Patents by Inventor Steve Canale
Steve Canale has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9865491Abstract: Disclosed are systems, devices and methodologies for handling wafers in wafer processing operations through use of wafer carriers. In an example situation, a wafer carrier can be configured as a plate to allow bonding of a wafer thereto to provide support for the wafer during some processing operations. Upon completion of such operations, the processed wafer can be separated from the support plate so as to allow further processing. Various devices and methodologies related to such wafer carriers for efficient handling of wafers are disclosed.Type: GrantFiled: January 9, 2017Date of Patent: January 9, 2018Assignee: Skyworks Solutions, Inc.Inventors: Elena Becerra Woodard, Daniel Kwadwo Amponsah Berkoh, David James Zapp, Steve Canale, Hyong Yong Lee, Daniel Eduardo Sanchez, Hung V. Phan
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Patent number: 9833980Abstract: Disclosed are various features associated with a securing mechanism for a wafer bonder. In certain situations, operation of securing mechanisms can generate undesirable particles and debris, and some them can be introduced to a wafer being bonded. In certain implementations, a securing mechanism can be configured to reduce the likelihood of such particles and debris being introduced to the wafer.Type: GrantFiled: July 29, 2016Date of Patent: December 5, 2017Assignee: Skyworks Solutions, Inc.Inventors: Steve Canale, David J. Zapp
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Patent number: 9799507Abstract: Disclosed are devices and methodologies for cleaning wafers in wafer processing operations such as solvent cleaning. In an example situation, a wafer that has been separated from a support plate can be cleaned. The wafer still needs to be handled carefully during such a cleaning operation. Various devices and methodologies that facilitate efficient handling of wafers and solvent cleaning operations are disclosed.Type: GrantFiled: October 17, 2014Date of Patent: October 24, 2017Assignee: Skyworks Solutions, Inc.Inventors: Steve Canale, David James Zapp
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Publication number: 20170125275Abstract: Disclosed are systems, devices and methodologies for handling wafers in wafer processing operations through use of wafer carriers. In an example situation, a wafer carrier can be configured as a plate to allow bonding of a wafer thereto to provide support for the wafer during some processing operations. Upon completion of such operations, the processed wafer can be separated from the support plate so as to allow further processing. Various devices and methodologies related to such wafer carriers for efficient handling of wafers are disclosed.Type: ApplicationFiled: January 9, 2017Publication date: May 4, 2017Inventors: Elena Becerra Woodard, Daniel Kwadwo Amponsah Berkoh, David James Zapp, Steve Canale, Hyong Yong Lee, Daniel Eduardo Sanchez, Hung V. Phan
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Patent number: 9576838Abstract: Disclosed are systems, devices and methodologies for handling wafers in wafer processing operations through use of wafer carriers. In an example situation, a wafer carrier can be configured as a plate to allow bonding of a wafer thereto to provide support for the wafer during some processing operations. Upon completion of such operations, the processed wafer can be separated from the support plate so as to allow further processing. Various devices and methodologies related to such wafer carriers for efficient handling of wafers are disclosed.Type: GrantFiled: September 16, 2015Date of Patent: February 21, 2017Assignee: Skyworks Solutions, Inc.Inventors: Elena Becerra Woodard, Daniel Kwadwo Amponsah Berkoh, David James Zapp, Steve Canale, Hyong Yong Lee, Daniel E. Sanchez, Hung V. Phan
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Publication number: 20170028697Abstract: Disclosed are various features associated with a securing mechanism for a wafer bonder. In certain situations, operation of securing mechanisms can generate undesirable particles and debris, and some them can be introduced to a wafer being bonded. In certain implementations, a securing mechanism can be configured to reduce the likelihood of such particles and debris being introduced to the wafer.Type: ApplicationFiled: July 29, 2016Publication date: February 2, 2017Inventors: Steve Canale, David J. Zapp
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Patent number: 9539801Abstract: A first surface of a debonder defines a recess that holds an assembly that includes a wafer bonded to a carrier plate having a first diameter that is larger than a second diameter of the wafer. The plate includes a peripheral area not covered by the wafer, and when the wafer of the assembly is placed within the recess, a portion of the peripheral area of the plate engages a portion of the first surface. A second surface of the debonder is disposed in the recess and is separated from the first surface. The second surface includes suction openings that deliver suction to the recess. A third surface of the debonder substantially connects the first and the second surfaces and includes an opening dimensioned to limit a pressure differential between the recess and outside the recess during application of the suction.Type: GrantFiled: February 19, 2016Date of Patent: January 10, 2017Assignee: Skyworks Solutions, Inc.Inventors: Steve Canale, David J. Zapp, Daniel Eduardo Sanchez, Hung V. Phan, Hyong Yong Lee
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Patent number: 9533484Abstract: A first surface of a debonder defines a recess to hold an assembly that includes a wafer bonded to a carrier plate having a first diameter that is larger than a second diameter of the wafer. The carrier plate includes a peripheral area not covered by the wafer, and when the wafer of the assembly is placed within the recess, a portion of the peripheral area of the carrier plate engages a portion of the first surface. A second surface of the debonder is disposed in the recess and is separated from the first surface, where the second surface includes suction openings that deliver a suction force to the recess, and a portion of the second surface is in contact with a heat source.Type: GrantFiled: February 19, 2016Date of Patent: January 3, 2017Assignee: Skyworks Solutions, Inc.Inventors: Steve Canale, David J. Zapp, Daniel Eduardo Sanchez, Hung V. Phan, Hyong Yong Lee
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Patent number: 9412630Abstract: Disclosed are various features associated with a securing mechanism for a wafer bonder. In certain situations, operation of securing mechanisms can generate undesirable particles and debris, and some them can be introduced to a wafer being bonded. In certain implementations, a securing mechanism can be configured to reduce the likelihood of such particles and debris being introduced to the wafer.Type: GrantFiled: December 27, 2013Date of Patent: August 9, 2016Assignee: Skyworks Solutions, Inc.Inventors: Steve Canale, David J. Zapp
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Publication number: 20160167360Abstract: A first surface of a debonder defines a recess that holds an assembly that includes a wafer bonded to a carrier plate having a first diameter that is larger than a second diameter of the wafer. The plate includes a peripheral area not covered by the wafer, and when the wafer of the assembly is placed within the recess, a portion of the peripheral area of the plate engages a portion of the first surface. A second surface of the debonder is disposed in the recess and is separated from the first surface. The second surface includes suction openings that deliver suction to the recess. A third surface of the debonder substantially connects the first and the second surfaces and includes an opening dimensioned to limit a pressure differential between the recess and outside the recess during application of the suction.Type: ApplicationFiled: February 19, 2016Publication date: June 16, 2016Inventors: Steve Canale, David J. Zapp, Daniel Eduardo Sanchez, Hung V. Phan, Hyong Yong Lee
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Publication number: 20160167359Abstract: A first surface of a debonder defines a recess to hold an assembly that includes a wafer bonded to a carrier plate having a first diameter that is larger than a second diameter of the wafer. The carrier plate includes a peripheral area not covered by the wafer, and when the wafer of the assembly is placed within the recess, a portion of the peripheral area of the carrier plate engages a portion of the first surface. A second surface of the debonder is disposed in the recess and is separated from the first surface, where the second surface includes suction openings that deliver a suction force to the recess, and a portion of the second surface is in contact with a heat source.Type: ApplicationFiled: February 19, 2016Publication date: June 16, 2016Inventors: Steve Canale, David J. Zapp, Daniel Eduardo Sanchez, Hung V. Phan, Hyong Yong Lee
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Patent number: 9296194Abstract: Disclosed are systems, devices and methodologies for debonding wafers from carrier plates. In certain wafer processing operations, it is desirable to temporarily mount a wafer on a carrier plate for support and ease of handling. Such a mounting can be achieved by bonding the wafer and the carrier plate with an adhesive. Once such operations are completed, the wafer needs to be debonded from the carrier plate. Such a debonding process can be achieved by applying a suction force to the wafer-carrier plate assembly. Various debonding systems, devices and methodologies, and related features, are disclosed.Type: GrantFiled: May 27, 2014Date of Patent: March 29, 2016Assignee: Skyworks Solutions, Inc.Inventors: Steve Canale, David J. Zapp, Daniel Eduardo Sanchez, Hung V. Phan, Hyong Yong Lee
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Publication number: 20160005637Abstract: Disclosed are systems, devices and methodologies for handling wafers in wafer processing operations through use of wafer carriers. In an example situation, a wafer carrier can be configured as a plate to allow bonding of a wafer thereto to provide support for the wafer during some processing operations. Upon completion of such operations, the processed wafer can be separated from the support plate so as to allow further processing. Various devices and methodologies related to such wafer carriers for efficient handling of wafers are disclosed.Type: ApplicationFiled: September 16, 2015Publication date: January 7, 2016Inventors: Elena Becerra Woodard, Daniel Kwadwo Amponsah Berkoh, David James Zapp, Steve Canale
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Publication number: 20150034131Abstract: Disclosed are devices and methodologies for cleaning wafers in wafer processing operations such as solvent cleaning. In an example situation, a wafer that has been separated from a support plate can be cleaned. The wafer still needs to be handled carefully during such a cleaning operation. Various devices and methodologies that facilitate efficient handling of wafers and solvent cleaning operations are disclosed.Type: ApplicationFiled: October 17, 2014Publication date: February 5, 2015Inventors: Steve Canale, David J. Zapp
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Patent number: 8888085Abstract: Disclosed are systems, devices and methodologies for handling wafers in wafer processing operations such as solvent and plasma cleaning. In an example situation, a wafer that has been separated from a support plate can be cleaned. The wafer still needs to be handled carefully during such a cleaning operation. Various devices and methodologies that facilitate efficient handling of wafers and wafer-cleaning operations are disclosed.Type: GrantFiled: October 5, 2010Date of Patent: November 18, 2014Assignee: Skyworks Solutions, Inc.Inventors: Steve Canale, David J. Zapp
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Publication number: 20140262053Abstract: Disclosed are systems, devices and methodologies for debonding wafers from carrier plates. In certain wafer processing operations, it is desirable to temporarily mount a wafer on a carrier plate for support and ease of handling. Such a mounting can be achieved by bonding the wafer and the carrier plate with an adhesive. Once such operations are completed, the wafer needs to be debonded from the carrier plate. Such a debonding process can be achieved by applying a suction force to the wafer-carrier plate assembly. Various debonding systems, devices and methodologies, and related features, are disclosed.Type: ApplicationFiled: May 27, 2014Publication date: September 18, 2014Applicant: Skyworks Solutions, Inc.Inventors: Steve Canale, David J. Zapp, Daniel Eduardo Sanchez, Hung V. Phan, Hyong Yong Lee
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Publication number: 20140182762Abstract: Disclosed are various features associated with a securing mechanism for a wafer bonder. In certain situations, operation of securing mechanisms can generate undesirable particles and debris, and some them can be introduced to a wafer being bonded. In certain implementations, a securing mechanism can be configured to reduce the likelihood of such particles and debris being introduced to the wafer.Type: ApplicationFiled: December 27, 2013Publication date: July 3, 2014Applicant: Skyworks Solutions, Inc.Inventors: Steve Canale, David J. Zapp
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Patent number: 8758553Abstract: Disclosed are systems, devices and methodologies for separating wafers from carrier plates. In certain wafer processing operations, it is desirable to temporarily mount a wafer on a carrier plate for support and ease of handling. Such a mounting can be achieved by bonding the wafer and the carrier plate with an adhesive. Once such operations are completed, the wafer needs to be separated or unbonded from the carrier plate. Such a separation process can be achieved by applying a mechanical shear force to the wafer-carrier plate assembly. Various devices and methodologies, and related features, are disclosed.Type: GrantFiled: October 5, 2010Date of Patent: June 24, 2014Assignee: Skyworks Solutions, Inc.Inventors: Jens A. Riege, Steve Canale, David J. Zapp
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Patent number: 8758552Abstract: Disclosed are systems, devices and methodologies for debonding wafers from carrier plates. In certain wafer processing operations, it is desirable to temporarily mount a wafer on a carrier plate for support and ease of handling. Such a mounting can be achieved by bonding the wafer and the carrier plate with an adhesive. Once such operations are completed, the wafer needs to be debonded from the carrier plate. Such a debonding process can be achieved by applying a suction force to the wafer-carrier plate assembly. Various debonding systems, devices and methodologies, and related features, are disclosed.Type: GrantFiled: October 5, 2010Date of Patent: June 24, 2014Assignee: Skyworks Solutions, Inc.Inventors: Steve Canale, David J. Zapp, Daniel E. Sanchez, Hung V. Phan, Hyong Y. Lee
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Patent number: 8640755Abstract: Disclosed are various features associated with a securing mechanism for a wafer bonder. In certain situations, operation of securing mechanisms can generate undesirable particles and debris, and some them can be introduced to a wafer being bonded. In certain implementations, a securing mechanism can be configured to reduce the likelihood of such particles and debris being introduced to the wafer.Type: GrantFiled: October 5, 2010Date of Patent: February 4, 2014Assignee: Skyworks Solutions, Inc.Inventors: Steve Canale, David J. Zapp