Patents by Inventor Steve Bergerson

Steve Bergerson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040161571
    Abstract: A thermal interface material (A) transfers heat from a heat source (12), such as a microprocessor, to a heat sink (14) for maintaining the microprocessor at a safe operating temperature. The interface material includes thermally conductive filler particles dispersed in a phase change material. The phase change material softens and flows at the operating temperature of the heat source, thereby providing good thermal contact with uneven surfaces of the heat source and heat sink, without excessive exudation and loss of the interface material. The phase change material includes a polymer component, such as an elastomer, and a melting point component, which adjusts the softening temperature of the phase change material to the operating temperature of the heat source.
    Type: Application
    Filed: January 21, 2004
    Publication date: August 19, 2004
    Applicant: Saint-Gobain Performance Plastics
    Inventors: James H. Duvall, Steve Bergerson, Charles Balian, Arthur H. Rogove
  • Patent number: 6764759
    Abstract: A thermal interface material (A) transfers heat from a heat source (12), such as a microprocessor, to a heat sink (14) for maintaining the microprocessor at a safe operating temperature. The interface material includes thermally conductive filler particles dispersed in a phase change material. The phase change material softens and flows at the operating temperature of the heat source, thereby providing good thermal contact with uneven surfaces of the heat source and heat sink, without excessive exudation and loss of the interface material. The phase change material includes a polymer component, such as an elastomer, and a melting point component, which adjusts the softening temperature of the phase change material to the operating temperature of the heat source.
    Type: Grant
    Filed: April 16, 2002
    Date of Patent: July 20, 2004
    Assignee: Saint-Gobain Performance Plastics Corporation
    Inventors: James H. Duvall, Steve Bergerson, Charles Balian, Arthur H. Rogove
  • Publication number: 20030039825
    Abstract: A thermal interface material (A) transfers heat from a heat source (12), such as a microprocessor, to a heat sink (14) for maintaining the microprocessor at a safe operating temperature. The interface material includes thermally conductive filler particles dispersed in a phase change material. The phase change material softens and flows at the operating temperature of the heat source, thereby providing good thermal contact with uneven surfaces of the heat source and heat sink, without excessive exudation and loss of the interface material. The phase change material includes a polymer component, such as an elastomer, and a melting point component, which adjusts the softening temperature of the phase change material to the operating temperature of the heat source.
    Type: Application
    Filed: April 16, 2002
    Publication date: February 27, 2003
    Inventors: James H. Duvall, Steve Bergerson, Charles Balian, Arthur H. Rogove
  • Patent number: 6391442
    Abstract: A thermal interface material (A) transfers heat from a heat source (12), such as a microprocessor, to a heat sink (14) for maintaining the microprocessor at a safe operating temperature. The interface material includes thermally conductive filler particles dispersed in a phase change material. The phase change material softens and flows at the operating temperature of the heat source, thereby providing good thermal contact with uneven surfaces of the heat source and heat sink, without excessive exudation and loss of the interface material. The phase change material includes a polymer component, such as an elastomer, and a melting point component, which adjusts the softening temperature of the phase change material to the operating temperature of the heat source.
    Type: Grant
    Filed: January 13, 2000
    Date of Patent: May 21, 2002
    Assignee: Saint-Gobain Performance Plastics Corporation
    Inventors: James H. Duvall, Steve Bergerson, Charles Balian, Arthur H. Rogove