, 2014Applicant: Applied Materials, Inc.Inventors: STEVE ABOAGYE, Paul Brillhart, Surajit Kumar, Anzhong Chang, Satheesh Kuppurao, Mehmet Tugrul Samir, David K. Carlson
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Publication number: 20140199056Abstract: Embodiments of the invention relate to a dome assembly. The dome assembly includes an upper dome comprising a central window, and an upper peripheral flange engaging the central window at a circumference of the central window, wherein a tangent line on an inside surface of the central window that passes through an intersection of the central window and the upper peripheral flange is at an angle of about 8° to about 16° with respect to a planar upper surface of the peripheral flange, a lower dome comprising a lower peripheral flange and a bottom connecting the lower peripheral flange with a central opening, wherein a tangent line on an outside surface of the bottom that passes through an intersection of the bottom and the lower peripheral flange is at an angle of about 8° to about 16° with respect to a planar bottom surface of the lower peripheral flange.Type: ApplicationFiled: December 18, 2013Publication date: July 17, 2014Inventors: Anzhong CHANG, Paul BRILLHART, Surajit KUMAR, Satheesh KUPPURAO, Mehmet Tugrul SAMIR, David K. CARLSON, Steve ABOAGYE, Anh N. NGUYEN, Kailash Kiran PATALAY, Joseph M. RANISH, Oleg SEREBRYANOV, Dongming IU, Shu-Kwan LAU, Zuoming ZHU, Herman DINIZ