Patents by Inventor Steve C. Avanzino

Steve C. Avanzino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Utilization of annealing enhanced or repaired seed layer to improve copper interconnect reliability
    Patent number: 6506668
    Abstract: A method of forming interconnects on a semiconductor chip is disclosed which comprises the steps of: depositing a barrier layer and a copper seed layer on the semiconductor chip; depositing on the copper seed layer an enhancement layer; annealing the semiconductor chip a first time after the copper seed layer and the enhancement layer are deposited to form an annealed layer; electroplating a copper layer on the semiconductor chip; and annealing the semiconductor chip a second time after the copper layer is deposited on the annealed layer to form an annealed copper conductive layer.
    Type: Grant
    Filed: June 22, 2001
    Date of Patent: January 14, 2003
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Christy Mei-Chu Woo, Connie Pin-Chin Wang, Steve C. Avanzino